JPH01284552A - Polyamide resin composition - Google Patents
Polyamide resin compositionInfo
- Publication number
- JPH01284552A JPH01284552A JP11363988A JP11363988A JPH01284552A JP H01284552 A JPH01284552 A JP H01284552A JP 11363988 A JP11363988 A JP 11363988A JP 11363988 A JP11363988 A JP 11363988A JP H01284552 A JPH01284552 A JP H01284552A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- weight
- parts
- polyamide resin
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 37
- 239000011342 resin composition Substances 0.000 title claims abstract description 14
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 33
- 229920000098 polyolefin Polymers 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 150000002903 organophosphorus compounds Chemical class 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 7
- 229910052604 silicate mineral Inorganic materials 0.000 claims abstract description 5
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 3
- 150000001340 alkali metals Chemical class 0.000 claims abstract description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims abstract description 3
- 150000001342 alkaline earth metals Chemical class 0.000 claims abstract description 3
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 3
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 3
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 3
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 3
- 239000004743 Polypropylene Substances 0.000 claims description 22
- 229920001155 polypropylene Polymers 0.000 claims description 22
- 239000000126 substance Substances 0.000 claims description 11
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 15
- 238000002156 mixing Methods 0.000 abstract description 9
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 abstract description 7
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 5
- 239000000454 talc Substances 0.000 abstract description 3
- 229910052623 talc Inorganic materials 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 description 30
- 239000004952 Polyamide Substances 0.000 description 13
- 229920002647 polyamide Polymers 0.000 description 13
- 238000000465 moulding Methods 0.000 description 12
- 230000000704 physical effect Effects 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 11
- 229920001577 copolymer Polymers 0.000 description 10
- 229920002292 Nylon 6 Polymers 0.000 description 9
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 6
- 238000004898 kneading Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 229920002302 Nylon 6,6 Polymers 0.000 description 5
- 229920001384 propylene homopolymer Polymers 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 229920000572 Nylon 6/12 Polymers 0.000 description 3
- 229920000577 Nylon 6/66 Polymers 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- TZYHIGCKINZLPD-UHFFFAOYSA-N azepan-2-one;hexane-1,6-diamine;hexanedioic acid Chemical compound NCCCCCCN.O=C1CCCCCN1.OC(=O)CCCCC(O)=O TZYHIGCKINZLPD-UHFFFAOYSA-N 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- PZWQOGNTADJZGH-SNAWJCMRSA-N (2e)-2-methylpenta-2,4-dienoic acid Chemical compound OC(=O)C(/C)=C/C=C PZWQOGNTADJZGH-SNAWJCMRSA-N 0.000 description 1
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical compound CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920000393 Nylon 6/6T Polymers 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910001583 allophane Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 125000004427 diamine group Chemical group 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- ZMUCVNSKULGPQG-UHFFFAOYSA-N dodecanedioic acid;hexane-1,6-diamine Chemical compound NCCCCCCN.OC(=O)CCCCCCCCCCC(O)=O ZMUCVNSKULGPQG-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920005670 poly(ethylene-vinyl chloride) Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 229920005653 propylene-ethylene copolymer Polymers 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ポリアミド樹脂組成物に関し、詳しくは、ポ
リアミドとポリプロピレンのそれぞれの優れた特性を併
せ存し、本来の吸水性のほか、成形加工特性(低そり、
低変形、ハイサイクル性等)及び諸物性(引張強度、引
張伸び等)の優れたポリアミド樹脂組成物に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a polyamide resin composition, and more specifically, it combines the excellent properties of polyamide and polypropylene, and has excellent water absorbency as well as moldability. Characteristics (low warpage,
The present invention relates to a polyamide resin composition having excellent properties (low deformation, high cycle performance, etc.) and various physical properties (tensile strength, tensile elongation, etc.).
〔従来の技術及び発明が解決しようとする課題〕一般に
、ポリアミド樹脂は、物理的、化学的性質に優れている
ことから合成繊維などとして幅広く利用されているが、
近年成形材料としても利用されるようになっている。こ
れは、ポリアミド樹脂が熱可塑性樹脂の中にあって、高
い機械的強度。[Prior art and problems to be solved by the invention] In general, polyamide resins are widely used as synthetic fibers due to their excellent physical and chemical properties.
In recent years, it has come to be used as a molding material. This is because polyamide resin is contained within thermoplastic resin and has high mechanical strength.
優れた耐摩耗性、耐薬品性、耐熱性及び比較的硬れた電
気的性質を有し、エンジニアリングプラスチックとして
の性能を充分有していることによる。This is because it has excellent abrasion resistance, chemical resistance, heat resistance, and relatively hard electrical properties, and has sufficient performance as an engineering plastic.
しかし、その反面、アミド基(−CONH−)に起因し
て吸水による寸法変化や機械的強度の低下が生ずるなど
好ましからざる性能をも有しており、それが故に、成形
材料としての市場性が限定されている。However, on the other hand, it has undesirable performance such as dimensional changes due to water absorption and a decrease in mechanical strength due to the amide group (-CONH-), which makes it less marketable as a molding material. Limited.
一方、ポリプロピレンは安価で、かつ吸?R性はほとん
ど示さないが、軟質であり、高温時の物性が劣るなどの
欠点がある。On the other hand, polypropylene is cheap and breathable? Although it exhibits almost no R property, it has drawbacks such as being soft and having poor physical properties at high temperatures.
したがって、ポリアミド樹脂およびポリプロピレン樹脂
のそれぞれの欠点を改善するために、これらの樹脂を併
用することは当然考えられるが、ポリアミド樹脂とポリ
プロピレン樹脂を通常の方法で混合して得た樹脂混合物
、あるいはそれらを単に溶融混練して得た樹脂組成物で
は相溶性が劣り、目的とする優れた特性を持つ組成物と
はなりえない。Therefore, in order to improve the respective disadvantages of polyamide resin and polypropylene resin, it is natural to think of using these resins together, but it is possible to use a resin mixture obtained by mixing polyamide resin and polypropylene resin in the usual way, or a mixture of them. A resin composition obtained simply by melting and kneading has poor compatibility and cannot provide a composition with the desired excellent properties.
