JPH02120759U - - Google Patents

Info

Publication number

JPH02120759U

JPH02120759U JP2915989U JP2915989U JPH02120759U JP H02120759 U JPH02120759 U JP H02120759U JP 2915989 U JP2915989 U JP 2915989U JP 2915989 U JP2915989 U JP 2915989U JP H02120759 U JPH02120759 U JP H02120759U

Authority

JP

Japan

Prior art keywords

lead wire

molding material

terminal device

crimping

connection structure

Prior art date

1989-03-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
• 238000002788 crimping Methods 0.000 claims description 3
• 239000012778 molding material Substances 0.000 claims description 3
• 239000004020 conductor Substances 0.000 claims description 2
• 238000010586 diagram Methods 0.000 description 1