JPH02106275A - Polishing tape - Google Patents

Abstract

PURPOSE:To improve an antistatic effect and favorably remove only the deposited foreign matter deposited on a polishing material without damaging the polishing material by providing a conductive body layer having an electric resistance of 10<10>OMEGA/sq or less between a polishing layer and a base body. CONSTITUTION:A conductive body layer having an electric resistance of 10<10>OMEGA/sq or less is provided between a polishing layer and a base body. As a result, the electric resistance of the whole polishing tape can be lowered reducing an electrostatic charge, restraining the depositin of dust caused by the electrostatic charge, and favorably removing only deposited foreign matter from the polishing material of a magnetic head, etc. without causing a scratch on the polishing material of the magnetic head, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an abrasive tape, and more particularly to an abrasive tape with low electrostatic charge and excellent cleaning properties.

[Conventional technology]

Polishing tapes are usually prepared by coating A1.203 powder, Cr, O, powder, SiO2 on a substrate such as a polyester film.
It is made by bonding abrasive materials such as powder, SiC powder, etc. with a binder resin, and is used, for example, to remove dust attached to the magnetic head or detached magnetic powder by sliding it in sliding contact with the magnetic head of a magnetic recording/reproducing device. It is widely used to remove foreign matter adhering to objects to be polished.

[Problem to be solved by the invention]

However, AfzO used in these conventional polishing tapes
Abrasives such as 3 powder, Cr, O, powder, 5iOz powder, and SiC powder all have high electrical resistance (and the abrasive tapes obtained using these have a large charge, so a large amount of dust will adhere to them). These adhering dust particles tend to cause scratches on objects to be polished, such as magnetic heads.

[Means for Solving the Problems] This invention was made as a result of various studies in view of the current situation, and the present invention was made as a result of various studies in view of the current situation.
By providing a conductive layer of 0 Ω/sq or less, the electrical resistance of the entire polishing tape is lowered, and the electrostatic charge is reduced.
This suppresses the adhesion of dust due to electrification, and allows only adhering foreign matter to be removed from the object to be polished, such as the magnetic head, without causing scratches on the object to be polished, such as the magnetic head.

In this invention, the conductor layer provided between the polishing layer and the base preferably has an electrical resistance of 10I0Ω/sq or less, and such electrical resistance is 1QIOΩ/sq or less.
When a conductive layer having a size of sq or less is formed, the electrical resistance of the entire polishing tape is sufficiently reduced, and the charging becomes sufficiently small, so that the adhesion of dust due to charging is sufficiently suppressed. Therefore,
By using a polishing tape in which such a conductive layer is provided between the polishing layer and the substrate, it is possible to remove the adhesion from the magnetic head or other object to be polished without causing scratches on the object to be polished, such as the magnetic head. Only foreign matter can be removed well.

Such a conductive layer is formed by mixing and dispersing conductive powder with a binder resin, an organic solvent, etc. to prepare a conductive layer paint, applying this conductive layer paint onto a substrate, and drying it. As the conductive powder, carbon black or metal powder with good conductivity such as copper powder is preferably used. The content of the conductive powder is preferably within the range of 5 to 80% by weight based on the total solid components in the conductor layer, and if the amount of conductive powder is too small, the electrical resistance of the conductor layer may be sufficiently reduced. If the amount is too large, the adhesion of the conductive layer to the substrate will decrease.

In addition, binder resins used for the conductor layer include vinyl chloride-vinyl acetate copolymer, polyvinyl butyral resin, cellulose resin, polyurethane resin, polyester resin, epoxy resin, and polyether resin. , isocyanate compounds, radiation-curable resins, and other conventional binder resins are preferably used. Examples of organic solvents include acetone, methyl isobutyl ketone, methyl ethyl ketone, cyclohexanone, toluene, ethyl acetate, tetrahydrofuran, and dimethyl formamide. Organic solvents commonly used in the past may be used alone or in combination of two or more.

In addition, the conductive layer can be formed by depositing a highly conductive metal such as aluminum or a metal oxide such as palladium oxide onto the substrate.

