JPH02106837U - - Google Patents
Info
- Publication number
- JPH02106837U JPH02106837U JP1524889U JP1524889U JPH02106837U JP H02106837 U JPH02106837 U JP H02106837U JP 1524889 U JP1524889 U JP 1524889U JP 1524889 U JP1524889 U JP 1524889U JP H02106837 U JPH02106837 U JP H02106837U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- wire bonding
- mesa
- semiconductor
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案リードフレームの一実施例を示
すインナーリード部拡大斜視図、第２図は別の実
施例で第１図のワイヤーボンデイング部を浸蝕さ
せないときの拡大斜視図、第３図は更に別の実施
例の拡大斜視図である。第４図はＤＩＰ型のリー
ドフレームの一部省略全体斜視説明図、第５図は
モールド樹脂を２点仮想線で表わしたＩＣパツケ
ージの斜視図である。第６図は第４図のＡ―Ａ′
断面部の本考案リードフレーム製造工程の一例（
蝕刻法）を示す説明図である。
（符号の説明）、１……ワイヤーボンデイング
部、２……インナーリード部分、２１，２２……
インナーリードの上面、下面、３……メサ状突起
、４……デインプル、Ｆ……リードフレーム、Ｍ
Ｌ……樹脂モールドライン。
Fig. 1 is an enlarged perspective view of the inner lead part showing one embodiment of the lead frame of the present invention, Fig. 2 is an enlarged perspective view of another embodiment when the wire bonding part of Fig. 1 is not eroded, and Fig. 3 is an enlarged perspective view of the inner lead part showing one embodiment of the lead frame of the present invention. FIG. 7 is an enlarged perspective view of yet another embodiment. FIG. 4 is a partially omitted perspective explanatory view of a DIP type lead frame, and FIG. 5 is a perspective view of an IC package in which molded resin is represented by two imaginary lines. Figure 6 is A-A' of Figure 4.
An example of the manufacturing process of the inventive lead frame of the cross section (
FIG. (Explanation of symbols), 1... Wire bonding part, 2... Inner lead part, 21, 22...
Upper surface, lower surface of inner lead, 3... Mesa-shaped projection, 4... Dimple, F... Lead frame, M
L...Resin mold line.
Claims (1)
に於て、ワイヤーボンデイング部１を除く樹脂モ
ールドラインＭＬまでの帯板状インナーリード部
分２の上面２１及び／若しくは下面２２に多数の
メサ状の突起３を形設したことを特徴とする半導
体用リードフレーム。 ２ ワイヤーボンデイング部１を除く樹脂モール
ドラインＭＬまでの帯板状インナーリード部分２
の上下いづれか一方の面２１にメサ状の突起３を
設け他方の面２２にデインプル４を形設したこと
を特徴とする半導体用リードフレーム。[Scope of claims for utility model registration] 1 Lead frame F for resin molded semiconductors
A semiconductor device characterized in that a large number of mesa-shaped protrusions 3 are formed on the upper surface 21 and/or lower surface 22 of the strip-shaped inner lead portion 2 up to the resin mold line ML excluding the wire bonding portion 1. Lead frame. 2 Strip-like inner lead portion 2 up to resin mold line ML excluding wire bonding portion 1
A semiconductor lead frame characterized in that a mesa-shaped protrusion 3 is provided on either the upper or lower surface 21 of the semiconductor lead frame, and a dimple 4 is formed on the other surface 22.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1524889U JPH02106837U (en) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1524889U JPH02106837U (en) | 1989-02-10 | 1989-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106837U true JPH02106837U (en) | 1990-08-24 |
Family
ID=31227135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1524889U Pending JPH02106837U (en) | 1989-02-10 | 1989-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106837U (en) |
-
1989
- 1989-02-10 JP JP1524889U patent/JPH02106837U/ja active Pending
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