JPH02114928U - - Google Patents
Info
- Publication number
- JPH02114928U JPH02114928U JP2429589U JP2429589U JPH02114928U JP H02114928 U JPH02114928 U JP H02114928U JP 2429589 U JP2429589 U JP 2429589U JP 2429589 U JP2429589 U JP 2429589U JP H02114928 U JPH02114928 U JP H02114928U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- center
- pellet
- suction
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2429589U JPH02114928U (US20100223739A1-20100909-C00005.png) | 1989-03-02 | 1989-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2429589U JPH02114928U (US20100223739A1-20100909-C00005.png) | 1989-03-02 | 1989-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02114928U true JPH02114928U (US20100223739A1-20100909-C00005.png) | 1990-09-14 |
Family
ID=31244029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2429589U Pending JPH02114928U (US20100223739A1-20100909-C00005.png) | 1989-03-02 | 1989-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02114928U (US20100223739A1-20100909-C00005.png) |
-
1989
- 1989-03-02 JP JP2429589U patent/JPH02114928U/ja active Pending
