JPH02153868A - Method for brazing ceramic plate and metallic plate - Google Patents
Method for brazing ceramic plate and metallic plateInfo
- Publication number
- JPH02153868A JPH02153868A JP30824688A JP30824688A JPH02153868A JP H02153868 A JPH02153868 A JP H02153868A JP 30824688 A JP30824688 A JP 30824688A JP 30824688 A JP30824688 A JP 30824688A JP H02153868 A JPH02153868 A JP H02153868A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic plate
- plate
- shielding material
- brazing
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 63
- 238000005219 brazing Methods 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 11
- 239000000463 material Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- 239000011162 core material Substances 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 3
- 229910002113 barium titanate Inorganic materials 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000005611 electricity Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- XBYNNYGGLWJASC-UHFFFAOYSA-N barium titanium Chemical compound [Ti].[Ba] XBYNNYGGLWJASC-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000007651 thermal printing Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、セラミック板と金属板のろう付け方法に係り
、特に、正の温度係数を有する半導体たるＰＴＣ素子の
製造に好適なセラミック板と金属板のろう付け方法に関
する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a method of brazing a ceramic plate and a metal plate, and in particular to a method of brazing a ceramic plate and a metal plate suitable for manufacturing a PTC element, which is a semiconductor having a positive temperature coefficient. Related to a method for brazing metal plates.
（従来の技術）
従来から、例えばチタン駿バリウム
（Ｂａ Ｔｉ ０３ ）を主成分とし、これに微陽の希
土類元素を加えて構成される半導体セラミックが、いわ
ゆるＰＴＣ索子として発熱体、吸熱体あるいは抵抗体に
応用されている。(Prior Art) Semiconductor ceramics composed of, for example, titanium-barium (Ba Ti 03 ) as a main component and a rare earth element of Weiyang have been used as a so-called PTC cord to be used as a heating element, heat absorber or Applied to resistors.
このうちＰＴＣ素子を使用したヒータとして第２図に示
すものがあり、このものは、平板状のセラミック板１の
両面に、アルミニウムのような熱伝導性のよい金属を波
形に成型してなるフィン２゜２を接着し、さらに、各フ
ィン２の表面にそれぞれ電極板３を接着して構成されて
いる。Among these, there is a heater using a PTC element as shown in Fig. 2, which is made of fins formed by molding a metal with good thermal conductivity, such as aluminum, into a corrugated shape on both sides of a flat ceramic plate 1. 2.2, and furthermore, an electrode plate 3 is adhered to the surface of each fin 2.
このようなヒータによれば、両１！極板３，３に通電す
ることにより両フィン２．２を介してセラミック板１に
も通電され、この結果、セラミック板１が発熱され、こ
のセラミック板１の熱は各フィン２に伝達されるので、
このフィン２に伝達された熱を図示しないファンなどを
使用して外部（放出することにより外部を加熱すること
ができる。According to such a heater, both 1! By energizing the electrode plates 3, 3, the ceramic plate 1 is also energized via both fins 2.2, and as a result, the ceramic plate 1 generates heat, and the heat of the ceramic plate 1 is transferred to each fin 2. So,
The outside can be heated by discharging the heat transferred to the fins 2 to the outside using a fan (not shown) or the like.
（発明が解決しようとする課題）
ところで、従来、セラミック板１とフィン２との接着は
接着剤により行なっていたが、このような接着剤による
接着は、作業性が悪く、大量生産に向かないし、また、
強力な接着剤を使用しないと長期にわたる使用によりセ
ラミック板１とフィン２とが剥離してしまうおそれがあ
った。(Problem to be Solved by the Invention) Conventionally, the ceramic plate 1 and the fins 2 have been bonded using an adhesive, but bonding using such an adhesive has poor workability and is not suitable for mass production. Also,
If a strong adhesive was not used, there was a risk that the ceramic plate 1 and the fins 2 would peel off after long-term use.
