JPH02132952U - - Google Patents

Info

Publication number

JPH02132952U

JPH02132952U JP4341989U JP4341989U JPH02132952U JP H02132952 U JPH02132952 U JP H02132952U JP 4341989 U JP4341989 U JP 4341989U JP 4341989 U JP4341989 U JP 4341989U JP H02132952 U JPH02132952 U JP H02132952U

Authority

JP

Japan

Prior art keywords

metal cap

sealed

resin

semiconductor element

wiring board

Prior art date

1989-04-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
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• 229910052751 metal Inorganic materials 0.000 claims description 4
• 239000002184 metal Substances 0.000 claims description 4
• 239000004065 semiconductor Substances 0.000 claims description 4
• 229920005989 resin Polymers 0.000 claims description 2
• 239000011347 resin Substances 0.000 claims description 2
• 239000004840 adhesive resin Substances 0.000 description 1
• 229920006223 adhesive resin Polymers 0.000 description 1
• TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1