そのため、従来からポリアミド樹脂とポリプロ 、ピ
レン樹脂のそれぞれの優れた特性を併せ有する樹脂組成
物、すなわちポリアミド樹脂が有する優れた耐摩耗性、
電気特性、耐熱性1機械的強度。Therefore, we have traditionally developed resin compositions that combine the excellent properties of polyamide resin, polypropylene resin, and pyrene resin, that is, the excellent abrasion resistance of polyamide resin,
Electrical properties, heat resistance 1 mechanical strength.
−3=
耐油性、さらにポリプロピレン樹脂が有する低吸水性、
耐熱水性、耐ハロゲン化金属性、低温耐衝撃性を併せ有
する樹脂組成物を得ることを目的として、様々な提案が
なされている(特公昭42−12546号公報、特公昭
50−7636号公報など)。-3= Oil resistance and low water absorption of polypropylene resin,
Various proposals have been made for the purpose of obtaining a resin composition that has hot water resistance, metal halide resistance, and low-temperature impact resistance (Japanese Patent Publication No. 42-12546, Japanese Patent Publication No. 50-7636, etc.) ).
これらのいわゆるポリマーアロイ組成物の場合、低吸水
性能ではかなりの改良が進行しているが、成形加工特性
や他の諸物性については、あまり考慮されていないのが
現状である。つまり、これらのポリマーアロイ組成物の
場合、相溶化の手法として反応が伴なっているため、成
形収縮率が大きくなるという問題がある。また、ポリプ
ロピレン樹脂はポリアミド樹脂に比べて融点が低いため
、これらのポリマーアロイ組成物は、ポリアミド樹脂の
固化時間よりも長くなる傾向がある。そのため、成形品
では、そり、変形が発生しやすく、また成形サイクルが
長くなることが大きな問題になっている。In the case of these so-called polymer alloy compositions, considerable improvements have been made in terms of low water absorption performance, but at present little consideration has been given to molding properties and other physical properties. In other words, in the case of these polymer alloy compositions, since a reaction is involved as a compatibilization method, there is a problem that the molding shrinkage rate increases. Additionally, since polypropylene resins have lower melting points than polyamide resins, these polymer alloy compositions tend to take longer to solidify than polyamide resins. Therefore, molded products tend to warp and deform, and the molding cycle becomes longer, which is a major problem.
本発明者らは、低吸水性にすぐれるとともに、上記の成
形加工特性や他の諸物性を改良することを目的として鋭
意研究を重ねた。The present inventors have conducted extensive research with the aim of improving the above-mentioned molding properties and other physical properties as well as having excellent low water absorption.
その結果、ポリアミド樹脂とポリプロピレン樹脂を併用
するに際して、酸変性ポリオレフィンならびにケイ酸塩
鉱物、ポリエチレンテレフタレート、ポリブチレンチレ
フクレートあるいは特定の有機リン化合物を配合するこ
とによって、目的を達成できることを見出した。As a result, it has been found that when using polyamide resin and polypropylene resin together, the objective can be achieved by blending acid-modified polyolefin, silicate mineral, polyethylene terephthalate, polybutylene lentilephrate, or a specific organic phosphorus compound.
本発明はかかる知見に基いて完成したものである。すな
わち、本発明は
(A)ポリアミド樹脂 100重量部。The present invention was completed based on this knowledge. That is, the present invention includes (A) 100 parts by weight of polyamide resin.
(B)酸変性ポリオレフィン0.5〜100重量部。(B) 0.5 to 100 parts by weight of acid-modified polyolefin.
(C)ポリプロピレン樹脂 5〜150重量部およ
び
(D((1)ケイ酸塩鉱物。(C) 5 to 150 parts by weight of polypropylene resin and (D((1) silicate mineral.
(2)一般式
〔式中、nは2あるいは4である。〕で表わされる繰返
し単位を有する重合度2以上の重合体。(2) General formula [where n is 2 or 4]. ] A polymer having a degree of polymerization of 2 or more and having a repeating unit represented by the following.
(3)一般式
(式中、M+はナトリウムあるいはカリウムを示し、X
、Yばそれぞれ
(ここで、R’、R2はそれぞれ水素もしくは炭素数1
〜6のアルキル基で
ある。)
を示す。〕で表わされるアルカリ金属含有有機リン化合
物
および
(4)一般式
〔式中、M2はマグネシウムあるいはカルシウムを示し
、Zは
(ここで、R’、R2は前記と同じである。)
を示ず。〕で表ねされるアルカリ土類金属含有有機リン
化合物
よりなる群から選ばれた少なくとも一種の化合物を、前
記(A)、 (B)、 (C)の合計100重量部に対
して0.01〜3重量部重量したことを特徴とするポリ
アミド樹脂組成物を提供するものである。(3) General formula (where M+ represents sodium or potassium,
, Y (here, R' and R2 are each hydrogen or carbon number 1)
~6 alkyl group. ) is shown. An alkali metal-containing organic phosphorus compound represented by the formula (4) (wherein, M2 represents magnesium or calcium, and Z is (here, R' and R2 are the same as above). ] At least one compound selected from the group consisting of alkaline earth metal-containing organophosphorus compounds represented by 0.01 parts by weight per 100 parts by weight of the above (A), (B), and (C). The present invention provides a polyamide resin composition characterized in that the weight of the polyamide resin composition is 3 parts by weight.
