JPH0196103A - Dental composition and production of dental material - Google Patents
Dental composition and production of dental materialInfo
- Publication number
- JPH0196103A JPH0196103A JP62253408A JP25340887A JPH0196103A JP H0196103 A JPH0196103 A JP H0196103A JP 62253408 A JP62253408 A JP 62253408A JP 25340887 A JP25340887 A JP 25340887A JP H0196103 A JPH0196103 A JP H0196103A
- Authority
- JP
- Japan
- Prior art keywords
- dental
- composition
- binder
- mixture
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 24
- 239000005548 dental material Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 20
- 239000000956 alloy Substances 0.000 claims abstract description 20
- 239000000843 powder Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000011230 binding agent Substances 0.000 claims abstract description 12
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 238000010304 firing Methods 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 abstract description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052738 indium Inorganic materials 0.000 abstract description 3
- 229910052763 palladium Inorganic materials 0.000 abstract description 3
- 229920000877 Melamine resin Polymers 0.000 abstract description 2
- 229910052804 chromium Inorganic materials 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract 3
- 239000000126 substance Substances 0.000 abstract 3
- 239000004640 Melamine resin Substances 0.000 abstract 1
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- -1 trichlorethylene Chemical class 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229940023487 dental product Drugs 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229920006186 water-soluble synthetic resin Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はインレー、ブリッジ等の歯科用材料を製造する
ための原料として用いられる歯科用組成物および歯科用
組成物を用いて歯科用材料を製造するための方法に関す
るものである。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a dental composition used as a raw material for manufacturing dental materials such as inlays and bridges, and to manufacturing dental materials using the dental composition. It relates to a method for manufacturing.
歯の欠損部を填めるためのインレー、人工歯の支台のブ
リッジ、義歯床等には例えばＡｕ（１２重量％以上）−
Ｐｄ（２０重量％以上） −Ａｇ（４０重量％以上）か
らなる合金（ＪＩＳ Ｔａ２０５）、 Ａｇ （６
０重量％以上） −Ｉｎ（５重量％未満）からなる合金
（ＪＩＳ Ｔ ６１０８） 、Ｃｏ （４０重量％
以上）−Ｃｒ（２０重量％以上）からなる合金（ＪＩＳ
Ｔ ６１１５）等の合金が用いられる。For example, Au (12% by weight or more) is used for inlays to fill missing teeth, bridges for artificial teeth, denture bases, etc.
Alloy consisting of Pd (20% by weight or more) -Ag (40% by weight or more) (JIS Ta205), Ag (6
0% by weight or more) - Alloy consisting of In (less than 5% by weight) (JIS T 6108), Co (40% by weight)
or more)-Cr (20% by weight or more) (JIS
An alloy such as T 6115) is used.
従来は樹脂粘土等により歯型をとり、該歯型に合わせて
ワ、ツクスを材料として母型を製作し、該母型を石膏等
を材料とする鋳型で覆った後焼成して該ワックスからな
る母型を分解揮散させ、このようにして得られた鋳型の
キャビティー内に上記合金溶湯を注入することにより歯
科用材料を製造していた。Conventionally, a tooth mold is made from resin clay or the like, a matrix is made from wax or tsukusu to match the tooth mold, the matrix is covered with a mold made from plaster or the like, and then fired and molded from the wax. Dental materials were produced by decomposing and volatilizing the matrix, and injecting the molten alloy into the cavity of the thus obtained mold.
しかし上記従来方法によれば、歯型とリーワックスによ
る母型の製作−鋳型の製作−焼成−鋳造と云う多くの工
程を必要とし、歯科用材料の製造に手間がかかる。However, according to the above-mentioned conventional method, many steps are required, including the production of a master mold using a tooth pattern and Lee wax, the production of a mold, firing, and casting, and it takes time and effort to produce dental materials.
本発明は上記従来の問題点を解決する手段として、金属
又は合金粉末と、バインダと、溶剤との混合物を主体と
するとする歯科用組成物、および該歯科用組成物を型に
充填して所定形状に成形し。As a means to solve the above-mentioned conventional problems, the present invention provides a dental composition mainly consisting of a mixture of metal or alloy powder, a binder, and a solvent, and a mold for filling the dental composition into a predetermined shape. Form into shape.
該成形物を焼成する歯科用材料の製造方法を提供するも
のである。The present invention provides a method for manufacturing a dental material by firing the molded product.
