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Priority to JP3347489UpriorityCriticalpatent/JPH02125337U/ja
Publication of JPH02125337UpublicationCriticalpatent/JPH02125337U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
H01L24/75—Apparatus for connecting with bump connectors or layer connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
H01L2224/7525—Means for applying energy, e.g. heating means
H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
H01L2224/75301—Bonding head
H01L2224/75302—Shape
H01L2224/75303—Shape of the pressing surface
Landscapes
Engineering & Computer Science
(AREA)
Manufacturing & Machinery
(AREA)
Computer Hardware Design
(AREA)
Microelectronics & Electronic Packaging
(AREA)
Power Engineering
(AREA)
Feeding Of Articles By Means Other Than Belts Or Rollers
(AREA)
