JPH02104691U - - Google Patents
Info
- Publication number
- JPH02104691U JPH02104691U JP1989012406U JP1240689U JPH02104691U JP H02104691 U JPH02104691 U JP H02104691U JP 1989012406 U JP1989012406 U JP 1989012406U JP 1240689 U JP1240689 U JP 1240689U JP H02104691 U JPH02104691 U JP H02104691U
- Authority
- JP
- Japan
- Prior art keywords
- case
- combination structure
- metal board
- metal
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 3
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Multi-Conductor Connections (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989012406U JPH0741194Y2 (ja) | 1989-02-03 | 1989-02-03 | 金属基板とケースとの組合わせ構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989012406U JPH0741194Y2 (ja) | 1989-02-03 | 1989-02-03 | 金属基板とケースとの組合わせ構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02104691U true JPH02104691U (US08063081-20111122-C00044.png) | 1990-08-20 |
| JPH0741194Y2 JPH0741194Y2 (ja) | 1995-09-20 |
Family
ID=31221825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989012406U Expired - Lifetime JPH0741194Y2 (ja) | 1989-02-03 | 1989-02-03 | 金属基板とケースとの組合わせ構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741194Y2 (US08063081-20111122-C00044.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217567A (ja) * | 2001-01-19 | 2002-08-02 | Nec Corp | 電子機器内部実装基板の低インピーダンス実装方法及び実装構造 |
| WO2006104037A1 (ja) * | 2005-03-28 | 2006-10-05 | The Furukawa Electric Co., Ltd. | メタルコア基板の補強構造及び電気接続箱 |
| JP2008085744A (ja) * | 2006-09-28 | 2008-04-10 | Nippon Dempa Kogyo Co Ltd | 表面実装用の圧電発振器 |
| JP2009026773A (ja) * | 2001-12-06 | 2009-02-05 | Rohm Co Ltd | 充電池用保護回路モジュール |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587671U (ja) * | 1981-07-07 | 1983-01-18 | 株式会社松井色素化学工業所 | 転写捺染シ−ト |
-
1989
- 1989-02-03 JP JP1989012406U patent/JPH0741194Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587671U (ja) * | 1981-07-07 | 1983-01-18 | 株式会社松井色素化学工業所 | 転写捺染シ−ト |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217567A (ja) * | 2001-01-19 | 2002-08-02 | Nec Corp | 電子機器内部実装基板の低インピーダンス実装方法及び実装構造 |
| JP2009026773A (ja) * | 2001-12-06 | 2009-02-05 | Rohm Co Ltd | 充電池用保護回路モジュール |
| WO2006104037A1 (ja) * | 2005-03-28 | 2006-10-05 | The Furukawa Electric Co., Ltd. | メタルコア基板の補強構造及び電気接続箱 |
| JP2008085744A (ja) * | 2006-09-28 | 2008-04-10 | Nippon Dempa Kogyo Co Ltd | 表面実装用の圧電発振器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741194Y2 (ja) | 1995-09-20 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |