JPH0136994B2 - - Google Patents

Info

Publication number
JPH0136994B2
JPH0136994B2 JP12706083A JP12706083A JPH0136994B2 JP H0136994 B2 JPH0136994 B2 JP H0136994B2 JP 12706083 A JP12706083 A JP 12706083A JP 12706083 A JP12706083 A JP 12706083A JP H0136994 B2 JPH0136994 B2 JP H0136994B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12706083A
Other versions
JPS59114892A (en
Inventor
Paoretsutei Furanku
Atsushurei Shubaato Suchiibun
Original Assignee
Intaanashonaru Bijinesu Mashiinzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US06/448,574 priority Critical patent/US4477484A/en
Application filed by Intaanashonaru Bijinesu Mashiinzu Corp filed Critical Intaanashonaru Bijinesu Mashiinzu Corp
Publication of JPS59114892A publication Critical patent/JPS59114892A/ja
Publication of JPH0136994B2 publication Critical patent/JPH0136994B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating the impedance of the material
    • G01N27/04Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating the impedance of the material by investigating resistance
    • G01N27/041Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating the impedance of the material by investigating resistance of a solid body
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416Systems
    • G01N27/42Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/422Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12361All metal or with adjacent metals having aperture or cut
JP12706083A 1982-12-10 1983-07-14 Expired JPH0136994B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US06/448,574 US4477484A (en) 1982-12-10 1982-12-10 Electroless plating monitor

Publications (2)

Publication Number Publication Date
JPS59114892A JPS59114892A (en) 1984-07-03
JPH0136994B2 true JPH0136994B2 (ja) 1989-08-03

Family

ID=23780856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12706083A Expired JPH0136994B2 (ja) 1982-12-10 1983-07-14

Country Status (4)

Country Link
US (1) US4477484A (ja)
EP (1) EP0113395B1 (ja)
JP (1) JPH0136994B2 (ja)
DE (1) DE3381648D1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8333355D0 (en) * 1983-12-14 1984-01-18 Rolls Royce Metallic coating layer thickness
EP0194103B1 (en) * 1985-02-28 1990-02-07 C. UYEMURA & CO LTD Method and apparatus for detecting start of electroless plating
US4626446A (en) * 1985-06-03 1986-12-02 International Business Machines Corporation Electroless plating bath monitor
US4755744A (en) * 1986-01-21 1988-07-05 Rohrback Corporation Plated sensor for monitoring corrosion or electroplating
US4820643A (en) * 1986-03-10 1989-04-11 International Business Machines Corporation Process for determining the activity of a palladium-tin catalyst
US4756923A (en) * 1986-07-28 1988-07-12 International Business Machines Corp. Method of controlling resistivity of plated metal and product formed thereby
US4882537A (en) * 1988-05-09 1989-11-21 Rohrback Cosasco Systems, Inc. Method and apparatus for reducing interference in an electrical resistance probe during electrolytic plating
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
JPH05211384A (ja) * 1991-11-20 1993-08-20 Nec Corp 印刷配線板のめっき方法
DE19736113A1 (de) * 1997-08-21 1999-03-18 Pac Tech Gmbh Verfahren und Vorrichtung zur Ermittlung einer Kenngröße für ein Metallisierungsbad
US6972444B1 (en) * 2003-08-06 2005-12-06 National Semiconductor Corporation Wafer with saw street guide
FR2892595B1 (fr) * 2005-10-21 2010-11-05 Siemens Vdo Automotive PROCESS FOR MONITORING THE QUALITY OF THE METALLIZATION OF A PRINTED CIRCUIT AND A PRINTED CIRCUIT
JP4923950B2 (ja) * 2006-10-26 2012-04-25 パナソニック株式会社 洗濯機
US20090199141A1 (en) * 2008-02-06 2009-08-06 Anritsu Company Systems and methods for prototyping and testing electrical circuits in near real-time
US9201015B2 (en) 2011-07-14 2015-12-01 International Business Machines Corporation Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component
CN103255398A (zh) * 2013-05-24 2013-08-21 无锡市崇安区科技创业服务中心 一种化学镀镍监测检测系统
CN105050318B (zh) * 2015-07-06 2017-11-28 江苏本川智能电路科技股份有限公司 具有埋阻测试区的pcb板结构及其测试方法
CN105758891B (zh) * 2015-07-17 2019-03-05 生益电子股份有限公司 一种pcb的性能检测方法
US10381276B2 (en) * 2015-12-17 2019-08-13 International Business Machines Corporation Test cell for laminate and method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3134690A (en) * 1960-02-09 1964-05-26 Eriksson Lars Erik Method for deposition of a copper layer on a non-conductive material
US3400014A (en) * 1964-09-15 1968-09-03 Ibm Process control of indium sheet film memories
US3936738A (en) * 1974-01-02 1976-02-03 Drexelbrook Controls, Inc. Method of and apparatus for measuring the amount of coating material applied to substrates
DE2410927C3 (ja) * 1974-03-05 1978-11-16 Kollmorgen Corp., Glen Cove, N.Y. (V.St.A.)
US4019129A (en) * 1975-06-02 1977-04-19 Bell Telephone Laboratories, Incorporated Metallic plating testing apparatus
DE3034175C2 (ja) * 1980-09-11 1987-12-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De
JPS58104166A (en) * 1981-12-14 1983-06-21 Oki Electric Ind Co Ltd Continuous measuring method for thickness of electroless plating

Also Published As

Publication number Publication date
EP0113395B1 (en) 1990-06-13
JPS59114892A (en) 1984-07-03
DE3381648D1 (de) 1990-07-19
US4477484A (en) 1984-10-16
EP0113395A2 (en) 1984-07-18
EP0113395A3 (en) 1987-09-23

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