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JPH02155296A - High heat radiating structure for heat generator - Google Patents

High heat radiating structure for heat generator

Info

Publication number
JPH02155296A
JPH02155296A JP31077888A JP31077888A JPH02155296A JP H02155296 A JPH02155296 A JP H02155296A JP 31077888 A JP31077888 A JP 31077888A JP 31077888 A JP31077888 A JP 31077888A JP H02155296 A JPH02155296 A JP H02155296A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
heat
radiating
end
pipe
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31077888A
Inventor
Michimasa Ohara
Mitsutake Sato
Yoshinori Usui
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To improve heat radiating efficiency and to further enhance its cooling effect by providing a heat radiating wall outside a shelf, and thermally coupling the heat radiating wall with a heat generation circuit unit by the use of a heat pipe.
CONSTITUTION: Heat radiating walls 1e each having a heat radiating fin 13-1 are disposed on the back of a backboard 1a-4 and at both sides of a shelf 1a, a bracket 1f is clamped with screws at inside having no heat radiating fin 1e-1, and the heat radiating end 1c-2 of a heat pipe 1c is inserted fixedly to the insertion hole 1f-1 of a bracket 1f. A power source board 1b is inserted and guided by the guide rails 1a-5 of the shelf 1a, its plug connector 1b-2 is electrically connected to the socket connector 1a-6 of the backboard 1a-4, and the heat absorption end 1c-1 of the heat pipe 1 is engaged with and inserted into the insertion hole 1d-3 of a heat coupling 1d. In the heat sink, heat generated at the power source board 1b-1 is absorbed by the heat absorption end 1c-1 of the heat pipe 1c through the heat coupling 1d, thermally conducted from the heat sink end 1c-2 directly to the heat radiating wall 1e to radiate the heat from the heat radiating fin.
COPYRIGHT: (C)1990,JPO&Japio
JP31077888A 1988-12-07 1988-12-07 High heat radiating structure for heat generator Pending JPH02155296A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31077888A JPH02155296A (en) 1988-12-07 1988-12-07 High heat radiating structure for heat generator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31077888A JPH02155296A (en) 1988-12-07 1988-12-07 High heat radiating structure for heat generator

Publications (1)

Publication Number Publication Date
JPH02155296A true true JPH02155296A (en) 1990-06-14

Family

ID=18009359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31077888A Pending JPH02155296A (en) 1988-12-07 1988-12-07 High heat radiating structure for heat generator

Country Status (1)

Country Link
JP (1) JPH02155296A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0541823A1 (en) * 1991-06-05 1993-05-19 Fujitsu Limited Heat pipe connector, electronic device and heat radiating fan having said pipe
JPH05327247A (en) * 1992-05-20 1993-12-10 Fujitsu Ltd Heat radiating structure for printed-board unit
US5398748A (en) * 1991-06-05 1995-03-21 Fujitsu Limited Heat pipe connector and electronic apparatus and radiating fins having such connector
US5946191A (en) * 1997-03-27 1999-08-31 Nec Corporation Electronic device having a plug-in unit with a heat sink structure
US6247944B1 (en) * 1998-06-15 2001-06-19 Compaq Computer Corporation Slide-activated, spring-loaded ejector for hot-pluggable disk drive carrier
US7460367B2 (en) * 2007-03-05 2008-12-02 Tracewell Systems, Inc. Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
JP2010245315A (en) * 2009-04-07 2010-10-28 Kobe Steel Ltd Substrate unit

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0541823A1 (en) * 1991-06-05 1993-05-19 Fujitsu Limited Heat pipe connector, electronic device and heat radiating fan having said pipe
US5398748A (en) * 1991-06-05 1995-03-21 Fujitsu Limited Heat pipe connector and electronic apparatus and radiating fins having such connector
JPH05327247A (en) * 1992-05-20 1993-12-10 Fujitsu Ltd Heat radiating structure for printed-board unit
US5946191A (en) * 1997-03-27 1999-08-31 Nec Corporation Electronic device having a plug-in unit with a heat sink structure
US6247944B1 (en) * 1998-06-15 2001-06-19 Compaq Computer Corporation Slide-activated, spring-loaded ejector for hot-pluggable disk drive carrier
US6302714B1 (en) 1998-06-15 2001-10-16 Compaq Computer Corporation Slide-activated, spring-loaded ejector for hot-pluggable disk drive carrier
US7460367B2 (en) * 2007-03-05 2008-12-02 Tracewell Systems, Inc. Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
JP2010245315A (en) * 2009-04-07 2010-10-28 Kobe Steel Ltd Substrate unit

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