JPH0167746U - - Google Patents
Info
- Publication number
- JPH0167746U JPH0167746U JP16290987U JP16290987U JPH0167746U JP H0167746 U JPH0167746 U JP H0167746U JP 16290987 U JP16290987 U JP 16290987U JP 16290987 U JP16290987 U JP 16290987U JP H0167746 U JPH0167746 U JP H0167746U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- wiring board
- flip
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 239000011241 protective layer Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16290987U JPH0167746U (US06272168-20010807-M00014.png) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16290987U JPH0167746U (US06272168-20010807-M00014.png) | 1987-10-23 | 1987-10-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0167746U true JPH0167746U (US06272168-20010807-M00014.png) | 1989-05-01 |
Family
ID=31447164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16290987U Pending JPH0167746U (US06272168-20010807-M00014.png) | 1987-10-23 | 1987-10-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0167746U (US06272168-20010807-M00014.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04282836A (ja) * | 1990-10-22 | 1992-10-07 | Internatl Business Mach Corp <Ibm> | 薄膜積層体における障壁の改良 |
-
1987
- 1987-10-23 JP JP16290987U patent/JPH0167746U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04282836A (ja) * | 1990-10-22 | 1992-10-07 | Internatl Business Mach Corp <Ibm> | 薄膜積層体における障壁の改良 |