本発明の組成物にお+jる(A)成分は、ナイロン6、
ナイロン11.ナイロン12などのポリラククム類;ナ
イロン66、ナイロン610.ナイロン612.ナイロ
ン46等のジカルボン酸とジアミンとから得られるポリ
アミド頚;ナイロン6/66、ナイロン6/610.ナ
イロン6/612゜ナイロン6/12.ナイロン6/6
6/610等の共重合ポリアミド類;ナイロン6/6T
(T:テレフタル酸成分);イソフタル酸のような芳香
族ジカルボン酸とメクキシレンジアミン得られる芳香族
ポリアミI”ff、あるいはイソフタル酸のような芳香
族ジカルボン酸と脂環族ジアミンから得られる半芳香族
ポリアミド類、さらにはポリエステルアミド、ポリエー
テルアミドおよびポリエステルエーテルアミドを挙げる
ことができる。なお、上記(A)成分であるポリアミド
樹脂としては、これらのポリアミドを単独で用いてもよ
く、また二種類以上を併用することもできる。The component (A) in the composition of the present invention is nylon 6,
Nylon 11. Polylactums such as nylon 12; nylon 66, nylon 610. Nylon 612. Polyamide neck obtained from dicarboxylic acid such as nylon 46 and diamine; nylon 6/66, nylon 6/610. Nylon 6/612° Nylon 6/12. Nylon 6/6
Copolymerized polyamides such as 6/610; nylon 6/6T
(T: terephthalic acid component); Aromatic polyamide I"ff obtained from aromatic dicarboxylic acid such as isophthalic acid and mexylenediamine, or semi-aromatic obtained from aromatic dicarboxylic acid such as isophthalic acid and alicyclic diamine Group polyamides, and further include polyesteramide, polyetheramide, and polyesteretheramide.Incidentally, as the polyamide resin which is the component (A), these polyamides may be used alone, or two types may be used. The above can also be used together.
なお、本発明において使用できるポリアミド樹脂は、上
述のポリアミドより選択されたものであればこれらのポ
リアミドの末端基の種類や濃度および分子量などにより
制限されることなく、種々のものを使用することができ
るが、特に高カルボン酸末端ポリアミドが好ましい。ま
たポリアミドの重合時に残存または生成するモノマー、
オリゴマー等の低分子量物が混在しているポリアミドも
用いることが可能である。Note that the polyamide resin that can be used in the present invention is not limited by the type, concentration, molecular weight, etc. of the terminal group of these polyamides as long as it is selected from the above-mentioned polyamides, and various resins can be used. However, highly carboxylic acid terminated polyamides are particularly preferred. In addition, monomers remaining or generated during polymerization of polyamide,
It is also possible to use polyamide in which low molecular weight substances such as oligomers are mixed.
次に、本発明の組成物の(B)成分は、酸変性ポリオレ
フィンであり、様々なものがあるが、本発明では主とし
て次の二種類に大別することがで一8=
きる。すなわち、■ポリオレフィンに、ラジカル発生剤
の存在下でα2 β−不飽和カルポン酸またはその誘導
体をグラフトしたグラフト酸変性ポリオレフィン、およ
び■オレフィン(特にα−オレフィン)のモノマーに、
α、β−不飽和カルポン酸またはその誘導体、およびメ
タクリル酸エステルまたはアクリル酸エステルを共重合
させて得られる三元系酸変性ポリオレフィンである。Next, component (B) of the composition of the present invention is an acid-modified polyolefin, and although there are various types, in the present invention, it can be roughly classified into the following two types. That is, (1) a grafted acid-modified polyolefin obtained by grafting α2β-unsaturated carboxylic acid or a derivative thereof to a polyolefin in the presence of a radical generator, and (2) a monomer of an olefin (especially α-olefin),
It is a ternary acid-modified polyolefin obtained by copolymerizing α, β-unsaturated carboxylic acid or its derivative, and methacrylic acid ester or acrylic acid ester.
このうち、上記■のグラフト酸変性ポリオレフィンにつ
いて、そのヘースとなるポリオレフィンは、様々なもの
があげられるが、好ましくは低密度ポリエチレン、中密
度ポリエチレン、高密度ポリエチレン、線状低密度ポリ
エチレン、ポリプロピレン、ポリブテン−1,ポリメチ
ルペンテン−1、エチレンとα−オレフィンとの共重合
体(エチレン−プロピレン共重合体、エチレン−プロピ
レン−ジエン三元共重合体、エチレン−ブテン−1共重
合体など)、エチレンとビニル化合物との共重合体(エ
チレン−酢酸ビニル共重合体、エチレン−アクリル酸共
重合体、エチレンーアクリル酸エステル共重合体、エチ
レン−メタクリル酸共重合体、エチレン−メタクリル酸
エステル共重合体、エチレン−(メタ)アクリル酸(エ
ステル)−α、β−不飽和カルポン酸(誘導体)三元共
重合体、エチレン−塩化ビニル共重合体など)あるいは
これらの混合物があげられる。Among these, for the graft acid-modified polyolefin mentioned above, various polyolefins can be used as the base, but preferably low-density polyethylene, medium-density polyethylene, high-density polyethylene, linear low-density polyethylene, polypropylene, and polybutene. -1, polymethylpentene-1, copolymer of ethylene and α-olefin (ethylene-propylene copolymer, ethylene-propylene-diene terpolymer, ethylene-butene-1 copolymer, etc.), ethylene and copolymers with vinyl compounds (ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, ethylene-methacrylic acid copolymer, ethylene-methacrylic acid ester copolymer) , ethylene-(meth)acrylic acid (ester)-α, β-unsaturated carboxylic acid (derivative) terpolymer, ethylene-vinyl chloride copolymer, etc.), or mixtures thereof.
また、グラフト変性に用いるα、β−不飽和カルボン酸
またはその誘導体としては、アクリル酸。Further, as the α,β-unsaturated carboxylic acid or its derivative used for graft modification, acrylic acid is used.
マレイン酸、フマール酸、イタコン酸、3.6−ニンド
メチレンー1,2,3.6−チトラヒドローシスーフタ
ル酸またはこれらの無水物やエステル類、2−ジメチル
アミノエチルメタクリレート等のアルキルアミノメタク
リレートおよびグリシジルメタクリレート等があげられ
、なかでもアクリル酸、マレイン酸、無水マレイン酸あ
るいは3,6−ニンドメチレンーL2,3.6−チトラ
ヒドローシスーフタル酸の無水物が好ましい。なお、こ
れらは単独で用いても二種以上を混合して用いてもよい
。Maleic acid, fumaric acid, itaconic acid, 3.6-nindomethylene-1,2,3.6-titrahydrosis-phthalic acid or their anhydrides and esters, alkylaminomethacrylates such as 2-dimethylaminoethyl methacrylate, and glycidyl Examples include methacrylate, and among these, acrylic acid, maleic acid, maleic anhydride, and 3,6-nindomethylene-L2,3,6-titrahydrosis-phthalic anhydride are preferred. In addition, these may be used individually or in mixture of 2 or more types.
