JPH02142567U - - Google Patents

Info

Publication number

JPH02142567U

JPH02142567U JP5103689U JP5103689U JPH02142567U JP H02142567 U JPH02142567 U JP H02142567U JP 5103689 U JP5103689 U JP 5103689U JP 5103689 U JP5103689 U JP 5103689U JP H02142567 U JPH02142567 U JP H02142567U

Authority

JP

Japan

Prior art keywords

electrical component

lead wire

component mounting

mounting land

wiring board

Prior art date

1989-04-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
• 239000011888 foil Substances 0.000 claims description 4
• 229910000679 solder Inorganic materials 0.000 claims description 3
• 238000005452 bending Methods 0.000 claims 1
• 239000000758 substrate Substances 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 239000011889 copper foil Substances 0.000 description 2