JPH02125337U - - Google Patents

Info

Publication number
JPH02125337U
JPH02125337U JP3347489U JP3347489U JPH02125337U JP H02125337 U JPH02125337 U JP H02125337U JP 3347489 U JP3347489 U JP 3347489U JP 3347489 U JP3347489 U JP 3347489U JP H02125337 U JPH02125337 U JP H02125337U
Authority
JP
Japan
Prior art keywords
plate
flat part
flat
suction
hollow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3347489U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3347489U priority Critical patent/JPH02125337U/ja
Publication of JPH02125337U publication Critical patent/JPH02125337U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525Means for applying energy, e.g. heating means
    • H01L2224/753Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301Bonding head
    • H01L2224/75302Shape
    • H01L2224/75303Shape of the pressing surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Die Bonding (AREA)
JP3347489U 1989-03-23 1989-03-23 Pending JPH02125337U (US07122547-20061017-C00032.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3347489U JPH02125337U (US07122547-20061017-C00032.png) 1989-03-23 1989-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3347489U JPH02125337U (US07122547-20061017-C00032.png) 1989-03-23 1989-03-23

Publications (1)

Publication Number Publication Date
JPH02125337U true JPH02125337U (US07122547-20061017-C00032.png) 1990-10-16

Family

ID=31537164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3347489U Pending JPH02125337U (US07122547-20061017-C00032.png) 1989-03-23 1989-03-23

Country Status (1)

Country Link
JP (1) JPH02125337U (US07122547-20061017-C00032.png)

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