さらに、グラフト変性に用いるラジカル発生剤としでは
、ジクミルバーオキサイド;ヘンシイルバーオキサイド
;ジーL−ブチルパーオキサイド;2.5−ジメチル−
2,5−ジ(t−ブチルパーオキシ)ヘキサン;2.5
−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキ
セン−3;ラウロイルパーオギサイド;t−プチルパー
オキシヘンゾエート等の有機過酸化物が好適に使用され
る。Further, as radical generators used for graft modification, dicumyl peroxide; hensyl peroxide; di-L-butyl peroxide; 2,5-dimethyl-
2,5-di(t-butylperoxy)hexane; 2.5
Organic peroxides such as -dimethyl-2,5-di(t-butylperoxy)hexene-3; lauroyl peroxide; and t-butyl peroxyhenzoate are preferably used.
上記■のグラフト酸変性ポリオレフィンを製造するにあ
たっては、上述のポリオレフィンを適当な溶媒に懸濁あ
るいは溶解させ、これに上記α。In producing the grafted acid-modified polyolefin of (1) above, the above-mentioned polyolefin is suspended or dissolved in a suitable solvent, and the above-mentioned α is added to the above-mentioned polyolefin.
β−不飽和カルボン酸またはその誘導体、およびラジカ
ル発生剤を加えて加熱撹拌する方法、あるいはポリオレ
フィンとα、β−不飽和カルボン酸またはその誘導体な
らびにラジカル発生剤を予め混合し、押出機、バンバリ
ーミキサ−、ニーダ−等を用いて溶融混練する方法など
があり、特に後者の方法が好適に採用される。この際に
用いる各化合物の使用量は、各種状況に応じ°ζ適宜選
定すればよく特に制“限はないが、通常はポリオレフィ
ン100重量部に対し、α、β−不飽和カルボン酸また
はその誘導体0.1〜5.0重量部およびラジカル発生
剤0.1〜5.0重量部を目安とすればよい。A method of adding a β-unsaturated carboxylic acid or its derivative and a radical generator and stirring with heating, or a method of pre-mixing the polyolefin and α,β-unsaturated carboxylic acid or its derivative and a radical generator and using an extruder or Banbury mixer. -, a method of melt-kneading using a kneader, etc., and the latter method is particularly preferably employed. The amount of each compound used in this case is not particularly limited as long as it can be selected appropriately depending on various situations, but usually α, β-unsaturated carboxylic acid or its derivative is used per 100 parts by weight of polyolefin. A rough guideline is 0.1 to 5.0 parts by weight and 0.1 to 5.0 parts by weight of the radical generator.
一方、上記■の三元系酸変性ポリオレフィンについて、
オレフィンモノマーは、様々なものがあげられるが、好
ましくはエチレン、プロピレン。On the other hand, regarding the above ternary acid-modified polyolefin,
Various olefin monomers can be used, but ethylene and propylene are preferred.
ブテン−1,メチルペンテン−1などであり、とりわけ
エチレンが好ましい。また、α、β−不飽和カルボン酸
またはその誘導体としては、前述したものと同様である
。These include butene-1, methylpentene-1, etc., and ethylene is particularly preferred. Further, the α,β-unsaturated carboxylic acid or its derivative is the same as described above.
この三元系酸変性ポリオレフィンの製造は通常の重合方
法を用い得る。この際に用いる各化合物の使用量は、各
種状況に応じて適宜選定すればよく特に制限はないが、
通常はオレフィン100重量部に対し、α、β−不飽和
カルボン酸またはその誘導体1〜5重量部およびメタク
リル酸エステルまたはアクリル酸エステル8〜25重量
部を目安とすればよい
本発明の組成物の(B)成分は、酸変性ポリオレフィン
、特に上述の■グラフト酸変性ポリオレフィンおよび/
あるいは■三元系酸変性ポリオレフィンが好適に用いら
れるが、この配合量については、(A)成分であるポリ
アミド樹脂100重量部に対して、0.5〜100重量
部である。ここで、(B)酸変性ポリオレフィンの配合
量が0.5重量部未満では、(A)成分であるポリアミ
ドと(C)成分であるポリプロピレン樹脂との相溶性を
改善することができないため、得られる組成物に所望す
る物性を付与することができない。一方、(B)酸変性
ポリオレフィンの配合量が100重量部を越えても、配
合量に相当する効果はなく、むしろ得られる組成物の諸
物性を低下させるおそれがある。This ternary acid-modified polyolefin can be produced using a conventional polymerization method. The amount of each compound used at this time is not particularly limited, as long as it can be selected appropriately depending on the various circumstances.
Usually, the composition of the present invention may contain 1 to 5 parts by weight of α,β-unsaturated carboxylic acid or its derivative and 8 to 25 parts by weight of methacrylic ester or acrylic ester per 100 parts by weight of olefin. Component (B) is an acid-modified polyolefin, especially the above-mentioned grafted acid-modified polyolefin and/or
Alternatively, (3) a ternary acid-modified polyolefin is preferably used, and the blending amount thereof is 0.5 to 100 parts by weight per 100 parts by weight of the polyamide resin as component (A). If the amount of acid-modified polyolefin (B) is less than 0.5 parts by weight, the compatibility between the polyamide as the component (A) and the polypropylene resin as the component (C) cannot be improved. The desired physical properties cannot be imparted to the composition. On the other hand, even if the amount of the acid-modified polyolefin (B) exceeds 100 parts by weight, there will be no effect corresponding to the amount, but rather there is a risk that the various physical properties of the resulting composition will be deteriorated.
次に、本発明の組成物の(C)成分は、ポリプロピレン
樹脂であり、この中にはプロピレン単独重合体のみなら
ずプロピレン共重合体も含まれる。Next, component (C) of the composition of the present invention is a polypropylene resin, which includes not only a propylene homopolymer but also a propylene copolymer.