このような従来のものにおける問題点を克服するために
は、セラミック板１とフィン２との接着をろう付けによ
り行なうことが望ましいが、セラミック板１とフィン２
をろう付けするために炉内において加熱すると、セラミ
ック板１の空孔からガスが噴出するため、セラミック板
１との接触面積の小さいフィン２はろう付けの小止りが
悪くなるおそれがある。In order to overcome these problems with the conventional ones, it is desirable to bond the ceramic plate 1 and the fins 2 together by brazing.
When heated in a furnace for brazing, gas is ejected from the pores of the ceramic plate 1, so the fins 2, which have a small contact area with the ceramic plate 1, may have difficulty brazing.
本発明は、このような点に鑑み、接触面積の小さいセラ
ミック板と金属板を良好にろう付けすることができるセ
ラミック板と金属板のろう付け方法を提供することを目
的とする。In view of these points, an object of the present invention is to provide a method for brazing a ceramic plate and a metal plate, which can effectively braze a ceramic plate and a metal plate with a small contact area.
前述した目的を達成するため本発明は、セラミック板と
金属板を当接し、このセラミックと金属板をろう付けす
るセラミック板と金属板のろう付け方法において、セラ
ミック板と金属板との間にセラミック板の表面からのガ
ス放出を防止する遮蔽材を介装し、この遮蔽材とセラミ
ック板ならびに金属板をそれぞれろう付けするようにし
たことを特徴としている。In order to achieve the above-mentioned object, the present invention provides a method for brazing a ceramic plate and a metal plate in which a ceramic plate and a metal plate are brought into contact with each other and the ceramic and metal plate are brazed. It is characterized in that a shielding material is interposed to prevent gas release from the surface of the plate, and the shielding material is brazed to the ceramic plate and the metal plate, respectively.
前述した構成の本発明によれば、セラミック板と金属板
との間に遮蔽材を介装して、この遮蔽材とセラミック板
および遮蔽材と金属板を、あらかじめ部材間に介装した
ろう材によりろう付けするようにしたので、このろう付
けを行なうために、これらのセラミック板、遮蔽材およ
び金属板を炉内において加熱することによりセラミック
板の空孔からガスが噴出しようとするが、このセラミッ
ク板の空孔から噴出しようとするガスは遮蔽材により阻
止され、金属板と遮蔽材との間への到達を防止されるの
で、金属板が、波形に成型したフィンのように遮蔽材と
の接触面積が小さいものであっても遮蔽材とのろう付け
を良好に行なうことができる。一方、セラミック板と遮
蔽材とのろう付けは、セラミック板と遮蔽材の接触面積
を大きくすることにより良好に行なうことができる。According to the present invention having the above-described structure, a shielding material is interposed between the ceramic plate and the metal plate, and the shielding material and the ceramic plate, and the shielding material and the metal plate are interposed between the members in advance. To perform this brazing, the ceramic plate, shielding material, and metal plate are heated in a furnace, causing gas to blow out from the pores of the ceramic plate. The gas that tries to blow out from the pores of the ceramic plate is blocked by the shielding material and is prevented from reaching the space between the metal plate and the shielding material, so that the metal plate acts like a corrugated fin. Even if the contact area is small, brazing with the shielding material can be performed well. On the other hand, brazing between the ceramic plate and the shielding material can be performed satisfactorily by increasing the contact area between the ceramic plate and the shielding material.
以下、本発明を図面に示す実施例により説明する。 The present invention will be explained below with reference to embodiments shown in the drawings.
