JPH0189791U - - Google Patents

Info

Publication number
JPH0189791U
JPH0189791U JP18621087U JP18621087U JPH0189791U JP H0189791 U JPH0189791 U JP H0189791U JP 18621087 U JP18621087 U JP 18621087U JP 18621087 U JP18621087 U JP 18621087U JP H0189791 U JPH0189791 U JP H0189791U
Authority
JP
Japan
Prior art keywords
mounting structure
module mounting
motherboard
modules
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18621087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18621087U priority Critical patent/JPH0189791U/ja
Publication of JPH0189791U publication Critical patent/JPH0189791U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す図、第2図は従
来例を示す図である。 図において、2は素子、3a,3b、……はモ
ジユール、4はマザーボード、5はコネクタ、1
0は放熱板、10a,10bは押え板を示す。
FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing a conventional example. In the figure, 2 is an element, 3a, 3b, ... are modules, 4 is a motherboard, 5 is a connector, 1
0 is a heat sink, and 10a and 10b are presser plates.

Claims (1)

【実用新案登録請求の範囲】 複数のモジユール3a,3b、……をコネクタ
5によりマザーボード4に垂直に実装するモジユ
ール実装構造において、 放熱板10と一体的な押え板10a,10bを
該モジユール3a,3b、……の素子2をはさみ
該放熱板10を該マザーボード4に固定すること
を特徴とするモジユール実装構造。
[Scope of Claim for Utility Model Registration] In a module mounting structure in which a plurality of modules 3a, 3b, . A module mounting structure characterized in that the heat sink 10 is fixed to the motherboard 4 by sandwiching the elements 2 of 3b, . . . .
JP18621087U 1987-12-07 1987-12-07 Pending JPH0189791U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18621087U JPH0189791U (en) 1987-12-07 1987-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18621087U JPH0189791U (en) 1987-12-07 1987-12-07

Publications (1)

Publication Number Publication Date
JPH0189791U true JPH0189791U (en) 1989-06-13

Family

ID=31477450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18621087U Pending JPH0189791U (en) 1987-12-07 1987-12-07

Country Status (1)

Country Link
JP (1) JPH0189791U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003022024A1 (en) * 2001-08-30 2003-03-13 Fujitsu Limited Printed board unit and electronic apparatus
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771509B2 (en) 1992-05-20 2004-08-03 Seiko Epson Corporation Cartridge for electronic devices
US6845014B2 (en) 1992-05-20 2005-01-18 Seiko Epson Corporation Cartridge for electronic devices
WO2003022024A1 (en) * 2001-08-30 2003-03-13 Fujitsu Limited Printed board unit and electronic apparatus

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