JPH0213746U - - Google Patents

Info

Publication number

JPH0213746U

JPH0213746U JP9229288U JP9229288U JPH0213746U JP H0213746 U JPH0213746 U JP H0213746U JP 9229288 U JP9229288 U JP 9229288U JP 9229288 U JP9229288 U JP 9229288U JP H0213746 U JPH0213746 U JP H0213746U

Authority

JP

Japan

Prior art keywords

semiconductor device

manufacturing

lead frame

lead

internal

Prior art date

1988-07-11

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 5
• 238000004519 manufacturing process Methods 0.000 claims 3
• 238000005452 bending Methods 0.000 claims 1
• 239000003822 epoxy resin Substances 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1