JPH0176040U - - Google Patents
Info
- Publication number
- JPH0176040U JPH0176040U JP17183287U JP17183287U JPH0176040U JP H0176040 U JPH0176040 U JP H0176040U JP 17183287 U JP17183287 U JP 17183287U JP 17183287 U JP17183287 U JP 17183287U JP H0176040 U JPH0176040 U JP H0176040U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pellet
- semiconductor device
- mounting part
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17183287U JPH0176040U (US06168655-20010102-C00055.png) | 1987-11-09 | 1987-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17183287U JPH0176040U (US06168655-20010102-C00055.png) | 1987-11-09 | 1987-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0176040U true JPH0176040U (US06168655-20010102-C00055.png) | 1989-05-23 |
Family
ID=31463837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17183287U Pending JPH0176040U (US06168655-20010102-C00055.png) | 1987-11-09 | 1987-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0176040U (US06168655-20010102-C00055.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112017002421T5 (de) | 2016-05-12 | 2019-01-24 | Mitsubishi Electric Corporation | Halbleitereinheit und verfahren zum herstellen einer halbleitereinheit |
-
1987
- 1987-11-09 JP JP17183287U patent/JPH0176040U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112017002421T5 (de) | 2016-05-12 | 2019-01-24 | Mitsubishi Electric Corporation | Halbleitereinheit und verfahren zum herstellen einer halbleitereinheit |
| US10741413B2 (en) | 2016-05-12 | 2020-08-11 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing semiconductor device |
