JPH01289259A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPH01289259A
JPH01289259A JP12093488A JP12093488A JPH01289259A JP H01289259 A JPH01289259 A JP H01289259A JP 12093488 A JP12093488 A JP 12093488A JP 12093488 A JP12093488 A JP 12093488A JP H01289259 A JPH01289259 A JP H01289259A
Authority
JP
Japan
Prior art keywords
solder
die pad
die
semiconductor
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12093488A
Other languages
English (en)
Inventor
Hiroaki Kamiya
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12093488A priority Critical patent/JPH01289259A/ja
Publication of JPH01289259A publication Critical patent/JPH01289259A/ja
Pending legal-status Critical Current

Links

JP12093488A 1988-05-17 1988-05-17 Manufacture of semiconductor device Pending JPH01289259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12093488A JPH01289259A (en) 1988-05-17 1988-05-17 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12093488A JPH01289259A (en) 1988-05-17 1988-05-17 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPH01289259A true JPH01289259A (en) 1989-11-21

Family

ID=14798586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12093488A Pending JPH01289259A (en) 1988-05-17 1988-05-17 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPH01289259A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169804A (en) * 1990-09-06 1992-12-08 Siemens Aktiengesellschaft Method for fastening a semiconductor, body provided with at least one semiconductor component to a substrate
DE4318727A1 (de) * 1992-06-05 1993-12-09 Mitsubishi Electric Corp Halbleitervorrichtung mit LOC-Struktur sowie dazugehöriges Herstellungsverfahren und dazugehöriger Zuführungsdraht-Rahmen

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169804A (en) * 1990-09-06 1992-12-08 Siemens Aktiengesellschaft Method for fastening a semiconductor, body provided with at least one semiconductor component to a substrate
DE4318727A1 (de) * 1992-06-05 1993-12-09 Mitsubishi Electric Corp Halbleitervorrichtung mit LOC-Struktur sowie dazugehöriges Herstellungsverfahren und dazugehöriger Zuführungsdraht-Rahmen
DE4318727C2 (de) * 1992-06-05 1998-03-12 Mitsubishi Electric Corp Verfahren zur Herstellung einer Halbleitervorrichtung mit LOC-Struktur sowie dazugehöriger Zuführungsdrahtrahmen

Similar Documents

Publication Publication Date Title
JPH01289259A (en) Manufacture of semiconductor device
JPH02125651A (en) Lead frame
JPH02256251A (en) Semiconductor device and its manufacture
JPH02146757A (en) Semiconductor device
JPS63117450A (en) Manufacture of semiconductor device
JPH02144954A (en) Semiconductor device
JPH01198038A (en) Semiconductor manufacturing apparatus
JPS5737842A (en) Device for gang bonding
JPH03120844A (en) Manufacture of semiconductor device and its equipment
JPS6049637A (en) Mounting method of semiconductor substrate
JPH0284745A (en) Semiconductor manufacturing device
JPS6386444A (en) Semiconductor device
JPS62269323A (en) Mounting process and device of semiconductor chip
JPH01183827A (en) Method and device for applying paste in die bonder
JPS6393119A (en) Manufacture of semiconductor device
JPS62158339A (en) Adhesion method of bonding leads to ic chip in semiconductor device
JPH03127842A (en) Wire bonding method and equipment
JPH03136254A (en) Die bonding
JPH01184840A (en) Wireless bonding and equipment therefor
JPS63221970A (en) Polishing method for semiconductor wafer
JPS57136353A (en) Manufacture of semiconductor device
JPS5630732A (en) Mounting method of semiconductor pellet
JPS63117433A (en) Mounting of semiconductor chip
JPH03289151A (en) Bonding head for thermocompression bonding
JPH03123042A (en) Semiconductor device