JPH02133308U - - Google Patents

Info

Publication number

JPH02133308U

JPH02133308U JP4176389U JP4176389U JPH02133308U JP H02133308 U JPH02133308 U JP H02133308U JP 4176389 U JP4176389 U JP 4176389U JP 4176389 U JP4176389 U JP 4176389U JP H02133308 U JPH02133308 U JP H02133308U

Authority

JP

Japan

Prior art keywords

adhesive layer

outer peripheral

semiconductor wafer

dicing tape

semiconductor wafers

Prior art date

1989-04-10

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000012790 adhesive layer Substances 0.000 claims description 7
• 239000004065 semiconductor Substances 0.000 claims 4
• 235000012431 wafers Nutrition 0.000 claims 4
• 230000002093 peripheral effect Effects 0.000 claims 2

Cited By (5)