JPH02150092A - Connecting structure between printed wiring boards - Google Patents

Connecting structure between printed wiring boards

Info

Publication number
JPH02150092A
JPH02150092A JP30441988A JP30441988A JPH02150092A JP H02150092 A JPH02150092 A JP H02150092A JP 30441988 A JP30441988 A JP 30441988A JP 30441988 A JP30441988 A JP 30441988A JP H02150092 A JPH02150092 A JP H02150092A
Authority
JP
Japan
Prior art keywords
lands
printed wiring
wiring board
board
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30441988A
Other languages
Japanese (ja)
Inventor
Toru Wakui
Original Assignee
Canon Components Kk
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Components Kk, Canon Inc filed Critical Canon Components Kk
Priority to JP30441988A priority Critical patent/JPH02150092A/en
Publication of JPH02150092A publication Critical patent/JPH02150092A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Abstract

PURPOSE: To connect inexpensively in high quality with simple structure and steps by adhering the land of a first printed wiring board in coincidence with that of a second printed wiring board.
CONSTITUTION: The lands 4 of a second printed wiring board 3 are so disposed as to be superposed on the lands 2 formed on a first printed wiring board 1. Then, both the boards 1, 3 are temporarily secured with adhesive, etc., and, when solder 6 is so piped as to connect the horseshoe-shaped lands 4 of the board 3 to the lands 2 through a hole 5 opened at the board 4, gas of the flux is discharged from the part not adhered to the part of the lands 4. That is, the cavity of the connecting face of the solder 6 to the lands 2 to be generated by the fact that no gas escaping position of flux occurs is eliminated. When the lands 2 are increased as compared with the hole 5, the aligning work of the connecting lands of both the boards 1, 3 can be further alleviated.
COPYRIGHT: (C)1990,JPO&Japio
JP30441988A 1988-12-01 1988-12-01 Connecting structure between printed wiring boards Pending JPH02150092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30441988A JPH02150092A (en) 1988-12-01 1988-12-01 Connecting structure between printed wiring boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30441988A JPH02150092A (en) 1988-12-01 1988-12-01 Connecting structure between printed wiring boards

Publications (1)

Publication Number Publication Date
JPH02150092A true JPH02150092A (en) 1990-06-08

Family

ID=17932773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30441988A Pending JPH02150092A (en) 1988-12-01 1988-12-01 Connecting structure between printed wiring boards

Country Status (1)

Country Link
JP (1) JPH02150092A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848492A (en) * 1981-09-16 1983-03-22 Gen Corp Flexible printed circuit board and solder connecting method
JPS5846607U (en) * 1981-09-26 1983-03-29
JPS6151772B2 (en) * 1981-06-19 1986-11-10 Nippon Kogaku Kk

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151772B2 (en) * 1981-06-19 1986-11-10 Nippon Kogaku Kk
JPS5848492A (en) * 1981-09-16 1983-03-22 Gen Corp Flexible printed circuit board and solder connecting method
JPS5846607U (en) * 1981-09-26 1983-03-29

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