第１図は本発明のろう付け方法に用いられるセラミック
板１、フィン２および遮蔽材４を示すものであり、この
うちセラミック板１は、前述したように、−例としてチ
タン酸バリウムを主成分とし、これに微ｍの希土類元素
を加えて構成された平板状のものである。そして、この
セラミック板１の表面には、ヒータとして使用するため
、アルミニウム（Ａｌｌ）、亜鉛（Ｚｎ）、銀（ＡＱ）
、ニッケル（Ｎ ｉ ）などの電極をなす金属被膜５が
溶射、プリントなどにより形成されている。なお、セラ
ミック板１の表面に微細な凹凸をあらかじめ形成してお
くことにより金属被膜５の形成を容易に行なうことがで
きる。FIG. 1 shows a ceramic plate 1, a fin 2, and a shielding material 4 used in the brazing method of the present invention, of which the ceramic plate 1 is made of, for example, barium titanate as a main component, as described above. It has a flat plate shape and is made by adding a minute amount of a rare earth element to this. The surface of the ceramic plate 1 is coated with aluminum (All), zinc (Zn), and silver (AQ) for use as a heater.
, nickel (N i ), or the like, is formed by thermal spraying, printing, or the like. Note that the metal coating 5 can be easily formed by forming fine irregularities on the surface of the ceramic plate 1 in advance.
前記フィン２は、前述したようにアルミニウムのような
熱伝導性のよい金属を波形に成型して形成されている。As described above, the fins 2 are formed by molding a metal with good thermal conductivity, such as aluminum, into a corrugated shape.
前記遮蔽材４は、全体として平板状に形成されており、
−例としてアルミニウム合金からなる芯材６を有してい
る。このアルミニウム合金の材質としては、ＪＩＳ
Ａ−３００３、Ａ−６９５１などが望ましい。前記芯材
６の両面には、ろう材の被膜７．７が形成されており、
このろう材としては、アルミニウムにシリコンを１０％
程度含有した、ＪＩＳ ＢＡ−４００４などが望まし
い。The shielding material 4 is formed into a flat plate shape as a whole,
- For example, it has a core material 6 made of an aluminum alloy. The material of this aluminum alloy is JIS
A-3003, A-6951, etc. are desirable. A coating 7.7 of a brazing material is formed on both sides of the core material 6,
As this brazing material, 10% silicon is added to aluminum.
It is desirable to use JIS BA-4004, which contains a certain degree of
つぎに、前述した遮蔽材４を用いてセラミック板１とフ
ィン２を接着するろう付け方法を説明する。Next, a brazing method for bonding the ceramic plate 1 and the fins 2 using the shielding material 4 described above will be explained.
セラミック板１の両面に遮蔽材４，４を接合し、各遮蔽
材４の反対側の面にそれぞれフィン２を接合した状態に
おいて全体を図示しない治具により固定する。そして、
この全体を加熱炉内に載置し、炉内を所定の温度に上昇
する。すると、炉内の温度の上昇に伴ない、遮蔽材４の
芯材６の両面に形成されたろう材の被膜７．７が溶融さ
れ、遮蔽材４の芯材６の両面に対しセラミック板１およ
び各フィン２が密着することになる。そこで、所定時間
経過後に炉内の加熱を停止し、炉内を冷却することによ
り、溶融状態にあったろう材が冷却固化され、セラミッ
ク板１と各遮蔽材４ならびに各遮蔽材４と各フィン２が
ろう付けされることになる。Shielding materials 4, 4 are bonded to both surfaces of the ceramic plate 1, and the fins 2 are bonded to the opposite surface of each shielding material 4, respectively, and the whole is fixed by a jig (not shown). and,
The whole is placed in a heating furnace, and the temperature inside the furnace is raised to a predetermined temperature. Then, as the temperature inside the furnace increases, the brazing filler metal coating 7.7 formed on both sides of the core material 6 of the shielding material 4 is melted, and the ceramic plate 1 and Each fin 2 will come into close contact with each other. Therefore, by stopping the heating in the furnace and cooling the inside of the furnace after a predetermined period of time, the molten brazing filler metal is cooled and solidified, and the ceramic plate 1 and each shielding material 4 as well as each shielding material 4 and each fin 2 will be soldered.
