JPH02127443U - - Google Patents
Info
- Publication number
- JPH02127443U JPH02127443U JP1989036977U JP3697789U JPH02127443U JP H02127443 U JPH02127443 U JP H02127443U JP 1989036977 U JP1989036977 U JP 1989036977U JP 3697789 U JP3697789 U JP 3697789U JP H02127443 U JPH02127443 U JP H02127443U
- Authority
- JP
- Japan
- Prior art keywords
- led
- chip
- metal wire
- driver
- printer head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 claims description 2
- 108091008695 photoreceptors Proteins 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989036977U JPH02127443U (tr) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989036977U JPH02127443U (tr) | 1989-03-30 | 1989-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02127443U true JPH02127443U (tr) | 1990-10-19 |
Family
ID=31543681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989036977U Pending JPH02127443U (tr) | 1989-03-30 | 1989-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02127443U (tr) |
-
1989
- 1989-03-30 JP JP1989036977U patent/JPH02127443U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH02127443U (tr) | ||
JPS6355537U (tr) | ||
JPH0390957U (tr) | ||
JPS6125148U (ja) | 光プリンタヘツド | |
JPH0370939U (tr) | ||
JPS61104566U (tr) | ||
JPH02108033U (tr) | ||
JPH0315149U (tr) | ||
JPS60146365U (ja) | 発光ダイオ−ドアレイヘツド | |
JPS6125150U (ja) | 光プリンタヘツド | |
JPH0390958U (tr) | ||
JPH0286743U (tr) | ||
JPS63153561U (tr) | ||
JPS63134748U (tr) | ||
JPS62187746U (tr) | ||
JPS6130264U (ja) | 印字用発光ダイオ−ド | |
JPH0345142U (tr) | ||
JPH02127442U (tr) | ||
JPS618145U (ja) | 光プリンタヘツド | |
JPH0359843U (tr) | ||
JPS6420341U (tr) | ||
JPH0267642U (tr) | ||
JPH01104048U (tr) | ||
JPS6240853U (tr) | ||
JPH02138455U (tr) |