JPH0193759U - - Google Patents

Info

Publication number
JPH0193759U
JPH0193759U JP18874587U JP18874587U JPH0193759U JP H0193759 U JPH0193759 U JP H0193759U JP 18874587 U JP18874587 U JP 18874587U JP 18874587 U JP18874587 U JP 18874587U JP H0193759 U JPH0193759 U JP H0193759U
Authority
JP
Japan
Prior art keywords
printed wiring
thin film
conductive material
wiring board
film conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18874587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18874587U priority Critical patent/JPH0193759U/ja
Publication of JPH0193759U publication Critical patent/JPH0193759U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例による印刷配線基
板を示す斜視図、第2図、第3図は従来の印刷配
線基板を示す斜視図及び平面図である。 1……印刷配線基板、2……印刷配線、3……
電子部品、4,5……ネジ、6……機器本体、7
a,7b,7c……穴、8……目印部。
FIG. 1 is a perspective view showing a printed wiring board according to an embodiment of this invention, and FIGS. 2 and 3 are a perspective view and a plan view showing a conventional printed wiring board. 1...Printed wiring board, 2...Printed wiring, 3...
Electronic parts, 4, 5...Screws, 6...Device body, 7
a, 7b, 7c...hole, 8...marker part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面に貼着された薄膜導電材にエツチング処理
等を行つて形成した配線を備え、かつ電子部品を
実装したり、基板を機器に取り付けたりする穴を
有する印刷配線基板において、上記穴の近傍に薄
膜導電材の一部を残すことにより、当該穴を識別
する目印部を設けたことを特徴とする印刷配線基
板。
In a printed wiring board that is equipped with wiring formed by etching a thin film conductive material adhered to the surface and has holes for mounting electronic components or attaching the board to equipment, A printed wiring board characterized in that a mark part for identifying the hole is provided by leaving a part of the thin film conductive material.
JP18874587U 1987-12-11 1987-12-11 Pending JPH0193759U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18874587U JPH0193759U (en) 1987-12-11 1987-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18874587U JPH0193759U (en) 1987-12-11 1987-12-11

Publications (1)

Publication Number Publication Date
JPH0193759U true JPH0193759U (en) 1989-06-20

Family

ID=31479818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18874587U Pending JPH0193759U (en) 1987-12-11 1987-12-11

Country Status (1)

Country Link
JP (1) JPH0193759U (en)

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