JPH02113340U - - Google Patents
Info
- Publication number
- JPH02113340U JPH02113340U JP1989020790U JP2079089U JPH02113340U JP H02113340 U JPH02113340 U JP H02113340U JP 1989020790 U JP1989020790 U JP 1989020790U JP 2079089 U JP2079089 U JP 2079089U JP H02113340 U JPH02113340 U JP H02113340U
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- heatsink
- terminal
- attached
- emitter terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989020790U JPH0622993Y2 (ja) | 1989-02-23 | 1989-02-23 | トランジスタ放熱器構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989020790U JPH0622993Y2 (ja) | 1989-02-23 | 1989-02-23 | トランジスタ放熱器構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02113340U true JPH02113340U (US20070167544A1-20070719-C00007.png) | 1990-09-11 |
| JPH0622993Y2 JPH0622993Y2 (ja) | 1994-06-15 |
Family
ID=31237452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989020790U Expired - Lifetime JPH0622993Y2 (ja) | 1989-02-23 | 1989-02-23 | トランジスタ放熱器構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622993Y2 (US20070167544A1-20070719-C00007.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06237556A (ja) * | 1993-02-09 | 1994-08-23 | Chodendo Hatsuden Kanren Kiki Zairyo Gijutsu Kenkyu Kumiai | 回転電機の固定子 |
-
1989
- 1989-02-23 JP JP1989020790U patent/JPH0622993Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06237556A (ja) * | 1993-02-09 | 1994-08-23 | Chodendo Hatsuden Kanren Kiki Zairyo Gijutsu Kenkyu Kumiai | 回転電機の固定子 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0622993Y2 (ja) | 1994-06-15 |