In addition, the polishing layer formed on the conductive layer thus formed is prepared by mixing and dispersing abrasive powder with a binder resin, an organic solvent, etc. to prepare a polishing paint, and applying this polishing paint to the substrate. It is formed by applying and drying.

As the abrasive powder, it is preferable to use one that has appropriate hardness and can effectively remove foreign matter such as dust attached to the object to be polished. For example, A1zCh powder, Cr! 0U powder, SiO2 powder, SiC powder, etc.
They may be used alone or in a mixture of two or more. The amount used is preferably within the range of 20 to 90% by weight, and is preferably used within the range of 50 to 80% by weight based on the total solid components in the polishing layer, in order to exhibit a sufficient leaning effect. is more preferable.

Further, as the binder resin and organic solvent used in such a polishing layer, the same ones as those used in the above-mentioned conductor layer are preferably used.

The polishing layer contains various commonly used additives,
For example, a lubricant, a dispersant, a filler, etc. may be added as appropriate.

〔Example] Next, embodiments of the invention will be described.

Example 1 Ketchen Black EC (Aku 30 parts by weight, manufactured by Zo Co., Ltd.,
(Carbon black) Byron 200 (manufactured by Toyobo Co., Ltd., 70〃Polyester resin) Methyl ethyl ketone 400〃This composition was mixed and dispersed in a ball mill for 40 hours to prepare a paint for a conductor layer, and this paint for a conductor layer was mixed to a thickness of 50 μm. A conductive layer was formed by coating the polyester film to a dry thickness of 2 μm and drying. The electrical resistance of this conductor layer was 10'Ω/sq.

Next, on the conductor layer on this polyester film,
A polishing coating having the composition shown below was applied and dried to form a polishing layer with a thickness of 10 μm. After that, it was cut to a predetermined width to make abrasive tape.

Abrasive paint WA-400 (manufactured by Fujimi Abrasive Materials Co., Ltd. 75 Heavy Industries Co., Ltd.,
Alumina powder) N-2301 (manufactured by Nippon Polyurethane Industry Co., Ltd., polyurethane resin) Methyl ethyl ketone 300 Comparative Example 1 A polishing tape was prepared in the same manner as in Example 1, except that the formation of the conductive layer was omitted. I made it.

Regarding the polishing tapes obtained in each example and comparative example,
The charging voltage on the surface of the polishing layer was measured, and the half-life until this charging voltage decreased to 50% of the initial charging voltage was measured. In addition, each polishing tape was applied to an 8 mm VTR equipped with a Sendus head with a gap length of 0.25 μm that was clogged due to magnetic coating detachment or adhesion of dust, etc.
The cleaning effect and the damage to the magnetic head caused by the polishing tape were investigated. The cleaning effect was evaluated by checking the degree of output recovery after running for 20 seconds, and rated as (0) if the output decreased within 0.3 dB compared to the output before clogging. In addition, the state of damage to the magnetic head was determined by observing the presence or absence of scratches on the surface of the magnetic head.

Table 1 below shows the results.

Table 1 [Effects of the Invention] As is clear from Table 1 above, the abrasive tape obtained by the present invention (Example 1) has a lower electrostatic voltage than the abrasive tape obtained in Comparative Example 1. Therefore, the polishing tape obtained by this invention has an excellent antistatic effect and can be used without damaging the object to be polished. It can be seen that only the foreign matter adhering to the polished object can be successfully removed.

Patent applicant: Hitachi Maxell, Ltd.

Claims (1)

[Scope of Claims] 1. An abrasive tape in which an abrasive layer containing an abrasive powder and a binder component is provided on a substrate, and the electrical resistance between the abrasive layer and the substrate is 10^1^0 Ω/sq or less. The polishing tape 2 is characterized in that it is provided with a conductive layer, and the polishing material powder contained in the polishing layer is Al_2, O_
3 powder, Cr_2O_3 powder, SiO_2 powder, SiC
The abrasive tape according to claim 1, which is at least one abrasive powder selected from powders.