JPH01289187A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH01289187A JPH01289187A JP11947288A JP11947288A JPH01289187A JP H01289187 A JPH01289187 A JP H01289187A JP 11947288 A JP11947288 A JP 11947288A JP 11947288 A JP11947288 A JP 11947288A JP H01289187 A JPH01289187 A JP H01289187A
- Authority
- JP
- Japan
- Prior art keywords
- insulating board
- printed wiring
- board
- wiring board
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 239000003365 glass fiber Substances 0.000 claims abstract description 6
- 230000009477 glass transition Effects 0.000 claims abstract description 6
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 6
- 229920000728 polyester Polymers 0.000 claims abstract description 5
- 239000000835 fiber Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 13
- 239000011889 copper foil Substances 0.000 abstract description 13
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 239000002390 adhesive tape Substances 0.000 abstract description 7
- 238000005530 etching Methods 0.000 abstract description 5
- 238000003780 insertion Methods 0.000 abstract description 5
- 230000037431 insertion Effects 0.000 abstract description 5
- 230000001681 protective effect Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 230000000717 retained effect Effects 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント配線板に関し、特に任意の箇所にフ
レキシブル性をもなせることができ、部品取付性にも優
れたプリント配線板に関するものである。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a printed wiring board, and particularly to a printed wiring board that can be flexible at any location and has excellent component mounting properties. It is.
（従来の技術）
従来のフレキシブルプリント配線板においては、ポリイ
ミド樹脂、ポリイミドアミド樹脂、ポリエステル樹脂な
どを用い、これらの熱可塑性樹脂に銅箔を貼り付けたフ
レキシブル基材を使用していた。しかし、自重で曲がる
から、取り扱いが難しく、導電パターンを形成する工程
等で取扱いが器しかった。(Prior Art) Conventional flexible printed wiring boards use flexible base materials made of polyimide resin, polyimide amide resin, polyester resin, etc., with copper foil pasted on these thermoplastic resins. However, it is difficult to handle because it bends under its own weight, and it is cumbersome to handle during processes such as forming conductive patterns.
最近、ポリエステル繊維とガラス繊維より成る不織布に
ガラス転移点が低いエポキシ樹脂を含浸させて絶縁板を
形成し、この絶縁板に銅箔を貼り付けてなるフレキシブ
ル基材が開発された。このフレキシブル基材により取り
扱いは改善されたが、フレキシブル性を保つために、絶
縁層の肉厚は０．３８間から０．７６鴫である。Recently, a flexible base material has been developed in which an insulating plate is formed by impregnating a nonwoven fabric made of polyester fiber and glass fiber with an epoxy resin having a low glass transition point, and a copper foil is attached to this insulating plate. This flexible substrate improves handling, but to maintain flexibility, the thickness of the insulating layer is between 0.38 and 0.76 mm.
（発明が解決しようとする課題）
前述した従来のフレキシブルプリント配線板には、絶縁
層の肉厚が０．３８ｍから０．７６ｍｍとなっているの
で、従来のプリント配線板の絶縁板の絶縁層の肉厚の１
．６ ｍに調整された部品挿入、半田付け等の自動化設
備をすべて再調整する手間がかかり、また、部品の自動
挿入時、挿入圧力によりプリント配線板が変形してしま
うという問題点がある。(Problems to be Solved by the Invention) In the conventional flexible printed wiring board described above, the thickness of the insulating layer is from 0.38 m to 0.76 mm. thickness of 1
．． It takes time and effort to readjust all automated equipment for parts insertion, soldering, etc. that has been adjusted to 6 m, and there is also the problem that the printed wiring board is deformed by the insertion pressure when parts are automatically inserted.
（課題を解決するための手段）
前述の課題を解決するために本発明が提供する手段は、
ポリエステル繊維及びガラス繊維からなる不織布にガラ
ス転移点が低いエポキシ樹脂を含浸させてなるフレキシ
ブル絶縁板と、このフレキシブル絶縁板の一面に形成し
てある導通パターンとからなるプリント配線板において
、前記フレキシブル絶縁板の他面に折曲げ部分を除いて
硬質絶縁板が貼着してあることを特徴とする。(Means for Solving the Problems) Means provided by the present invention to solve the above-mentioned problems are as follows:
A printed wiring board comprising a flexible insulating board made by impregnating a nonwoven fabric made of polyester fibers and glass fibers with an epoxy resin having a low glass transition point, and a conductive pattern formed on one surface of the flexible insulating board. It is characterized in that a hard insulating plate is attached to the other side of the plate except for the bent portion.