ところで、セラミック板１を加熱すると、セラミック板
１の空孔からガスが噴出しようとするが、このガスはセ
ラミック板１に接合している遮蔽材４の芯材６に阻止さ
れてフィン２と遮蔽材４の接合位置には到達しないので
、接触面積の小さいフィン２と遮蔽材４のろう付けがセ
ラミック板１からのガスに阻害されることはなく、した
がって、フィン２と遮蔽材４のろう付けを良好に行なう
ことができる。一方、セラミック板１と遮蔽材４のろう
付けは、セラミック板１と遮蔽材４の接合位置にセラミ
ック板１からのガスが到達することになるが、セラミッ
ク板１と遮蔽材４の接触面積は大きいので、セラミック
板１と遮蔽材４のろう付けも良好に行なうことができる
。By the way, when the ceramic plate 1 is heated, gas tries to eject from the pores of the ceramic plate 1, but this gas is blocked by the core material 6 of the shielding material 4 bonded to the ceramic plate 1, and is blocked by the fins 2 and the shielding material. Since the joining position of the material 4 is not reached, the brazing of the fin 2 and the shielding material 4, which have a small contact area, is not hindered by the gas from the ceramic plate 1, and therefore the brazing of the fin 2 and the shielding material 4 is not hindered. can be performed well. On the other hand, when brazing the ceramic plate 1 and the shielding material 4, the gas from the ceramic plate 1 reaches the joining position of the ceramic plate 1 and the shielding material 4, but the contact area between the ceramic plate 1 and the shielding material 4 is Since it is large, the ceramic plate 1 and the shielding material 4 can be brazed well.
なお、セラミック板１の金属被膜５により被覆された表
面をサンドベーパやワイヤブラシにより荒らして表面の
活性化をはかることにより、より良好にろう付けを行な
うことができる。また、遮蔽材４の片面にのみろう材の
被膜７を形成しておき、金属被膜５を形成後のセラミッ
ク板１の表面にろう材を溶射してもよい。In addition, better brazing can be achieved by roughening the surface of the ceramic plate 1 covered with the metal coating 5 with a sand vapor or a wire brush to activate the surface. Alternatively, a coating 7 of a brazing filler metal may be formed on one side of the shielding material 4, and the brazing filler metal may be thermally sprayed onto the surface of the ceramic plate 1 after the metal coating 5 has been formed.
このように本実施例によれば、フィン２のような接触面
積の小さいものであっても良好にろう付けすることがで
きる。As described above, according to this embodiment, even something with a small contact area, such as the fin 2, can be brazed satisfactorily.
なお、本発明は、前述した実施例に限定されるものでは
なく、必要に応じて種々の変更が可能である。Note that the present invention is not limited to the embodiments described above, and various changes can be made as necessary.
以上説明したように本発明によれば、接触面積が小さい
金属板とセラミック板であっても、中間に遮蔽材を介装
しセラミック板からのガスの噴出をこの遮蔽材により阻
止することにより良好にろう付けすることができるとい
う優れた効果を奏する。As explained above, according to the present invention, even if the contact area between a metal plate and a ceramic plate is small, a shielding material is interposed between the metal plate and the ceramic plate to prevent gas from blowing out from the ceramic plate. It has the excellent effect of being able to be brazed to other parts.