ここでプロピレン共重合体としては、プロピレン−エチ
レン共重合体、プロピレン−ブテン−1共重合体などが
あり、これらのブロック共重合体やランダム共重合体が
ある。この(C)成分としては、プロピレン単独重合体
やプロピレン共重合体を単独で使用してもよく、あるい
は二種類以上併用することもできる。Examples of propylene copolymers include propylene-ethylene copolymers, propylene-butene-1 copolymers, and block copolymers and random copolymers thereof. As this component (C), a propylene homopolymer or a propylene copolymer may be used alone, or two or more types may be used in combination.
なお、このプロピレン単独重合体、プロピレン共重合体
の分子量は特に制限されないが、一般にはMFRが1〜
50g/10分のものが好適に使用される
また、この(C)成分の配合量については、(A)成分
であるポリアミド100重量部に対して、5〜150重
量部とずべきであり、好ましくは10〜140重量部の
範囲で選定する。ここで(C)成分が5重量部未満では
、得られる組成物にポリプロピレンの本来有する優れた
特性(低吸水性等)を充分に付与することができない。The molecular weight of this propylene homopolymer and propylene copolymer is not particularly limited, but generally MFR is 1 to 1.
50 g/10 minutes is preferably used. Also, the amount of component (C) to be blended should be 5 to 150 parts by weight based on 100 parts by weight of the polyamide (A) component. It is preferably selected within the range of 10 to 140 parts by weight. If the amount of component (C) is less than 5 parts by weight, the excellent properties inherent to polypropylene (low water absorption, etc.) cannot be sufficiently imparted to the resulting composition.
また、150重量部を越えると、得られる組成物は、耐
熱性1機械的強度等の物性において満足できないものと
なる。If the amount exceeds 150 parts by weight, the resulting composition will not be satisfactory in physical properties such as heat resistance and mechanical strength.
なお、本発明の組成物に要求される物性のうち、吸水性
の低減を重視する場合は、(B)酸変性ポリオレフィン
と(C)ポリプロピレン樹脂の合計配合量を、(A)ポ
リアミド樹脂の配合量より多(することが効果的である
。また、本発明の組成物に耐熱性を特に期待する場合に
は、(A)成分であるポリアミド樹脂の配合量を(B)
、(C)成分の合計配合量より多くすることが好ましい
。Among the physical properties required for the composition of the present invention, when reducing water absorption is important, the total blending amount of (B) acid-modified polyolefin and (C) polypropylene resin should be changed to the blending amount of (A) polyamide resin. It is effective to increase the amount of polyamide resin (A) to (B) when heat resistance is particularly expected for the composition of the present invention.
It is preferable that the amount is greater than the total amount of components (C).
さらに、本発明の組成物においては、上記(A)。Furthermore, in the composition of the present invention, the above (A).
(B)、(C)成分のみならず、(D)成分として前記
(1)〜(4)から選ばれた一種あるいは二種以上の化
合物を配合することが必要である。ここで(1)成分は
、ケイ酸塩鉱物であり、さらに詳しくは5iOzを必須
成分として含有し、かつMgCh、AfzOh。It is necessary to blend not only components (B) and (C) but also one or more compounds selected from the above (1) to (4) as component (D). Here, component (1) is a silicate mineral, more specifically, it contains 5iOz as an essential component, and also contains MgCh and AfzOh.
CaO,Fed、Fe2O3,Na2O等の各成分を一
種乃至数種含有する含水あるいは無水塩である。It is a hydrous or anhydrous salt containing one or more of each component such as CaO, Fed, Fe2O3, Na2O, etc.
具体的には、タルク、クレー、シリカ、シリカ・アルミ
ナ、マイカ、アロフェン、パイロフィライト、カオリナ
イト モンモリロナイト、バーミキュライト、ワラスト
ナイト、カオリン等をあげることができる。Specifically, talc, clay, silica, silica/alumina, mica, allophane, pyrophyllite, kaolinite, montmorillonite, vermiculite, wollastonite, kaolin, etc. can be mentioned.
また、(2)成分は一般式
%式%
〔式中、nは2あるいは4である。〕で表わされる繰返
し単位を有する重合度2以上の重合体、具体的にはポリ
エチレンテレフタレート(PET)やポリブチレンチレ
フクレート(PBT)である。しかし、これらは必ずし
もポリマーでなくともよく、低分子量のオリゴマー程度
のものでもよい。In addition, the component (2) is represented by the general formula % [wherein n is 2 or 4]. ] A polymer having a degree of polymerization of 2 or more and having a repeating unit represented by the following formula, specifically, polyethylene terephthalate (PET) and polybutylene terephthalate (PBT). However, these do not necessarily have to be polymers, and may be low molecular weight oligomers.
さらに、(3)成分および(4)成分は、共に有機リン
化合物であり、それぞれ前述した一般式(α)。Furthermore, component (3) and component (4) are both organic phosphorus compounds, and each has the general formula (α) described above.
一般式(β)で表わされるものである。これらはいずれ
も従来からポリアミド樹脂の造核剤として使用されてい
るものであり、各種のものをあげることができるが、本
発明においては市販のものを充当すればよい。It is represented by the general formula (β). All of these have been conventionally used as nucleating agents for polyamide resins, and various types can be mentioned, but in the present invention, commercially available ones may be used.
本発明の組成物においては、(D)成分として上記(1
)〜(4)の化合物が単独であるいは二種以上組合せて
使用されるが、この(D)成分の配合量は、前記(A)
、 (BL (C)成分の合計100重量部に= 16
−
対して0.01〜3重量部、好ましくは0.1〜2重量
部の範囲で選定する。ここで(D)成分の配合量が、0
.01重量部より少ないと、組成物から得られる成形品
のそりを改善すること困難となり、また、成形サイクル
を短縮することができなくなる。逆に3重量部を超える
と、組成物の流動性が低下し、また耐衝撃性も低下する
。In the composition of the present invention, the above (1) is used as the component (D).
) to (4) may be used alone or in combination of two or more, and the blending amount of component (D) is the same as that of (A) above.