（実施例） 次に、本発明について図面を参照して説明する。(Example) Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例のプリント配線板を示す斜視
図、第２図はそのプリント配線板に電子部を実装した状
態を示す側面図、第３図は第２図のプリント配線板を折
り曲げた状態を示す側面図、第４図（ａ）〜（ｆ）は第
１図のプリント配線板の製造方法を説明するための断面
図、第５図（ａ）〜（ｆ）は第４図の製造方法以外の製
造方法を説明するための断面図である。Fig. 1 is a perspective view showing a printed wiring board according to an embodiment of the present invention, Fig. 2 is a side view showing a state in which electronic parts are mounted on the printed wiring board, and Fig. 3 is the printed wiring board of Fig. 2. 4(a) to 4(f) are cross-sectional views for explaining the manufacturing method of the printed wiring board of FIG. FIG. 4 is a cross-sectional view for explaining a manufacturing method other than the manufacturing method shown in FIG. 4;
図中、１は硬質絶縁板、２は両面接着テープ、３はフレ
キシブル絶縁板、４は導体パターン、５はランド、６は
貫通孔、７は折曲げ部、８は電子部品、９は半田、１０
はソルダーレジスト層、１１はメイン部分、１２はサブ
部分、１３は保護紙、１４は銅箔、１５は接着剤である
。In the figure, 1 is a hard insulating board, 2 is a double-sided adhesive tape, 3 is a flexible insulating board, 4 is a conductor pattern, 5 is a land, 6 is a through hole, 7 is a bent part, 8 is an electronic component, 9 is solder, 10
1 is a solder resist layer, 11 is a main portion, 12 is a sub portion, 13 is a protective paper, 14 is a copper foil, and 15 is an adhesive.
硬質絶縁板１は、紙基材フェノール樹脂板、ガラス繊維
基材エポキシ樹脂板などの熱硬化性樹脂板からなる。The hard insulating board 1 is made of a thermosetting resin board such as a paper-based phenol resin board or a glass fiber-based epoxy resin board.
この硬質絶縁板１の上面の全体に、両面接着テープ２あ
るいは接着剤によって、ポリエステル繊維とガラス繊維
より成る不織布にガラス転移点が低いエポキシ樹脂を含
浸させてなるフレキシブル絶縁板３が、貼り付けである
。A flexible insulating board 3, which is made by impregnating a nonwoven fabric made of polyester fibers and glass fibers with an epoxy resin having a low glass transition point, is pasted onto the entire upper surface of the hard insulating board 1 using double-sided adhesive tape 2 or an adhesive. be.
このフレキシブル絶縁板３の片面に銅箔などからなる導
体パターン４が形成され、導体パターン４のランド５に
はフレキシブル絶縁板３、硬質絶縁板１を貫通する部品
取付用の貫通孔６が形成されでいる。A conductive pattern 4 made of copper foil or the like is formed on one side of the flexible insulating plate 3, and a through hole 6 for attaching components that penetrates through the flexible insulating plate 3 and the hard insulating plate 1 is formed in the land 5 of the conductive pattern 4. I'm here.
硬質絶縁板１は、フレキシブル絶縁板３の折曲げ部分以
外に貼り付けられている。The hard insulating plate 1 is attached to a portion of the flexible insulating plate 3 other than the bent portion.
このような構成のプリント配線板において、第２図に示
すように、部品取付用の貫通孔６に電子部品８を組み込
み、半田９でランド５とリード線を接続した後、折り曲
げ可能な曲率半径Ｒの丸棒１６等を折曲げ部７に押し当
て、丸棒１６の曲面に沿わせて曲げることにより、折曲
げ部７によって第３図に示すようにメイン部分１１とサ
ブ部分１２に分けられ、メイン部分１１に対してサブ部
分１２を折曲げ部７で自由に折り曲げさせることが出来
る。In the printed wiring board having such a configuration, as shown in FIG. 2, after the electronic component 8 is assembled into the through hole 6 for component mounting and the land 5 and the lead wire are connected with solder 9, the bendable radius of curvature is set. By pressing the R round bar 16 etc. against the bent part 7 and bending it along the curved surface of the round bar 16, the bent part 7 separates the main part 11 and the sub part 12 as shown in FIG. , the sub portion 12 can be freely bent with respect to the main portion 11 at the bending portion 7.
次に、本実施例のプリント配線板の製造方法について説
明する。Next, a method for manufacturing the printed wiring board of this example will be explained.
