JPH02110368U - - Google Patents

Info

Publication number

JPH02110368U

JPH02110368U JP1903389U JP1903389U JPH02110368U JP H02110368 U JPH02110368 U JP H02110368U JP 1903389 U JP1903389 U JP 1903389U JP 1903389 U JP1903389 U JP 1903389U JP H02110368 U JPH02110368 U JP H02110368U

Authority

JP

Japan

Prior art keywords

mounting

component

terminal pad

integrated circuit

hybrid integrated

Prior art date

1989-02-21

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims description 2
• 229910000679 solder Inorganic materials 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims description 2
• 238000000926 separation method Methods 0.000 description 1