JPH02140838U - - Google Patents

Info

Publication number
JPH02140838U
JPH02140838U JP4828289U JP4828289U JPH02140838U JP H02140838 U JPH02140838 U JP H02140838U JP 4828289 U JP4828289 U JP 4828289U JP 4828289 U JP4828289 U JP 4828289U JP H02140838 U JPH02140838 U JP H02140838U
Authority
JP
Japan
Prior art keywords
view
semiconductor substrate
back surface
sectional
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4828289U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4828289U priority Critical patent/JPH02140838U/ja
Publication of JPH02140838U publication Critical patent/JPH02140838U/ja
Pending legal-status Critical Current

Links

JP4828289U 1989-04-26 1989-04-26 Pending JPH02140838U (US06174465-20010116-C00003.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4828289U JPH02140838U (US06174465-20010116-C00003.png) 1989-04-26 1989-04-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4828289U JPH02140838U (US06174465-20010116-C00003.png) 1989-04-26 1989-04-26

Publications (1)

Publication Number Publication Date
JPH02140838U true JPH02140838U (US06174465-20010116-C00003.png) 1990-11-26

Family

ID=31564949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4828289U Pending JPH02140838U (US06174465-20010116-C00003.png) 1989-04-26 1989-04-26

Country Status (1)

Country Link
JP (1) JPH02140838U (US06174465-20010116-C00003.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001084606A1 (fr) * 2000-04-27 2001-11-08 Shin-Etsu Handotai Co., Ltd. Plaquette de semi-conducteur et dispositif pour procede de fabrication d'un dispositif a semi-conducteurs

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001084606A1 (fr) * 2000-04-27 2001-11-08 Shin-Etsu Handotai Co., Ltd. Plaquette de semi-conducteur et dispositif pour procede de fabrication d'un dispositif a semi-conducteurs
US6787797B2 (en) 2000-04-27 2004-09-07 Shin-Etsu Handotai Co., Ltd. Semiconductor wafer and device for semiconductor device manufacturing process

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