まず、第４図を参照して説明すると、第４図（ａ）に示
すように、硬質絶縁板１の上面に耐熱性を有する両面接
着テープ２をその外側に保護紙１３を残した状態で３０
〜８０℃に加温された熱ゴムローラにて全面に接着する
。First, referring to FIG. 4, as shown in FIG. 4(a), a heat-resistant double-sided adhesive tape 2 is placed on the top surface of a hard insulating plate 1 with a protective paper 13 left on the outside. 30
Adhere to the entire surface using a heated rubber roller heated to ~80°C.
次に、第４°図（ｂ）に示すようにフレキシブル性を必
要とする部分を除いて配置し、保護紙１３をはがした後
、第４図（Ｃ）に示すように銅箔１４を貼り付けたフレ
キシブル絶縁板３を熱ゴムローラにて全面に貼り付ける
。続いて、第４図（ｄ）に示すように銅箔１４上にエツ
チングレジスト膜を導電パターン状に形成し、エツチン
グ液にて保護されていない部分を溶解除去することによ
り、銅箔１４からなる所望とする導電パターン４を形成
する。Next, as shown in Fig. 4(b), remove the parts that require flexibility, remove the protective paper 13, and then apply the copper foil 14 as shown in Fig. 4(C). The attached flexible insulating board 3 is attached to the entire surface using a hot rubber roller. Subsequently, as shown in FIG. 4(d), an etching resist film is formed on the copper foil 14 in the form of a conductive pattern, and the unprotected portions are dissolved and removed with an etching solution, thereby forming the copper foil 14. A desired conductive pattern 4 is formed.
次に第４図（ｅ）に示すようにソルダーレジストＷｊ！
ｉｏ又は絶縁膜を形成し、続いて、第４図（ｆ）に示す
ようにプレス等で部品取付用の貫通孔６等を形成する。Next, as shown in FIG. 4(e), solder resist Wj!
io or an insulating film is formed, and then, as shown in FIG. 4(f), through holes 6 and the like for attaching parts are formed by a press or the like.
これにより、第１図あるいは第４図（ｆ）に示すような
プリント配線板ができ上がる。As a result, a printed wiring board as shown in FIG. 1 or FIG. 4(f) is completed.
尚、上述の実施例の中で述べた両面接着テープ２の代わ
りに耐熱性を有する熱硬化接着剤シートを用い、フレキ
シブル絶縁板３を熱硬化性接着剤シート２上に重ね、１
２０〜１８０℃、１０〜３０ｋｇ／ＣＩ！２の熱プレス
で１０〜３０分間加熱圧着して硬質絶縁板１とフレキシ
ブル絶縁板３を接着結合することもできる。Incidentally, a heat-resistant thermosetting adhesive sheet is used instead of the double-sided adhesive tape 2 described in the above embodiment, and the flexible insulating plate 3 is stacked on the thermosetting adhesive sheet 2.
20~180℃, 10~30kg/CI! The rigid insulating plate 1 and the flexible insulating plate 3 can also be adhesively bonded by heat-pressing for 10 to 30 minutes using a hot press as described in step 2.
更に、第４図の製造方法と異なる他の製造方法について
説明する。第５図（ａ）に示すように、銅箔１４を貼り
付けたフレキシブル絶縁板３にローラにて液状硬化性接
着剤１５を塗布し、５０〜１００℃にて乾燥した後、第
５図（ｂ）に示すように硬質絶縁板１をフレキシブル性
を必要とする部分を除いて配置し、第５図（ｃ）に示す
ように接着剤２の面を接合面としてフレキシブル絶縁板
３を重ね、１２０〜１８０℃、１（１−３０ｋＱ／ Ｃ
Ｉ！ ２の熱プレスで１０〜３０分間加熱圧着させる。Furthermore, another manufacturing method different from the manufacturing method shown in FIG. 4 will be explained. As shown in FIG. 5(a), a liquid curable adhesive 15 is applied with a roller to the flexible insulating board 3 on which the copper foil 14 is pasted, and after drying at 50 to 100°C, as shown in FIG. As shown in b), the rigid insulating board 1 is arranged except for the part that requires flexibility, and the flexible insulating board 3 is stacked with the adhesive 2 surface as the bonding surface as shown in FIG. 5(c). 120-180℃, 1(1-30kQ/C
I! Heat and press for 10 to 30 minutes using the heat press in Step 2.
続いて、第５図（ｄ）に示すように銅箔１４上にエツチ
ングレジスト膜を導電パターン状に形成し、エツチング
液にて保護されていない部分を溶解除去することにより
、銅箔１４からなる所望とする導電パターン４を形成す
る０次に第５図（ｅ）に示すようにソルダーレジスト膜
１０又は絶縁膜を形成し、続いて、第５図（ｆ）に示す
ようにプレス等で部品取付貫通孔６等を形成して第１図
あるいは第４図（ｆ）に示すようなプリント配線板を製
造する。Subsequently, as shown in FIG. 5(d), an etching resist film is formed on the copper foil 14 in the form of a conductive pattern, and the unprotected portions are dissolved and removed with an etching solution, thereby forming a pattern made of the copper foil 14. Next, as shown in FIG. 5(e), a solder resist film 10 or an insulating film is formed to form the desired conductive pattern 4, and then, as shown in FIG. A printed wiring board as shown in FIG. 1 or FIG. 4(f) is manufactured by forming mounting through holes 6 and the like.
