JPH0160551U - - Google Patents

Info

Publication number

JPH0160551U

JPH0160551U JP15526687U JP15526687U JPH0160551U JP H0160551 U JPH0160551 U JP H0160551U JP 15526687 U JP15526687 U JP 15526687U JP 15526687 U JP15526687 U JP 15526687U JP H0160551 U JPH0160551 U JP H0160551U

Authority

JP

Japan

Prior art keywords

hole

semiconductor device

terminal pin

narrowed

brazing

Prior art date

1987-10-09

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 4
• 238000005219 brazing Methods 0.000 claims description 3
• 239000000919 ceramic Substances 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims description 3
• 239000000463 material Substances 0.000 claims description 2
• 239000004020 conductor Substances 0.000 claims 1
• 238000007747 plating Methods 0.000 description 1

Cited By (1)