JPH0191493A - Formation of interconnection - Google Patents

Formation of interconnection

Info

Publication number
JPH0191493A
JPH0191493A JP28463287A JP28463287A JPH0191493A JP H0191493 A JPH0191493 A JP H0191493A JP 28463287 A JP28463287 A JP 28463287A JP 28463287 A JP28463287 A JP 28463287A JP H0191493 A JPH0191493 A JP H0191493A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
substrate
interconnection
formed
predetermined pattern
interconnections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28463287A
Inventor
Tomoichi Hotani
Satoshi Morimoto
Toshiyuki Suzuki
Masami Takagi
Nobuyuki Takahashi
Yoshinaga Yamakawa
Original Assignee
Matsushita Electric Works Ltd
Toyo Giken Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Abstract

PURPOSE:To facilitate adjustment of thickness of an insulating layer, by disposing a preliminary substrate on which a reversed predetermined pattern of interconnection is formed removably, on a substrate through an adhesive layer so that the predetermined pattern of interconnection is transferred to the substrate. CONSTITUTION:A preliminary substrate 35 on which an interconnection 2 having a reversed predetermined pattern is formed such that it can be peeled off is prepared and the preliminary substrate 35 is superposed on a substrate 1 through an adhesive layer 31 with the interconnection pattern formed surface faced to the substrate 1 so that the predetermined pattern of the circuit 2 is transferred to the substrate 1. Accordingly, even if there are several places where interconnections are to be formed and an interconnection 2 must be provided in each place, the patterns of the interconnections 2 formed correctly on the preliminary substrate 35 with a predetermined accuracy can be transferred to the substrate 1 simultaneously with the accuracy maintained. In this manner, positional accuracy of the interconnections as a whole can be improved, and a thickness of an insulating layer 3 can be easily adjusted as thin as desired.
JP28463287A 1987-06-25 1987-11-11 Formation of interconnection Pending JPH0191493A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP15826387 1987-06-25
JP28463287A JPH0191493A (en) 1987-06-25 1987-11-11 Formation of interconnection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28463287A JPH0191493A (en) 1987-06-25 1987-11-11 Formation of interconnection

Publications (1)

Publication Number Publication Date
JPH0191493A true true JPH0191493A (en) 1989-04-11

Family

ID=26485443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28463287A Pending JPH0191493A (en) 1987-06-25 1987-11-11 Formation of interconnection

Country Status (1)

Country Link
JP (1) JPH0191493A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534595A (en) * 1978-08-30 1980-03-11 Texas Instruments Inc Microelectronic semiconductor switching circuit
JPS5848988A (en) * 1981-09-18 1983-03-23 Sumitomo Electric Industries Method of producing printed circuit board
JPS58137291A (en) * 1982-02-09 1983-08-15 Suwa Seikosha Kk Method of producing printed circuit board
JPS59145594A (en) * 1983-02-09 1984-08-21 Homofuaaberu Design Kk Method of forming printed circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534595A (en) * 1978-08-30 1980-03-11 Texas Instruments Inc Microelectronic semiconductor switching circuit
JPS5848988A (en) * 1981-09-18 1983-03-23 Sumitomo Electric Industries Method of producing printed circuit board
JPS58137291A (en) * 1982-02-09 1983-08-15 Suwa Seikosha Kk Method of producing printed circuit board
JPS59145594A (en) * 1983-02-09 1984-08-21 Homofuaaberu Design Kk Method of forming printed circuit

Similar Documents

Publication Publication Date Title
JPS6072663A (en) Connecting method of low melting metallic ball
JPS607149A (en) Manufacture of semiconductor device
JPS6449302A (en) Film antenna
JPH03178152A (en) Molded ic and its manufacture
JPH01300590A (en) Method of forming pattern on multilayer printed board
JPS61222715A (en) Manufacture of resin molded body
JPS6452629A (en) Production of glass product
JPS61222151A (en) Manufacture of printed wiring substrate for mounting semiconductor
JPS63284886A (en) Forming method of metallic pattern
JPH01136124A (en) Manufacture of electrode substrate for liquid crystal display panel
JPH01137691A (en) Manufacture of printed wiring board device
JPH03203341A (en) Substrate possessing microelectrode and it production
JPH03181191A (en) Printed wiring board
JPH03229484A (en) Manufacture of printed wiring board
JPH0387030A (en) Multilayer interconnection
JPH02228093A (en) Manufacture of printed wiring board with plated conductor
JPH0233997A (en) Manufacture of laminate plate of multilayer substrate
JPS59155128A (en) Manufacture of semiconductor device
JPH02228632A (en) Electrooptic device and its production
JPS62156847A (en) Multilayer printed circuit board and manufacture thereof
JPS63271958A (en) Formation of multilayer interconnection
JPH0345398A (en) Printed circuit board for ic card
JPS59152407A (en) Manufacture of multilayered interference film filter
JPH04263490A (en) Manufacture of thin film circuit
JPS5567158A (en) Inductor device of hybrid integrated circuit