（発明の効果）
以上説明したように本発明のプリント配線板によれば、
部品挿入、半田付は等のすべての自動化設備を再調整す
る手間がかからず、また、部品の自動挿入時、挿入圧力
によりプリント配線板が変形してしまうこともなく、従
来の製造設備がすべて使用できるのアッセンブルコスト
を大幅に低減させることができる。(Effects of the Invention) As explained above, according to the printed wiring board of the present invention,
There is no need to readjust all automated equipment for parts insertion, soldering, etc., and the printed wiring board does not deform due to insertion pressure when parts are automatically inserted, making it easier to use conventional manufacturing equipment. All can be used to significantly reduce the assembly cost.
第１図は本発明の一実施例のプリント配線板を示す斜視
図、第２図はそのプリント配線板に電子部を実装した状
態を示す側面図、第３図は第２図のプリント配線板を折
り曲げた状態を示す側面図、第４図（ａ）〜（ｆ）は第
１図のプリント配線板の製造方法を説明するための断面
図、第５図（ａ）〜（ｆ）は第４図の製造方法以外の製
造方法を説明するための断面図である。
１・・・硬質絶縁板、２・・・両面接着テープ、３・・
・フレキシブル絶縁板、４・・・導体パターン、５・・
・ランド、６・・・貫通孔、７・・・折曲げ部、８・・
・電子部品、９・・・半田、１０・・・ソルダーレジス
ト層、１１・・・メイン部分、１２・・・サブ部分、１
３・・・保護紙、１４・・・銅箔、１５・・・接着剤、
１６・・・丸棒。Fig. 1 is a perspective view showing a printed wiring board according to an embodiment of the present invention, Fig. 2 is a side view showing a state in which electronic parts are mounted on the printed wiring board, and Fig. 3 is the printed wiring board of Fig. 2. 4(a) to 4(f) are cross-sectional views for explaining the manufacturing method of the printed wiring board of FIG. FIG. 4 is a cross-sectional view for explaining a manufacturing method other than the manufacturing method shown in FIG. 4; 1...Hard insulating board, 2...Double-sided adhesive tape, 3...
・Flexible insulation board, 4... Conductor pattern, 5...
・Land, 6... Through hole, 7... Bent part, 8...
・Electronic component, 9...Solder, 10...Solder resist layer, 11...Main part, 12...Sub part, 1
3... Protective paper, 14... Copper foil, 15... Adhesive,
16...Round bar.
Claims (1)
ス転移点が低いエポキシ樹脂を含浸させてなるフレキシ
ブル絶縁板と、このフレキシブル絶縁板の一面に形成し
てある導通パターンとからなるプリント配線板において
、前記フレキシブル絶縁板の他面に折曲げ部分を除いて
硬質絶縁板が貼着してあることを特徴とするプリント配
線板。A printed wiring board comprising a flexible insulating board made by impregnating a nonwoven fabric made of polyester fibers and glass fibers with an epoxy resin having a low glass transition point, and a conductive pattern formed on one surface of the flexible insulating board. A printed wiring board characterized by having a hard insulating board adhered to the other side of the board except for the bent portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11947288A JPH01289187A (en) | 1988-05-16 | 1988-05-16 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11947288A JPH01289187A (en) | 1988-05-16 | 1988-05-16 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01289187A true JPH01289187A (en) | 1989-11-21 |
Family
ID=14762159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11947288A Pending JPH01289187A (en) | 1988-05-16 | 1988-05-16 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01289187A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007220784A (en) * | 2006-02-15 | 2007-08-30 | Sumitomo Bakelite Co Ltd | Adhesive substrate, manufacturing method of circuit substrate, and circuit board |
-
1988
- 1988-05-16 JP JP11947288A patent/JPH01289187A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007220784A (en) * | 2006-02-15 | 2007-08-30 | Sumitomo Bakelite Co Ltd | Adhesive substrate, manufacturing method of circuit substrate, and circuit board |
| JP4692317B2 (en) * | 2006-02-15 | 2011-06-01 | 住友ベークライト株式会社 | Adhesive substrate, circuit board manufacturing method, and circuit board |
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