JPH0189741U - - Google Patents
Info
- Publication number
- JPH0189741U JPH0189741U JP1987185475U JP18547587U JPH0189741U JP H0189741 U JPH0189741 U JP H0189741U JP 1987185475 U JP1987185475 U JP 1987185475U JP 18547587 U JP18547587 U JP 18547587U JP H0189741 U JPH0189741 U JP H0189741U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- protective film
- operating section
- functional operating
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987185475U JPH0189741U (US07923587-20110412-C00001.png) | 1987-12-04 | 1987-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987185475U JPH0189741U (US07923587-20110412-C00001.png) | 1987-12-04 | 1987-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189741U true JPH0189741U (US07923587-20110412-C00001.png) | 1989-06-13 |
Family
ID=31476790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987185475U Pending JPH0189741U (US07923587-20110412-C00001.png) | 1987-12-04 | 1987-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189741U (US07923587-20110412-C00001.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0444397A (ja) * | 1990-06-11 | 1992-02-14 | Alps Electric Co Ltd | 電子部品の製造方法 |
| JPH08186109A (ja) * | 1994-12-28 | 1996-07-16 | Nec Corp | 半導体集積回路装置 |
-
1987
- 1987-12-04 JP JP1987185475U patent/JPH0189741U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0444397A (ja) * | 1990-06-11 | 1992-02-14 | Alps Electric Co Ltd | 電子部品の製造方法 |
| JPH08186109A (ja) * | 1994-12-28 | 1996-07-16 | Nec Corp | 半導体集積回路装置 |