本発明で用いられる金属または合金粉末とはＡｇ、Ｐｄ
、Ａｕ、Ｎｉ、Ｃｒ、Ｉｎ、Ｃｏ等の単体粉末、あるい
は上記金属の二種以上の混合粉末、あるいは上記金属の
二種以上の合金の粉末、あるいは上記合金の二種以上の
混合粉末であり、合金としては例えば前記したようなＪ
ＩＳ Ｔ ６１０６、ＪＩＳ Ｔ ６１０８、Ｊ
ＩＳ Ｔ ６１１５等に記載されるものがある。The metal or alloy powder used in the present invention is Ag, Pd
, a single powder of Au, Ni, Cr, In, Co, etc., a mixed powder of two or more of the above metals, a powder of an alloy of two or more of the above metals, or a mixed powder of two or more of the above alloys. , as an alloy, for example, J as mentioned above.
IS T 6106, JIS T 6108, J
There are those described in IS T 6115 and the like.
上記金属または合金粉末の粒子径は結合温度を低くし、
かつ反応性を良好にするために出来るだけ小さい方がよ
く、望ましくは５０μｍ以下、更に望ましくは１０μｍ
以下の粒子径とされ、また組成物の分散性、成形性を良
好ならしめるために球状であることが望ましい。The particle size of the metal or alloy powder mentioned above lowers the bonding temperature,
In order to improve the reactivity, it is better to be as small as possible, preferably 50 μm or less, and more preferably 10 μm.
It is desirable that the particles have a particle size as follows, and that they are spherical in order to improve the dispersibility and moldability of the composition.
本発明に用いられるバインダは主として合成樹脂である
。該合成樹脂としてはエポキシ樹脂、メラミン樹脂、フ
ェノール樹脂、レゾルシノール樹脂、ウレタン樹脂、ア
クリル樹脂、ポリエステル樹脂、ポリビニルフタレート
、ポリビニルブチレート、ポリアミド樹脂、ポリビニル
アルコール、カルボキシメチルセルロース等の通常この
種のインクあるいはペーストに用いられている熱硬化性
合成樹脂、熱可塑性合成樹脂が含まれ、２００℃以下の
低温で乾燥もしくは硬化するものが望ましい。The binder used in the present invention is mainly a synthetic resin. The synthetic resins include epoxy resins, melamine resins, phenolic resins, resorcinol resins, urethane resins, acrylic resins, polyester resins, polyvinyl phthalate, polyvinyl butyrate, polyamide resins, polyvinyl alcohol, carboxymethyl cellulose, and other inks or pastes. It includes thermosetting synthetic resins and thermoplastic synthetic resins that are used in the industry, and desirably those that dry or harden at a low temperature of 200°C or lower.
本発明に用いられる溶剤としてはメタノール。 The solvent used in the present invention is methanol.
エタノール、ｎ−ブタノール等のアルコール、トリオー
ル、キジロール等の芳香族系、酢酸エチル。Alcohols such as ethanol and n-butanol, aromatic systems such as triol and quidylol, and ethyl acetate.
酢酸ｎ−ブチル等の酢酸エステル系、メチルエチルケト
ン、メチルイソブチルケトン等のケトン系。Acetate esters such as n-butyl acetate, ketones such as methyl ethyl ketone and methyl isobutyl ketone.
セルソルブアセテート、ｎ−ブチルセロソルブ等のセロ
ソルブ系、ヘキサン、ヘプタン、シクロヘキサン等のパ
ラフィン系、メチレンクロライド。Cellosolve types such as cellosolve acetate and n-butyl cellosolve, paraffin types such as hexane, heptane, and cyclohexane, and methylene chloride.
トリクロルエチレン等の塩素化炭化水素系等の通常この
種のインクあるいはペーストに用いられている有機溶剤
の単独あるいは該有機溶剤の二種以上の混合溶剤が含ま
れるが、水溶性の合成樹脂の場合には水、あるいは水と
メタノール、エタノール等の水溶性有機溶剤との混合物
が用いられる。Contains organic solvents such as chlorinated hydrocarbons such as trichlorethylene, which are usually used in this type of ink or paste, or a mixture of two or more of these organic solvents, but in the case of water-soluble synthetic resins. Water or a mixture of water and a water-soluble organic solvent such as methanol or ethanol is used.
上記成分以外に本発明の組成物には更にステアリン酸、
流動パラフィン、アルキルベンゼンスルホン酸塩、アエ
ロジル等の成形性付与剤、成形形状安定剤１分散剤、増
粘剤等が添加されてもよい。In addition to the above ingredients, the composition of the present invention further includes stearic acid,
Liquid paraffin, an alkylbenzene sulfonate, a moldability imparting agent such as Aerosil, a molding shape stabilizer, a dispersant, a thickener, etc. may be added.
上記金属または合金粉末と、バインダと、溶剤との混合
物の混合比率は一般に金属または合金粉末１００重量部
に対し、バインダ０．５〜１．５重量部、溶剤５〜３０
重量部程置部される。バインダの量が少な過ぎると成形
物の形状安定性や強度が低下し、多過ぎると焼成後の収
縮率が大きくなって製品の割れ等の原因となる。The mixing ratio of the mixture of the metal or alloy powder, binder, and solvent is generally 100 parts by weight of the metal or alloy powder, 0.5 to 1.5 parts by weight of the binder, and 5 to 30 parts by weight of the solvent.