, (total of 100 parts by weight of BL (C) component = 16
- from 0.01 to 3 parts by weight, preferably from 0.1 to 2 parts by weight. Here, the blending amount of component (D) is 0
.. If the amount is less than 0.01 parts by weight, it will be difficult to improve the warpage of the molded product obtained from the composition, and it will also be impossible to shorten the molding cycle. On the other hand, if it exceeds 3 parts by weight, the fluidity of the composition will decrease and the impact resistance will also decrease.
本発明のポリアミド樹脂組成物を製造するに際しては(
A)、 (B)、 (C)の樹脂成分と、(D)成分で
ある添加剤((1)〜(4)成分)の少なくとも一種と
の溶融混練を種々の状態で行うことができる。例えば、
重合反応終了後の未だ溶融状態にある(A)ポリアミド
樹脂に(B)酸変性ポリオレフィンと(C)ポリプロピ
レン樹脂ならびに(D)添加剤を加えて溶融混練しても
よく、あるいは粉末状またはペレット状の(A)ポリア
ミド樹脂に、上記(B)、(C)および(D)成分を加
えて溶融混練してもよい。さらに、(D)成分である添
加剤の効果を最大限に発揮させるためには、(A)ポリ
アミド樹脂に、上記(1)〜(4)の少なくとも一種の
添加剤を加えて溶融混練した後、(B)、(C)成分を
加えて溶融混練することが好ましい。When producing the polyamide resin composition of the present invention (
The resin components A), (B), and (C) and at least one of the additives (components (1) to (4)) that are component (D) can be melt-kneaded in various states. for example,
(B) acid-modified polyolefin, (C) polypropylene resin and (D) additives may be added to (A) polyamide resin which is still in a molten state after completion of the polymerization reaction and then melt-kneaded, or it may be in the form of powder or pellets. The above components (B), (C) and (D) may be added to the polyamide resin (A) and melt-kneaded. Furthermore, in order to maximize the effect of the additive that is component (D), it is necessary to add at least one of the additives listed in (1) to (4) above to the polyamide resin (A) and then melt-knead it. , (B), and (C) are preferably added and melt-kneaded.
各成分を溶融混練する際の温度は、適宜選定すればよい
が、通常は180°C〜350°C1好ましくは200
〜300°Cの範囲から選定される。温度が低すぎると
、各成分の溶融が不充分であるため、完全な溶融混練が
困難となり、また高すぎると分解反応が進行するおそれ
があり、あまり好ましくない。The temperature when melting and kneading each component may be selected as appropriate, but is usually 180°C to 350°C, preferably 200°C.
-300°C. If the temperature is too low, each component will be insufficiently melted, making complete melt-kneading difficult, and if the temperature is too high, there is a risk that a decomposition reaction will proceed, which is not very preferable.
なお、上記溶融混練の操作は、単軸、二軸押出機など公
知の溶融混練装置を用いて行えばよい。The above-mentioned melt-kneading operation may be performed using a known melt-kneading device such as a single-screw or twin-screw extruder.
本発明の組成物は上述の如く、(A)、(B)。The composition of the present invention includes (A) and (B) as described above.
(C)及び(D)成分を主成分とするものであるが、目
的に応じてさらに染料、顔料、充填剤、核剤。The main components are components (C) and (D), but depending on the purpose, dyes, pigments, fillers, and nucleating agents may be added.
繊維状物、可塑剤、滑剤、離型剤、カップリング剤1発
泡剤、耐熱剤、耐候剤あるいは難燃剤等を適量添加する
こともできる。Appropriate amounts of fibrous substances, plasticizers, lubricants, mold release agents, coupling agents, blowing agents, heat resistant agents, weather resistant agents, flame retardants, etc. can also be added.
また、本発明の組成物は、パイプ、チューブ。The composition of the present invention can also be used in pipes and tubes.
棒、射出成形品等に加工することが可能であり、さらに
後加工としてメツキ塗装などを施すこともできる。It can be processed into rods, injection molded products, etc., and can also be subjected to post-processing such as plating.
〔実施例]
次に、本発明を実施例および比較例に基いて、さらに詳
しく説明する。[Example] Next, the present invention will be described in more detail based on Examples and Comparative Examples.
なお、以下の各側において得られたポリアミド樹脂組成
物の各種物性は、次の如き試験方法に基いて測定したも
のである。The various physical properties of the polyamide resin compositions obtained on each side below were measured based on the following test methods.
試W11和λ阻皮汰
試験片は、組成物をスクリューインライン式射出成形機
で成形して作成した。このときのシリンダー温度は、(
A)ポリアミド樹脂としてナイロン66を用いた場合は
280°C、ナイロン6/66を用いた場合は265°
C、ナイロン6を用いた場合は250°Cとした。また
、金型温度は60°Cとした。Test W11 sum lambda skin test piece was prepared by molding the composition using a screw in-line injection molding machine. The cylinder temperature at this time is (
A) 280°C when using nylon 66 as the polyamide resin, 265° when using nylon 6/66
When C and nylon 6 were used, the temperature was 250°C. Moreover, the mold temperature was 60°C.
戒彫濯譚1M監決
(1)吸水特性
(1−1)吸水率の測定
ASTM−D−63’8に規定された引張試験用試験片
を用い、100°Cの沸騰水中に24時間浸清して、成
形後の絶対乾燥時と吸水時の重量から次式に従って算出
した。Kaikyorutan 1M Supervision (1) Water Absorption Characteristics (1-1) Measurement of Water Absorption Rate Using a tensile test specimen specified in ASTM-D-63'8, immerse it in boiling water at 100°C for 24 hours. The weight was calculated according to the following formula from the absolute dry weight after molding and the weight after water absorption.
(1−2)吸水時の寸法変化率□の測定上記の吸水した
引張試験片の長手方向の寸法と成形後の絶対乾燥(絶乾
)□時め゛試験片の長手方向の寸法から、次式に従って
算出した。(1-2) Measurement of dimensional change rate □ upon water absorption From the longitudinal dimension of the above water-absorbed tensile test piece and the longitudinal dimension of the test piece at the time of absolute drying (absolutely dry) □ after molding, Calculated according to the formula.
(2)引張強度及び伸びめ測□定 □ ASTM−D”63 EHと準拠して測定した。(2) Tensile strength and elongation measurement □ Measured in accordance with ASTM-D''63EH.
