JPH02166746A - Measuring apparatus - Google Patents

Measuring apparatus

Info

Publication number
JPH02166746A
JPH02166746A JP32294588A JP32294588A JPH02166746A JP H02166746 A JPH02166746 A JP H02166746A JP 32294588 A JP32294588 A JP 32294588A JP 32294588 A JP32294588 A JP 32294588A JP H02166746 A JPH02166746 A JP H02166746A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
electrodes
surfaces
mounting
voltage
surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32294588A
Inventor
Yutaka Akaike
Takuo Uchida
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To decrease variations of electric resistance in measurement and to improve measuring accuracy by forming voltage applying electrodes and voltage measuring electrodes on the surfaces which are obtained by dividing a mounting surface into 2N (N is an integer of 2 or more) surfaces, and forming N pieces of these electrodes alternately on the mounting surfaces.
CONSTITUTION: Voltage applying electrodes 2 and applied voltage measuring electrodes 3 comprising, e.g., gold and the like, are formed on a main body 1 of a mounting-table made in a disk shape. The voltage applying electrodes 2 and the voltage measuring electrodes 3 are formed on the surfaces which are obtained by dividing the surface of the mounting-table main body 1 into quadrants. Two electrodes are alternately formed on the surfaces of the mounting-table main body 1. Specified voltages are applied to connector electrodes on the rear surface of a semiconductor wafer from the voltage applying electrodes 2. The applied voltages are measured with the voltage measuring electrodes 3. Since the number of the divisions is more than conventional two divisions, the area of one electrode surface is small. There is a room for selecting the different kind of electrode in the shortest distance. Loss in electric resistance is made less, and the measuring accuracy is improved.
COPYRIGHT: (C)1990,JPO&Japio
JP32294588A 1988-12-21 1988-12-21 Measuring apparatus Pending JPH02166746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32294588A JPH02166746A (en) 1988-12-21 1988-12-21 Measuring apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32294588A JPH02166746A (en) 1988-12-21 1988-12-21 Measuring apparatus

Publications (1)

Publication Number Publication Date
JPH02166746A true true JPH02166746A (en) 1990-06-27

Family

ID=18149391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32294588A Pending JPH02166746A (en) 1988-12-21 1988-12-21 Measuring apparatus

Country Status (1)

Country Link
JP (1) JPH02166746A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653298A (en) * 1990-01-24 1994-02-25 Internatl Business Mach Corp <Ibm> Dry interface thermal shuck temp. control system for testing semiconductor wafer
US7262613B2 (en) 2003-06-09 2007-08-28 Tokyo Electron Limited Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object
CN103091514A (en) * 2011-10-27 2013-05-08 无锡华润上华科技有限公司 Manual operated probe station structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892232A (en) * 1981-11-27 1983-06-01 Nec Home Electronics Ltd Wafer inspection device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892232A (en) * 1981-11-27 1983-06-01 Nec Home Electronics Ltd Wafer inspection device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653298A (en) * 1990-01-24 1994-02-25 Internatl Business Mach Corp <Ibm> Dry interface thermal shuck temp. control system for testing semiconductor wafer
US7262613B2 (en) 2003-06-09 2007-08-28 Tokyo Electron Limited Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object
US7688088B2 (en) 2003-06-09 2010-03-30 Tokyo Electron Limited Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object
CN103091514A (en) * 2011-10-27 2013-05-08 无锡华润上华科技有限公司 Manual operated probe station structure

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