JPH0193746U - - Google Patents

Info

Publication number
JPH0193746U
JPH0193746U JP19040887U JP19040887U JPH0193746U JP H0193746 U JPH0193746 U JP H0193746U JP 19040887 U JP19040887 U JP 19040887U JP 19040887 U JP19040887 U JP 19040887U JP H0193746 U JPH0193746 U JP H0193746U
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
surface height
lead frame
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19040887U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19040887U priority Critical patent/JPH0193746U/ja
Publication of JPH0193746U publication Critical patent/JPH0193746U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP19040887U 1987-12-14 1987-12-14 Pending JPH0193746U (US07179912-20070220-C00144.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19040887U JPH0193746U (US07179912-20070220-C00144.png) 1987-12-14 1987-12-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19040887U JPH0193746U (US07179912-20070220-C00144.png) 1987-12-14 1987-12-14

Publications (1)

Publication Number Publication Date
JPH0193746U true JPH0193746U (US07179912-20070220-C00144.png) 1989-06-20

Family

ID=31481382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19040887U Pending JPH0193746U (US07179912-20070220-C00144.png) 1987-12-14 1987-12-14

Country Status (1)

Country Link
JP (1) JPH0193746U (US07179912-20070220-C00144.png)

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