(3)熱変形温度 □
ASTM−D−134sに準拠し、曲げ応力46kg
f / CTMにて測定した。 ゛
(4)成形収縮率
ASTM−D−638に規定された1号試験片を成形し
、絶乾状態で23°Cの温度に24蒔間薮置した後、長
手方向の寸法を測□定し、次代にした゛かって成形収縮
率を求めた。(3) Heat distortion temperature □ Based on ASTM-D-134s, bending stress 46 kg
Measured using f/CTM. (4) Molding shrinkage rate A No. 1 test piece specified in ASTM-D-638 was molded and placed at a temperature of 23°C for 24 minutes in an absolutely dry state, and then the longitudinal dimension was measured. Then, in the next generation, the molding shrinkage rate was determined.
1 ’20 X 12,0”X 、3..2mmの平板
を成形し、絶乾状態で、23°Cに24時間放置した後
、半板に一頂点を固定し、対角線上の他の頂点の平面か
らの距離を測定し、そりの状態を判定した。1'20 x 12,0" The distance from the plane was measured to determine the warpage condition.
(6)ハイサイクルテスト 45髄直径で厚み3mmの円板上に、外直径7mm。(6) High cycle test 45 on a disc with a medullary diameter and a thickness of 3 mm, and an outer diameter of 7 mm.
内直径2.5mm、長さj5.mmの筒体を一体にした
形状9成形品を冷却時間を変えて成形し、中のピン穴の
形状が良好か否かで判定した。Inner diameter 2.5mm, length j5. Shape 9 molded products made by integrating cylinders of mm in diameter were molded with different cooling times, and judgment was made based on whether the shape of the pin holes inside was good or not.
また、各側において使用した(A)ポリアミド樹脂、、
(B)、、酸変性ポリオレフィン、 (C)ポリプロピ
レン樹脂および(D)添加剤は、以下のとおりである。In addition, (A) polyamide resin used on each side,
(B), acid-modified polyolefin, (C) polypropylene resin, and (D) additives are as follows.
A ボ1アミド 」L
■ナイロン66
相対粘啓:、、2.85
アミノ末端基濃度:、 5. OX、10−5当量/g
■ナイロン6/66
共重合比: ナイロン6/ナイロン66 =10/90
相対粘度:2.90
アミノ末端基濃度:4.5X10−’当量7ビ■ナイロ
ン6
相対粘度:3.10
アミノ末端基濃度: 4.5X10−’当量/g−ロ
Σm’h創児n−L/ス不ノ
■グラフト酸変性ポリプロピレン(種類■)23 (1
”CのMFRが1.0g/10分を有するアイツタクチ
イックポリプロピレンに無水マレイン酸を0.35重量
%付加したグラフト酸変性ポリプロピレン。A Bo1 Amide L ■Nylon 66 Relative viscosity: 2.85 Amino end group concentration: 5. OX, 10-5 equivalent/g
■Nylon 6/66 Copolymerization ratio: Nylon 6/Nylon 66 = 10/90
Relative viscosity: 2.90 Amino end group concentration: 4.5X10-' equivalent 7bis Nylon 6 Relative viscosity: 3.10 Amino end group concentration: 4.5X10-'equivalent/g-RoΣm'h-born n- L/Sununo ■ Grafted acid-modified polypropylene (type ■) 23 (1
A grafted acid-modified polypropylene obtained by adding 0.35% by weight of maleic anhydride to tactical polypropylene having an MFR of 1.0 g/10 min.
■三元系酸変性ポリエチレン(種類■)エチレン100
重量部に対してメタクリル酸メチル7重量部および無水
マレイン酸1重量部を共重合した三元系酸変性ポリエチ
レン。■Ternary acid-modified polyethylene (type■) Ethylene 100
A ternary acid-modified polyethylene obtained by copolymerizing 7 parts by weight of methyl methacrylate and 1 part by weight of maleic anhydride.
Cボ1プロピレン 1
■プロピレン単独重合体
JIS K 6758のMFRが18g/10分のプロ
ピレン単独重合体(昭和電工■製、ショウア1:+7−
MA 610 H)。Cbo 1 Propylene 1 ■ Propylene homopolymer JIS K 6758 MFR of 18 g/10 min Propylene homopolymer (manufactured by Showa Denko ■, Shore 1: +7-
MA 610H).
■プロヒッンブロック共重合体
JIS K 6758のMFRが16g/10分のプロ
ピレンエチレンブロソク共重合体(昭和電工■製、ショ
ウアロマ−MK511)。■Propylene block copolymer A propylene ethylene block copolymer with an MFR of JIS K 6758 of 16 g/10 minutes (manufactured by Showa Denko ■, Showaromer-MK511).
」温
(1)タルク(平均粒径2μ、林化成社製 5000
S )(2J P E T粉末(分子量20000)(
3)有機リン化合物
や〜)II
(t−Bu OP 0Na
(4)を機リン化合物
(t−Buは第三級ブチル基を示す。)23一
実施例1〜11および比較例1〜5
前記の(A)ポリアミド樹脂、 (B)酸変性ポリオレ
フィン、 (C)ポリプロピレン樹脂および(D)各種
添加剤を、第1表に示した配合量(重量%)でヘンシェ
ルミキサーを用いて予めそれぞれ5分間乾式ブレンドし
た。"Warm (1) Talc (average particle size 2μ, manufactured by Hayashi Kasei Co., Ltd. 5000
S ) (2J PET powder (molecular weight 20,000) (
3) Organophosphorus compound or ~) II (t-Bu OP 0Na (4) as organic phosphorus compound (t-Bu represents a tertiary butyl group) 23 - Examples 1 to 11 and Comparative Examples 1 to 5 (A) polyamide resin, (B) acid-modified polyolefin, (C) polypropylene resin, and (D) various additives were mixed in advance for 5 minutes using a Henschel mixer in the amounts (wt%) shown in Table 1. Dry blended.
