JPH0211328U - - Google Patents

Info

Publication number
JPH0211328U
JPH0211328U JP8969588U JP8969588U JPH0211328U JP H0211328 U JPH0211328 U JP H0211328U JP 8969588 U JP8969588 U JP 8969588U JP 8969588 U JP8969588 U JP 8969588U JP H0211328 U JPH0211328 U JP H0211328U
Authority
JP
Japan
Prior art keywords
island
wiring pattern
chip
bonding pad
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8969588U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8969588U priority Critical patent/JPH0211328U/ja
Publication of JPH0211328U publication Critical patent/JPH0211328U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8969588U 1988-07-05 1988-07-05 Pending JPH0211328U (US08197722-20120612-C00042.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8969588U JPH0211328U (US08197722-20120612-C00042.png) 1988-07-05 1988-07-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8969588U JPH0211328U (US08197722-20120612-C00042.png) 1988-07-05 1988-07-05

Publications (1)

Publication Number Publication Date
JPH0211328U true JPH0211328U (US08197722-20120612-C00042.png) 1990-01-24

Family

ID=31314240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8969588U Pending JPH0211328U (US08197722-20120612-C00042.png) 1988-07-05 1988-07-05

Country Status (1)

Country Link
JP (1) JPH0211328U (US08197722-20120612-C00042.png)

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