JPH02159790A - Manufacture of circuit board - Google Patents

Abstract

PURPOSE:To obtain a circuit board through a consistent conveyer system composed of a first process a third process by a method wherein a circuit board is formed on a belt conveyer-like transfer ribbon. CONSTITUTION:A first process A serves as a process in which an electrode 3 and a conductor layer 4 are formed on the face of a transfer ribbon 6. And, a second process 3 is such that a terminal 5 is fixed to the electrode 3 and the upside of the transfer ribbon 6 is molded with hot-melt resin. Then, a third process C is a process that a circuit board 1 molded in the first process A is separated from the transfer ribbon 6. As mentioned above, the belt conveyer- like transfer ribbon 6 is employed and the circuit board 1 is formed on the transfer ribbon 6, whereby a first process - a third process can be set into a consistent conveyer operation.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to an improvement in a method for manufacturing a circuit board, particularly when the manufacturing process is simple and a smooth conductor layer is formed on the surface of the board. The present invention relates to a method for manufacturing a circuit board suitable for.

[Prior Art] Conventionally, this type of technology has been disclosed in Japanese Patent Publication No. 5539093.

In this conventional technique, an insulator is formed on a mirror plate coated with a mold release agent, an electrode is formed on the insulator, an adhesive is further applied on the electrode, and the adhesive is applied through the adhesive. After attaching the mirror plate on which the insulator and electrode are arranged to another board, the mirror plate is peeled off from the insulator and the electrode, so that the electrode on which the contact slides contacts and the insulator are on the same plane. The invention relates to a method of forming a switch circuit board disposed thereon.

[Problems to be Solved by the Invention] However, the above-mentioned conventional technology requires a step of applying a mold release agent to the mirror plate in order to peel the mirror plate from the insulator and the electrode, and also requires a step of applying a release agent to the mirror plate, and also prevents mold release sticking. A similar material was required. Furthermore, prior to the step of peeling off the mirror plate, a step of adhering the insulator and electrode to the substrate was required, and an adhesive was also required.

In addition, in order to electrically connect the circuit board to an external circuit, it is necessary to fix the terminal, but if it gets stuck on the electrode surface side, it will be a factor that obstructs the movement of the brush that slides on the electrode surface. If the fixed part of the terminal is exposed, stress is likely to be applied to the fixed part when connecting the terminal to an external circuit (which may lead to a disconnection accident. When attempting to fix the terminal on the back side of the electrode to avoid sticking, the insulator and the substrate to which the electrode is bonded become obstacles, making it difficult to fix the terminal on the back side.

Means for Solving Problem L] This invention was invented in view of the above problem, and it is an object of the present invention to form a circuit board through a simple manufacturing process and to prevent the fixed portion of the terminal from being exposed from the circuit board. The purpose is to manufacture circuit boards.

In order to achieve the above object, the present invention employs the configuration means numbered Y below. That is, the first step is to form an electrode and a conductive layer on the surface of a belt conveyor-shaped transfer ribbon that flows continuously from the discharge to the end of the process, and the first step is to fix a terminal to the electrode and to form the conductive layer of the transfer ribbon. and a second step of molding the side having the terminal with heated molten resin, and a third step of peeling the circuit board molded in the second step from the transfer ribbon. provide a method.

[Function] According to the manufacturing method according to the present invention described above, a belt conveyor-like transfer ribbon is adopted, and a circuit board is formed on the transfer ribbon, thereby setting each of the above-described steps into a consistent assembly line. can do.

[Embodiment] Figures 1 to 4 are drawings showing preferred embodiments of the present invention, with Figure 1 showing each manufacturing process, and Figures 2 to 4 showing each manufacturing process. 2 shows a partially assembled state of the circuit board.

In this embodiment, the circuit board 1 is applied to a resistance board of a variable resistor.

As shown in FIG. 4, the circuit board 1 has a shape in which a conductor layer 4 consisting of an electrode 3 and a thick film resistor is formed without any step on the surface 2J of a resin molded product 2, and a terminal 5 is formed protruding from a side surface 22. has been completed.

In FIG. 4, reference numeral 6 denotes a transfer ribbon, and as shown in FIG. 1, the transfer ribbon 6 has a belt conveyor shape that continuously flows from a first step to a third step, which will be described later. As the transfer ribbon 6, for example, an aluminum foil wound into a roll having a thickness of about 0.1 mm is used. As the material of the transfer ribbon 6, metal ribbons such as stainless steel and copper, resin ribbons such as polyimide resin and Teflon resin, etc. may be used alone or in combination. The transfer ribbon 6 only needs to have heat resistance and smoothness to withstand the molding temperature in the second step described below.

