JPH02104636U - - Google Patents

Info

Publication number
JPH02104636U
JPH02104636U JP1376789U JP1376789U JPH02104636U JP H02104636 U JPH02104636 U JP H02104636U JP 1376789 U JP1376789 U JP 1376789U JP 1376789 U JP1376789 U JP 1376789U JP H02104636 U JPH02104636 U JP H02104636U
Authority
JP
Japan
Prior art keywords
resin
resin sealing
lead
showing
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1376789U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1376789U priority Critical patent/JPH02104636U/ja
Publication of JPH02104636U publication Critical patent/JPH02104636U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1376789U 1989-02-08 1989-02-08 Pending JPH02104636U (US06368395-20020409-C00050.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1376789U JPH02104636U (US06368395-20020409-C00050.png) 1989-02-08 1989-02-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1376789U JPH02104636U (US06368395-20020409-C00050.png) 1989-02-08 1989-02-08

Publications (1)

Publication Number Publication Date
JPH02104636U true JPH02104636U (US06368395-20020409-C00050.png) 1990-08-20

Family

ID=31224361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1376789U Pending JPH02104636U (US06368395-20020409-C00050.png) 1989-02-08 1989-02-08

Country Status (1)

Country Link
JP (1) JPH02104636U (US06368395-20020409-C00050.png)

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