Parts by weight are measured. If the amount of binder is too small, the shape stability and strength of the molded product will decrease, and if it is too large, the shrinkage rate after firing will increase, causing cracks in the product.
上記成分比率により混合された金属または合金粉末と、
バインダと、溶剤とからなる組成物は粘土状であり所望
の型に充填して容易に成形することが出来る。成形後は
得られた成形物を自然乾燥または望ましくは２００℃以
下の低温で加熱乾燥またはバインダである合成樹脂の硬
化を行なう、−〔焼成〕
該成形物は通常６００〜８００℃程度で焼成される。焼
成は大気雰囲気中あるいは窒素やアルゴンガス等の不活
性ガス雰囲気中で行なう、該焼成によってバインダある
いはその他の成分は分散揮散し、金属または合金粉末は
相互融着（反応と云う）して歯科用材料が製造される。Metal or alloy powder mixed according to the above component ratio,
The composition consisting of a binder and a solvent is clay-like and can be easily molded by filling it into a desired mold. After molding, the molded product is air-dried, preferably dried by heating at a low temperature of 200°C or less, or the synthetic resin that is the binder is cured. Ru. Firing is carried out in the air or in an inert gas atmosphere such as nitrogen or argon gas. By this firing, the binder or other components are dispersed and volatilized, and the metal or alloy powders are mutually fused (referred to as reaction) to form a dental product. Material is manufactured.
本発明の歯科用組成物を用いると、成形−焼成の二工程
で歯科用材料が製造される。When the dental composition of the present invention is used, a dental material is produced in two steps: molding and firing.
〔発明の効果］
したがって本発明においては極めて簡単な短い工程で歯
科用材料を製造出来るから安価に歯科用材料を提供する
ことが可能となる。[Effects of the Invention] Accordingly, in the present invention, dental materials can be manufactured through extremely simple and short steps, and therefore, it is possible to provide dental materials at low cost.
夫々１０μｍの平均径を有する球状のＡｇ微粉末とＰｄ
微粉末およびＩｎ微粉末を重量比で６５：２０：１５に
なるように混合し、ポリビニルフタレートを水で５重量
％に溶解したものを該混合金属粉に対し、１重量％添加
し混合して、粘土状にした。これを歯型（インレー用）
に押し込んで充填し、その後自然乾燥を行なった。該歯
型から成形物を抜きとったのち、大気中７００℃に加熱
して焼成してインレーを製造した。焼成後の得られたイ
ンレーの金属断面には、全く気孔がみつからず、完全に
合金化していることが判明した。Spherical Ag fine powder and Pd each having an average diameter of 10 μm
Fine powder and In fine powder were mixed in a weight ratio of 65:20:15, and 1% by weight of polyvinyl phthalate dissolved in water was added to the mixed metal powder and mixed. , made into clay. This is a tooth mold (for inlay)
It was filled by pressing it into a container, and then air-dried. After extracting the molded product from the tooth mold, it was heated to 700° C. in the atmosphere and fired to produce an inlay. No pores were found in the metal cross section of the obtained inlay after firing, indicating that it was completely alloyed.
尚、この合金の硬さはビッカース硬度でＨｖ＝１１２で
あった。The hardness of this alloy was Hv=112 in terms of Vickers hardness.
Claims (1)
を主体とすることを特徴とする歯科用組成物 ２、金属又は合金粉末と、バインダと、溶剤との混合物
を型に充填して所定形状に成形し、該成形物を焼成する
ことを特徴とする歯科用材料の製造方法[Claims] 1. A dental composition mainly comprising a mixture of a metal or alloy powder, a binder, and a solvent. 2. A dental composition comprising a mixture of a metal or alloy powder, a binder, and a solvent. A method for producing a dental material, which comprises filling a mold, molding it into a predetermined shape, and firing the molded product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62253408A JPH0196103A (en) | 1987-10-07 | 1987-10-07 | Dental composition and production of dental material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62253408A JPH0196103A (en) | 1987-10-07 | 1987-10-07 | Dental composition and production of dental material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0196103A true JPH0196103A (en) | 1989-04-14 |
Family
ID=17250967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62253408A Pending JPH0196103A (en) | 1987-10-07 | 1987-10-07 | Dental composition and production of dental material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0196103A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8475695B2 (en) | 2004-12-29 | 2013-07-02 | General Electric Company | Ceramic composite with integrated compliance/wear layer |
-
1987
- 1987-10-07 JP JP62253408A patent/JPH0196103A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8475695B2 (en) | 2004-12-29 | 2013-07-02 | General Electric Company | Ceramic composite with integrated compliance/wear layer |
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