JPH0193731U - - Google Patents
Info
- Publication number
- JPH0193731U JPH0193731U JP19105087U JP19105087U JPH0193731U JP H0193731 U JPH0193731 U JP H0193731U JP 19105087 U JP19105087 U JP 19105087U JP 19105087 U JP19105087 U JP 19105087U JP H0193731 U JPH0193731 U JP H0193731U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- power
- gaasfet
- source electrode
- gold ribbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
- H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
- H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
Landscapes
- Junction Field-Effect Transistors (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19105087U JPH0193731U (US07534539-20090519-C00280.png) | 1987-12-15 | 1987-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19105087U JPH0193731U (US07534539-20090519-C00280.png) | 1987-12-15 | 1987-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193731U true JPH0193731U (US07534539-20090519-C00280.png) | 1989-06-20 |
Family
ID=31481978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19105087U Pending JPH0193731U (US07534539-20090519-C00280.png) | 1987-12-15 | 1987-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193731U (US07534539-20090519-C00280.png) |
-
1987
- 1987-12-15 JP JP19105087U patent/JPH0193731U/ja active Pending
