JPH01295428A - Resin hardening apparatus for die bonder - Google Patents

Abstract

PURPOSE:To prevent the occurrence of dispersion in thermal hardening of resin, by inclining straightening vanes at the sides of frame outputting and inputting ports outward, constituting a heat block with one heat block comprising a material having high heat conductivity, and providing a gas feeding path which is communicated to a pipe in said heat block. CONSTITUTION:Straightening vanes 34 at the sides of frame outputting and inputting ports 3 and 2 among straightening vanes 34 are inclined outward. A heat block 31 is constituted with one heat block 31 comprising a material having high heat conductivity. A gas feeding path which is communicated to a pipe 35 is provided in the heat block 31. Therefore, heating distribution state in the heat block 31 comprising the material having the high heat conductivity becomes uniform. Intrusion of air into a heating furnace can be blocked with oxidation preventing gas which is blown to the frame outputting and inputting ports 2 and 3. The oxidation preventing gas which is supplied into the gas feeding path 35 can be heated with the heat block 31. In this way, the occurrence of dispersion in thermal hardening of bonding resin can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin curing device for a die bonder used in the manufacturing process of semiconductor devices.

[Conventional technology]

Conventionally, a resin curing device for this type of die bonder is constructed as shown in FIGS. 2 and 3.

To explain this based on the same figure, in the same figure, the reference numeral 1 denotes a heating furnace having a frame inlet 2 and a frame outlet 3, 4 is a heating furnace provided in this heating furnace, and an IC lead frame 5 and an IC chip. (Not shown) Four SUS heat blocks 7 are installed above these heat blocks 4 at a predetermined interval and are equipped with N2 for oxidation prevention.
a plurality of pipes each having an outlet 8 that blows out gas downward;
Reference numeral 9 denotes a rectifying plate that is vertically installed between two adjacent pipes among these pipes 7 and rectifies the Nt gas. Further, 10 is a hot air generator that heats the NZ gas supplied into the pipe 7, 11 is a manifold, 12 and 1
3 is a lower heat insulating plate and a side heat insulating plate, 14 is a cover, 15 is a lid body, and 16 and 17 are an inloader and an outloader. The pipe 7 is composed of an inner vibrator 7a that supplies N2 gas into the heating furnace 1, and an outer vibrator 7b that prevents air from flowing into the heating furnace 1.

In the resin curing device for die bonder configured in this way, IC chips (
The IC lead frame 5 having a transport device (not shown)
(not shown), they are sequentially conveyed from the inloader 16 through the heating furnace 1 to the outloader 17. At this time,
The IC lead frame 5 is a heater block 4 in the heating furnace 1.
The resin for bonding the chip described above is thermally cured.

[Problem to be solved by the invention]

By the way, in the conventional resin curing device for die bonder, the heat block 4 is formed of SUS material, so the thermal conductivity is extremely low, and the heat distribution state is uneven in the same heat block 4. There was a problem that variations occurred in heat curing. In addition, since the NZ gas is blown downward from the outlet 8 of the pipe 7, a large amount of NZ gas is required to prevent air from entering the heating furnace 1, resulting in a problem of poor gas supply efficiency. There was also. That is, the N2 gas blown out from the air outlet 8 collides with the heat block 4, which tends to cause turbulence. Furthermore, since a dedicated hot air generator 10 is required to heat the N2 gas, there is an inconvenience that the cost increases.

The present invention has been made in view of these circumstances, and can prevent variations in thermosetting of resin, improve gas supply efficiency, and reduce costs. The present invention provides a resin curing device for a die bonder.

[Means to solve the problem]

A resin curing device for a die bonder according to the present invention includes 1 a heating furnace having a frame inlet and a frame outlet, and a heating furnace installed in the heating furnace to heat an adhesive resin interposed between an ICIJ-de frame and an rc chip. A heat block to be cured, a plurality of pipes provided above the heat block and having blow-off ports for blowing out anti-oxidation gas toward the frame carrying-out entrance, and each of these pipes between two adjacent pipes. A rectifying plate is provided to rectify the gas for preventing oxidation, and among these rectifying plates, the rectifying plate on the side of the frame loading/unloading entrance is tilted outward, and the heat block is made of a material with high thermal conductivity. This heat block is provided with a gas supply passage communicating with the pipe.

[For production]

In the present invention, the heating distribution state of the heat block made of a material with high thermal conductivity becomes uniform, and the infiltration of air into the heating furnace is prevented by the oxidation-preventing gas blown toward the frame loading/unloading entrance. Furthermore, the anti-oxidation gas supplied to the gas supply passage can be heated by the heat block.

