JPH02150485A - Adhesive for automobile structure - Google Patents

Adhesive for automobile structure

Info

Publication number
JPH02150485A
JPH02150485A JP30482588A JP30482588A JPH02150485A JP H02150485 A JPH02150485 A JP H02150485A JP 30482588 A JP30482588 A JP 30482588A JP 30482588 A JP30482588 A JP 30482588A JP H02150485 A JPH02150485 A JP H02150485A
Authority
JP
Japan
Prior art keywords
epoxy resin
gelatinized
conductive material
electrically conductive
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30482588A
Other languages
Japanese (ja)
Other versions
JPH0742449B2 (en
Inventor
Takahiro Nakano
Toshimori Sakakibara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sunstar Engineering Inc
Original Assignee
Sunstar Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunstar Engineering Inc filed Critical Sunstar Engineering Inc
Priority to JP63304825A priority Critical patent/JPH0742449B2/en
Publication of JPH02150485A publication Critical patent/JPH02150485A/en
Publication of JPH0742449B2 publication Critical patent/JPH0742449B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: To provide the objective adhesive composed of a specific gelatinized epoxy resin, a latent curing agent and an electrically conductive material and having sufficient shower resistance and high electrical conductivity to enable spot welding.
CONSTITUTION: The objective adhesive having a viscosity of ≥2,000 poise (at 40°C and 20 sec-1) is composed of (A) a gelatinized epoxy resin produced by dissolving (i) one or more compounds selected from polyamide wax, castor oil wax, sorbitol derivative and amino acid derivative in (ii) an epoxy resin under heating and cooling the solution, (B) a latent curing agent consisting of dicyandiamide, imidazole, isophthalic acid dihydrazide, etc., and (C) an electrically conductive material composed of carbon black, ferrite, metal (oxide) powder, etc.
COPYRIGHT: (C)1990,JPO&Japio
JP63304825A 1988-11-30 1988-11-30 Automotive structural adhesive Expired - Lifetime JPH0742449B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63304825A JPH0742449B2 (en) 1988-11-30 1988-11-30 Automotive structural adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63304825A JPH0742449B2 (en) 1988-11-30 1988-11-30 Automotive structural adhesive

Publications (2)

Publication Number Publication Date
JPH02150485A true JPH02150485A (en) 1990-06-08
JPH0742449B2 JPH0742449B2 (en) 1995-05-10

Family

ID=17937707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63304825A Expired - Lifetime JPH0742449B2 (en) 1988-11-30 1988-11-30 Automotive structural adhesive

Country Status (1)

Country Link
JP (1) JPH0742449B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352514A (en) * 1990-04-25 1994-10-04 Nitta Gelatin Inc. Metal surface adhered to a second metal surface
EP1728825A1 (en) 2005-06-02 2006-12-06 Dow Global Technologies Inc. Toughener for a structural epoxy adhesive
JP2011236322A (en) * 2010-05-10 2011-11-24 Yokohama Rubber Co Ltd:The Structural adhesive
US8461662B2 (en) 2009-06-25 2013-06-11 Samsung Electronics Co., Ltd. Carbon/epoxy resin composition, and carbon-epoxy dielectric film produced by using the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101836566B1 (en) 2015-05-15 2018-03-08 현대자동차주식회사 Conductive adhesive and bounding method of composite using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5959769A (en) * 1982-09-29 1984-04-05 Meisei Chiyaachiru Kk Structural adhesive
JPS60206882A (en) * 1984-03-30 1985-10-18 Sunstar Giken Kk Epoxy resin adhesive
JPS60235877A (en) * 1984-05-08 1985-11-22 Sunstar Giken Kk Epoxy resin adhesive for automobile
JPS63189488A (en) * 1987-01-30 1988-08-05 Yokohama Rubber Co Ltd:The Oil surface adhesive

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5959769A (en) * 1982-09-29 1984-04-05 Meisei Chiyaachiru Kk Structural adhesive
JPS60206882A (en) * 1984-03-30 1985-10-18 Sunstar Giken Kk Epoxy resin adhesive
JPS60235877A (en) * 1984-05-08 1985-11-22 Sunstar Giken Kk Epoxy resin adhesive for automobile
JPS63189488A (en) * 1987-01-30 1988-08-05 Yokohama Rubber Co Ltd:The Oil surface adhesive

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352514A (en) * 1990-04-25 1994-10-04 Nitta Gelatin Inc. Metal surface adhered to a second metal surface
EP1728825A1 (en) 2005-06-02 2006-12-06 Dow Global Technologies Inc. Toughener for a structural epoxy adhesive
US8461662B2 (en) 2009-06-25 2013-06-11 Samsung Electronics Co., Ltd. Carbon/epoxy resin composition, and carbon-epoxy dielectric film produced by using the same
JP2011236322A (en) * 2010-05-10 2011-11-24 Yokohama Rubber Co Ltd:The Structural adhesive

Also Published As

Publication number Publication date
JPH0742449B2 (en) 1995-05-10

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