JPH0160572U - - Google Patents

Info

Publication number
JPH0160572U
JPH0160572U JP15700587U JP15700587U JPH0160572U JP H0160572 U JPH0160572 U JP H0160572U JP 15700587 U JP15700587 U JP 15700587U JP 15700587 U JP15700587 U JP 15700587U JP H0160572 U JPH0160572 U JP H0160572U
Authority
JP
Japan
Prior art keywords
board
sub
main board
chip component
long hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15700587U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15700587U priority Critical patent/JPH0160572U/ja
Publication of JPH0160572U publication Critical patent/JPH0160572U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図乃至第５図は本考案の一実施例に関し、
第１図は側面図、第２図は上面図、第３図はメイ
ン基板を示す図、第４図はサブ基板を示す図、第
５図は誤挿入時の状態を示す図である。第６図、
第７図、第８図は夫々従来のサブ基板を示す図で
ある。 １６…メイン基板、１２…サブ基板、Ａ…挿入
部分、１８…長孔、２２…チツプ部品、２０…切
欠部。

Claims (1)

  1. 【実用新案登録請求の範囲】 メイン基板に略垂直に取り付けられるサブ基板
    と、 前記メイン基板に設けられ前記サブ基板の挿入
    部分が挿入される長孔と、 前記サブ基板の挿入部分に設けられたチツプ部
    品と、 このチツプ部品の挿入を許容するために前記長
    孔に設けられた切欠部とを、 備えることを特徴とするサブ基板のメイン基板へ
    の誤装着防止構造。
JP15700587U 1987-10-14 1987-10-14 Pending JPH0160572U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15700587U JPH0160572U (ja) 1987-10-14 1987-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15700587U JPH0160572U (ja) 1987-10-14 1987-10-14

Publications (1)

Publication Number Publication Date
JPH0160572U true JPH0160572U (ja) 1989-04-17

Family

ID=31436061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15700587U Pending JPH0160572U (ja) 1987-10-14 1987-10-14

Country Status (1)

Country Link
JP (1) JPH0160572U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009188138A (ja) * 2008-02-05 2009-08-20 Yamatake Corp 子基板の取付構造
US9781831B2 (en) 2014-03-27 2017-10-03 Nec Corporation Electronic device including module accommodating components disposed on substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009188138A (ja) * 2008-02-05 2009-08-20 Yamatake Corp 子基板の取付構造
US9781831B2 (en) 2014-03-27 2017-10-03 Nec Corporation Electronic device including module accommodating components disposed on substrate

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