〔Example〕

EMBODIMENT OF THE INVENTION Hereinafter, the structure etc. of this invention will be explained in detail by the Example shown in the figure.

FIG. 1 (al and (bl) are an exploded perspective view and a cross-sectional view taken along the line bb--b, respectively, showing a resin curing device for a die bonder according to the present invention.
In this figure, the same members as in FIGS. 2 and 3 are designated by the same reference numerals, and detailed explanations will be omitted. In the figure, the heat block indicated by the reference numeral 31 is constituted by one heat block made of a material having high thermal conductivity, such as copper. Reference numeral 32 denotes four pipes having blow-off ports 33 for blowing out anti-oxidation NZ gas toward the frame carry-in port 2 and the frame carry-out port 3, and are provided above the heat block 3I. 34 is N! It is a rectifying plate that rectifies gas, and each of the pipes 32 is provided between two adjacent pipes 32.

Among these current plates 34, those on the side of the frame loading port 2 and the frame loading port 3 are inclined outward. 3
5 is N which communicates with the pipe 32 and the pipe 7b.
This pipe serves as a passageway for supplying t-gas, and is provided in the heat block 31. This vibrator 35 is divided into a pipe 32 and a pipe 7b by the manifold 11.

In the resin curing device for die bonder configured as described above, the copper heat block 31 makes the heat distribution state of the heat block 31 uniform.

Furthermore, the N2 gas blown toward the frame loading port 2 and the frame loading port 3 can prevent air from entering the heating furnace 1, so N! The amount of gas supplied can be reduced. Furthermore, a pipe 35 for gas supply
Since the N2 gas supplied to the heating block 31 can be heated by the heat block 31, a dedicated heating device such as a hot air generator is not required.

Note that the number of pipes, etc. in the present invention is not limited to the embodiment, and may be changed as appropriate depending on the scale of the heating furnace, etc., for example.

Incidentally, frame conveyance by the resin curing device in the present invention is performed in the same manner as in the conventional device. That is, an IC lead frame 5 having an IC chip (not shown) bonded with an adhesive resin is sequentially transported from an inloader 16 through the heating furnace 1 to an outloader 17 by a transport device (not shown). Ru. At this time, heat block 3
1 heats the IC lead frame 5, so that the adhesive resin is thermoset. Here, heat block 3I
Therefore, N2 gas is heated and passed from pipe 35 to pipe 32.
7b. In addition, the air outlet 33 is controlled by the rectifying plate 34 near the frame loading port 2 and the frame loading port 3.
The Nt gas blown out becomes a laminar flow.

〔Effect of the invention〕

As explained above, according to the present invention, since the heat block is constituted by one heat block made of a material with high thermal conductivity, the heating distribution state of the heat block becomes uniform, and there is no variation in the thermosetting of the adhesive resin. can be prevented from occurring. Further, a plurality of pipes each having an outlet for blowing out anti-oxidation gas toward the frame carrying-in/out port, and a rectifying plate provided between two adjacent pipes to rectify the gas, Of these rectifying plates, the one on the side of the frame carrying-in/out port is inclined outward, so that it is possible to prevent air from entering the heating furnace, and it is also possible to increase the rate of supply of gas for preventing oxidation. Furthermore, since the heat block is provided with a gas supply passage that communicates with the pipe, there is no need for a dedicated hot air generator that was previously required, which has the advantage of reducing costs.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 fa) and crest) are an exploded perspective view and a sectional view taken along the line b-b of the resin curing device for a die bonder according to the present invention;
FIGS. 2 and 3 are an exploded perspective view and a sectional view taken along the line mm of the conventional resin curing device for a die bonder. 1... Heating furnace, 2... Frame entrance, 3...
...Frame export port, 5...IC lead frame,
7b...pipe, 31...heat block, 3
2... Pipe, 34... Current plate, 35...
pipe. Agent Masuo Oiwa Figure 1 Jb28hehefu Figure 2

Claims (1)

[Claims] A heating furnace having a frame loading port and a frame loading port, and an IC lead frame and an IC installed in the heating furnace.
A heat block for thermally curing adhesive resin interposed between chips; a plurality of pipes provided above the heat block having blow-off ports for blowing anti-oxidation gas toward the frame carrying-out port; and these pipes. Each of these is provided with a rectifying plate installed between two adjacent pipes to rectify the gas, and among these rectifying plates, the rectifying plate on the side of the frame loading/unloading entrance is inclined outward to make the heat block heat conductive. 1. A resin curing device for a die bonder, comprising one heat block made of a material with a high heat exchange rate, and the heat block is provided with a gas supply passage communicating with the pipe.