JPH02131354U - - Google Patents

Info

Publication number

JPH02131354U

JPH02131354U JP4021389U JP4021389U JPH02131354U JP H02131354 U JPH02131354 U JP H02131354U JP 4021389 U JP4021389 U JP 4021389U JP 4021389 U JP4021389 U JP 4021389U JP H02131354 U JPH02131354 U JP H02131354U

Authority

JP

Japan

Prior art keywords

semiconductor package

package

pad

recess

leads

Prior art date

1989-04-04

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 2
• 239000004065 semiconductor Substances 0.000 claims 2
• 239000000470 constituent Substances 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1