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Publication date
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Priority to JP5130789UpriorityCriticalpatent/JPH02140847U/ja
Publication of JPH02140847UpublicationCriticalpatent/JPH02140847U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/78—Apparatus for connecting with wire connectors
H01L2224/7825—Means for applying energy, e.g. heating means
H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
H01L2224/78313—Wedge
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/78—Apparatus for connecting with wire connectors
H01L2224/7825—Means for applying energy, e.g. heating means
H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
H01L2224/78313—Wedge
H01L2224/78314—Shape
H01L2224/78317—Shape of other portions
H01L2224/78318—Shape of other portions inside the capillary