第１図Figure 1
第１図は本発明に係るセラミック板と金属板のろう付け
方法の実施例を示す正面図、第２図はセラミック板を利
用したヒータの斜視図である。
１・・・セラミック板、２・・・フィン、３・・・電極
板、４・・・遮蔽材、５・・・金属被膜、６・・・芯材
、７・・・被膜。
第２図FIG. 1 is a front view showing an embodiment of the method of brazing a ceramic plate and a metal plate according to the present invention, and FIG. 2 is a perspective view of a heater using the ceramic plate. DESCRIPTION OF SYMBOLS 1... Ceramic plate, 2... Fin, 3... Electrode plate, 4... Shielding material, 5... Metal coating, 6... Core material, 7... Coating. Figure 2
Claims (1)
板をろう付けするセラミック板と金属板のろう付け方法
において、セラミック板と金属板との間にセラミック板
の表面からのガス放出を防止する遮蔽材を介装し、この
遮蔽材とセラミック板ならびに金属板をそれぞれろう付
けするようにしたことを特徴とするセラミック板と金属
板のろう付け方法。In a ceramic plate and metal plate brazing method in which a ceramic plate and a metal plate are brought into contact and the ceramic and metal plate are brazed, a shield is provided between the ceramic plate and the metal plate to prevent gas from being released from the surface of the ceramic plate. A method for brazing a ceramic plate and a metal plate, characterized in that a shielding material is interposed between the ceramic plate and the metal plate.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30824688A JPH02153868A (en) | 1988-12-06 | 1988-12-06 | Method for brazing ceramic plate and metallic plate |
| EP89120508A EP0368206B1 (en) | 1988-11-07 | 1989-11-06 | Positive-temperature-coefficient heating device and process for fabricating the same |
| DE68917259T DE68917259T2 (en) | 1988-11-07 | 1989-11-06 | Heater with positive temperature coefficient and method of manufacturing the same. |
| CA002002319A CA2002319C (en) | 1988-11-07 | 1989-11-06 | Positive-temperature-coefficient heating device and process for fabricating the same |
| US07/627,813 US5077889A (en) | 1988-11-07 | 1990-12-14 | Process for fabricating a positive-temperature-coefficient heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30824688A JPH02153868A (en) | 1988-12-06 | 1988-12-06 | Method for brazing ceramic plate and metallic plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02153868A true JPH02153868A (en) | 1990-06-13 |
Family
ID=17978698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30824688A Pending JPH02153868A (en) | 1988-11-07 | 1988-12-06 | Method for brazing ceramic plate and metallic plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02153868A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0569983A2 (en) * | 1992-05-15 | 1993-11-18 | Nippondenso Co., Ltd. | Positive-temperature-coefficient thermistor heating device and process for production of the same |
| CN102303174A (en) * | 2011-08-23 | 2012-01-04 | 甄海威 | Superposition method for welding ceramic and aluminum |
| GB2562276A (en) * | 2017-05-10 | 2018-11-14 | Dyson Technology Ltd | A heater |
| US11589661B2 (en) | 2017-01-12 | 2023-02-28 | Dyson Technology Limited | Hand held appliance |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6071579A (en) * | 1983-09-28 | 1985-04-23 | 株式会社日立製作所 | Method of bonding alumina and metal |
| JPS61227971A (en) * | 1985-04-01 | 1986-10-11 | 株式会社日立製作所 | Method of joining silicon nitride or sialon and metal |
-
1988
- 1988-12-06 JP JP30824688A patent/JPH02153868A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6071579A (en) * | 1983-09-28 | 1985-04-23 | 株式会社日立製作所 | Method of bonding alumina and metal |
| JPS61227971A (en) * | 1985-04-01 | 1986-10-11 | 株式会社日立製作所 | Method of joining silicon nitride or sialon and metal |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0569983A2 (en) * | 1992-05-15 | 1993-11-18 | Nippondenso Co., Ltd. | Positive-temperature-coefficient thermistor heating device and process for production of the same |
| EP0569983A3 (en) * | 1992-05-15 | 1994-03-30 | Nippon Denso Co | |
| CN102303174A (en) * | 2011-08-23 | 2012-01-04 | 甄海威 | Superposition method for welding ceramic and aluminum |
| US11589661B2 (en) | 2017-01-12 | 2023-02-28 | Dyson Technology Limited | Hand held appliance |
| US11712098B2 (en) | 2017-01-12 | 2023-08-01 | Dyson Technology Limited | Hand held appliance |
| GB2562276A (en) * | 2017-05-10 | 2018-11-14 | Dyson Technology Ltd | A heater |
| GB2562276B (en) * | 2017-05-10 | 2021-04-28 | Dyson Technology Ltd | A heater |
| US11168924B2 (en) | 2017-05-10 | 2021-11-09 | Dyson Technology Limited | Heater |
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