JPH0180972U - - Google Patents

Info

Publication number

JPH0180972U

JPH0180972U JP1987177911U JP17791187U JPH0180972U JP H0180972 U JPH0180972 U JP H0180972U JP 1987177911 U JP1987177911 U JP 1987177911U JP 17791187 U JP17791187 U JP 17791187U JP H0180972 U JPH0180972 U JP H0180972U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

composite

rigid

flexible printed

Prior art date

1987-11-20

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
• 239000002131 composite material Substances 0.000 claims 2
• 238000010030 laminating Methods 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
• 229910052802 copper Inorganic materials 0.000 description 2
• 239000010949 copper Substances 0.000 description 2
• 239000011889 copper foil Substances 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1