JPH02146474U - - Google Patents

Info

Publication number

JPH02146474U

JPH02146474U JP5590989U JP5590989U JPH02146474U JP H02146474 U JPH02146474 U JP H02146474U JP 5590989 U JP5590989 U JP 5590989U JP 5590989 U JP5590989 U JP 5590989U JP H02146474 U JPH02146474 U JP H02146474U

Authority

JP

Japan

Prior art keywords

copper conductor

board

printed

copper

thick film

Prior art date

1989-05-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
• 229910052802 copper Inorganic materials 0.000 claims description 8
• 239000010949 copper Substances 0.000 claims description 8
• 239000004020 conductor Substances 0.000 claims description 7
• 238000010304 firing Methods 0.000 claims 1
• 239000011810 insulating material Substances 0.000 claims 1
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1