得られた各混合物を、ベント付同方向二軸押出機(内径
30mm)を用いて混練し、ペレットを作成した。なお
、ナイロン66系混合物では280°C,ナイロン6/
66系混合物では265°C,ナイロン6系混合物では
250°Cに加熱した。Each of the obtained mixtures was kneaded using a vented co-directional twin-screw extruder (inner diameter 30 mm) to create pellets. In addition, for nylon 66-based mixtures, the temperature is 280°C, nylon 6/
The mixture was heated to 265°C for the 66-based mixture, and 250°C for the nylon 6-based mixture.
各ペレットから射出成形機を使用して物性測定用の試料
を作成し、各物性を測定した。結果を第2表に示す。Samples for measuring physical properties were prepared from each pellet using an injection molding machine, and each physical property was measured. The results are shown in Table 2.
(以下余白)
〔発明の効果〕
本発明によれば、ポリアミドとポリプロピレンのそれぞ
れの優れた特性を併せ有し、本来の低吸水性のほかに、
成形加工特性(低そり、低変形。(The following is a blank space) [Effects of the Invention] According to the present invention, it combines the excellent properties of polyamide and polypropylene, and in addition to its original low water absorption,
Molding properties (low warpage, low deformation.
成形サイクルはポリアミド樹脂と同等)及び諸物性(引
張強度、引張伸び(耐衝撃性)、耐熱変形)の改良され
たポリアミド樹脂組成物が得られる。A polyamide resin composition with improved molding cycle (equivalent to that of polyamide resin) and various physical properties (tensile strength, tensile elongation (impact resistance), heat deformation resistance) can be obtained.
したがって、本発明のポリアミド樹脂組成物は、エンジ
ニアリング樹脂、具体的には自動車の部品3ポンプのハ
ウジング、電気または電子部品さらにはそのコネクター
などの素材として幅広く有効な利用が期待される。Therefore, the polyamide resin composition of the present invention is expected to be widely and effectively used as an engineering resin, specifically as a material for automobile parts 3 pump housings, electric or electronic parts, and connectors thereof.
=28−=28-
Claims (1)
し単位を有する重合度2以上の重合体、 (3)一般式 ▲数式、化学式、表等があります▼ 〔式中、M^1はナトリウムあるいはカリウムを示し、
X、Yはそれぞれ ▲数式、化学式、表等があります▼あるいは▲数式、化
学式、表等があります▼ (ここで、R^1、R^2はそれぞれ水素もしくは炭素
数1〜6のアルキル基である。)を示す。〕で表わされ
るアルカリ金属含有有機リン化合物 および (4)一般式 ▲数式、化学式、表等があります▼ 〔式中、M^2はマグネシウムあるいはカルシウムを示
し、Zは ▲数式、化学式、表等があります▼あるいは▲数式、化
学式、表等があります▼ (ここで、R^1、R^2は前記と同じである。) を示す。]で表わされるアルカリ土類金属含有有機リン
化合物 よりなる群から選ばれた少なくとも一種の化合物を、前
記(A)、(B)、(C)の合計100重量部に対して
0.01〜3重量部配合したことを特徴とするポリアミ
ド樹脂組成物。Scope of Claims: (A) 100 parts by weight of polyamide resin, (B) 0.5 to 100 parts by weight of acid-modified polyolefin, (C) 5 to 150 parts by weight of polypropylene resin, and (D) (1) silicate mineral. , (2) General formula▲There are mathematical formulas, chemical formulas, tables, etc.▼ [In the formula, n is 2 or 4. ] A polymer with a degree of polymerization of 2 or higher and having a repeating unit represented by (3) General formula ▲ Numerical formula, chemical formula, table, etc. ▼ [In the formula, M^1 represents sodium or potassium,
X and Y each have a ▲ mathematical formula, chemical formula, table, etc. ▼ or ▲ a mathematical formula, chemical formula, table, etc. ▼ (Here, R^1 and R^2 are each hydrogen or an alkyl group having 1 to 6 carbon atoms. ). ] Alkali metal-containing organophosphorus compounds represented by (4) General formula ▲ Numerical formula, chemical formula, table, etc. ▼ [In the formula, M^2 represents magnesium or calcium, Z represents ▲ Numerical formula, chemical formula, table, etc. There is ▼ or ▲ there is a mathematical formula, chemical formula, table, etc. ▼ (Here, R^1 and R^2 are the same as above.) Indicates. ] at least one compound selected from the group consisting of alkaline earth metal-containing organic phosphorus compounds represented by 0.01 to 3 parts by weight per 100 parts by weight of the above (A), (B), and (C). A polyamide resin composition characterized in that it contains parts by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11363988A JPH01284552A (en) | 1988-05-12 | 1988-05-12 | Polyamide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11363988A JPH01284552A (en) | 1988-05-12 | 1988-05-12 | Polyamide resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01284552A true JPH01284552A (en) | 1989-11-15 |
Family
ID=14617336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11363988A Pending JPH01284552A (en) | 1988-05-12 | 1988-05-12 | Polyamide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01284552A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5795935A (en) * | 1993-12-28 | 1998-08-18 | Daicel Chemical Industries, Ltd. | Thermoplastic composition of polyester, polyamide and glycidyl-modified polyolefin |
US7138452B2 (en) | 2001-12-27 | 2006-11-21 | Lg Chem, Ltd. | Nanocomposite blend composition having super barrier property |
US8835542B2 (en) | 2009-04-30 | 2014-09-16 | Milliken & Company | Nucleating agent and thermoplastic compositions comprising the same |
-
1988
- 1988-05-12 JP JP11363988A patent/JPH01284552A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5795935A (en) * | 1993-12-28 | 1998-08-18 | Daicel Chemical Industries, Ltd. | Thermoplastic composition of polyester, polyamide and glycidyl-modified polyolefin |
US7138452B2 (en) | 2001-12-27 | 2006-11-21 | Lg Chem, Ltd. | Nanocomposite blend composition having super barrier property |
JP2006328426A (en) * | 2001-12-27 | 2006-12-07 | Lg Chem Ltd | Nanocomposite blend composition having excellent barrier property |
US8835542B2 (en) | 2009-04-30 | 2014-09-16 | Milliken & Company | Nucleating agent and thermoplastic compositions comprising the same |
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