Furthermore, the transfer ribbon 6 has a feed hole 61 and a positioning hole 6.
2 are bored at a predetermined pitch. The pitch of the feed holes 61 is set smaller than the pitch of the positioning holes 62.

The feed hole 61 and the positioning hole 62 are used to determine the printing position and printing timing of the electrode 3 and conductor layer 4 in the first step (^), which will be described later, and the resin molding in the second step (B). It is used to determine the timing of molding the object 2, etc.

Next, each manufacturing process will be explained in sequence.

Figure 1 is a diagram showing the entire first process A to third process C.

The first step A is the part indicated by the symbol A, and consists of the step of forming the electrode 3 and the conductor layer 4 on the surface of the transfer ribbon 6, as shown in FIG.

Specifically, the first step Δ includes: printing the electrode 3 on the transfer ribbon 6 using the first printing machine 7; and printing the electrode 3 on the transfer ribbon 6 using the first baking machine 8.
The process consists of a stage of firing the electrode 3 using a printer, a stage of printing the conductor layer 4 using the second printing machine 9, and a stage of firing the conductor layer 4 using the second firing machine 10.

The conductor layer 4 is made of a material in which conductive particles are mixed into a resin having the same coefficient of thermal expansion as the resin molded product 2 which is molded in the second step B, and has a variable resistance. It has an appropriate specific resistance that can be used as the resistance of the device.

Next, the second step B is the part indicated by the symbol B in FIG. 1, and as referred to in FIG.
The second side of the transfer ribbon 6 is molded with heated molten resin.

To be more specific, the second step B includes the step of soldering and soldering the terminal 5 to the electrode 3 formed in the first step A (not shown), and the step of resin molding using the molding machine 11. and a step of molding the object 2.

Next, in the third step C, which is the part indicated by symbol C in FIG. 1, as shown in FIG. It consists of a peeling process.

To be more specific, the third step C includes cooling the circuit board 1 and the transfer ribbon 6, which were completed by molding the resin molding 2 in the second process B, using a cooler 12, and cooling the transfer ribbon 6. The circuit board 1 is peeled from the transfer ribbon 6 by being wound into a roll at the terminal end 6a.

Of course, the circuit board 1 may be separated from the transfer ribbon 6 with the aid of a jig or tool.

The circuit board 1 formed through the above steps is used as a component of a variable resistor. In the circuit board 1, a sliding brush (not shown) slides on the surface of the conductor layer 4, so that a resistance value corresponding to the sliding position is obtained at the terminal 5.

Note that this invention is not limited to the above-mentioned embodiments, and for example,
Both ends of the transfer ribbon 6 may be connected to form an endless configuration.

In this case, since the transfer ribbon 6 is used repeatedly, a material that can be easily recycled by washing or the like is used.

In addition, in the third process C, the cooler 12 is equipped with Daiflon (
It is also possible to replace it with a liquid tank containing a liquid such as (trade name) liquid.

Thereby, cooling and cleaning can be performed at the same time.

[Effects of the Invention] As described above, the present invention makes it possible to manufacture a circuit board in a consistent assembly line through the first to third steps by forming the circuit board on a belt conveyor-like transfer ribbon. Therefore, it is possible to form a circuit board through a simple manufacturing process, and it has the excellent effect of contributing to the manufacture of inexpensive circuit boards.

FIG. 2 is a perspective view immediately after the first step is completed.

FIG. 3 is a perspective view immediately after the second step is completed.

FIG. 4 is a perspective view immediately after the third step is completed.

1... Circuit board, 2... Resin molded product, 3...
... Electrode, 4 ... Conductor layer, 5 ... Terminal, 6 ... Transfer ribbon, 61 ... Feeding hole, 62 ... Positioning hole.

that's all

[Brief explanation of the drawing]

FIG. 1 is a process diagram showing the entire first to fourth steps of a preferred embodiment of the present invention.

Claims (1)

[Claims] A first step (A) of forming an electrode (3) and a conductor layer (4) on the surface of a transfer ribbon (6) shaped like a belt conveyor that flows continuously from the beginning to the end of the process; While fixing the terminal (5), the transfer ribbon (
6) a second step (B) of molding the side having the conductor layer (4) and the terminal (5) with heated melt resin; and the circuit board (1) molded in the second step (B) is A method for manufacturing a circuit board, comprising a third step (C) of peeling off the transfer ribbon (6).