JPH01278917A - Lead bending device for electronic parts - Google Patents

Lead bending device for electronic parts

Info

Publication number
JPH01278917A
JPH01278917A JP10578288A JP10578288A JPH01278917A JP H01278917 A JPH01278917 A JP H01278917A JP 10578288 A JP10578288 A JP 10578288A JP 10578288 A JP10578288 A JP 10578288A JP H01278917 A JPH01278917 A JP H01278917A
Authority
JP
Japan
Prior art keywords
revolution
bodies
electronic parts
bending
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10578288A
Other languages
Japanese (ja)
Inventor
Yoshihiko Furushima
Michio Osada
Original Assignee
T & K Internatl Kenkyusho:Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by T & K Internatl Kenkyusho:Kk filed Critical T & K Internatl Kenkyusho:Kk
Priority to JP10578288A priority Critical patent/JPH01278917A/en
Publication of JPH01278917A publication Critical patent/JPH01278917A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve the durability and bending accuracy of a device by equipping a specified number of bodies of revolution for pressure for bending leads of an electronic parts on axes and arranging necessary numbers of rock-suppress members at specified places in the circumferential place.
CONSTITUTION: On the side on which outer leads 2 of an electronic parts is bent and pressurized a specified number of bodies 4 of revolution for pressure are arranged on the axes 13 through bearing mechanisms. Further, necessary numbers of rock-suppress members 5 are arranged in the circumferential parts of the bodies 4 of revolution. When the electronic parts body A is fitted and supported by a die 6 and a pressurizing part 7 and a punch 8 is lowered, the bodies 4 of revolution bends the leads 2 as far as the bending angle. In this case, the bodies 4 of revolution is prevented surely from deforming, curving and rocking. Further, since the bodies 4 of revolution can be revolved through the bearing mechanisms, the whole device is improved in durability. Since the bodies of revolution are prevented from deforming and curving, the bending accuracy, too, is improved.
COPYRIGHT: (C)1989,JPO&Japio
JP10578288A 1988-04-28 1988-04-28 Lead bending device for electronic parts Pending JPH01278917A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10578288A JPH01278917A (en) 1988-04-28 1988-04-28 Lead bending device for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10578288A JPH01278917A (en) 1988-04-28 1988-04-28 Lead bending device for electronic parts

Publications (1)

Publication Number Publication Date
JPH01278917A true JPH01278917A (en) 1989-11-09

Family

ID=14416717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10578288A Pending JPH01278917A (en) 1988-04-28 1988-04-28 Lead bending device for electronic parts

Country Status (1)

Country Link
JP (1) JPH01278917A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5199469A (en) * 1990-08-31 1993-04-06 Mitsubishi Denki Kabushiki Kaisha Exterior lead forming device for semiconductor devices
US5626169A (en) * 1992-11-06 1997-05-06 Fico B.V. Device for bending leads of a lead frame
DE19638671A1 (en) * 1996-09-20 1998-04-02 Siemens Components A T Semiconductor chip housing leads deforming jig and method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166550A (en) * 1986-01-20 1987-07-23 Fujitsu Ltd Ic lead bending press
JPS6384056A (en) * 1986-09-29 1988-04-14 Toshiba Corp Equipment for molding lead

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166550A (en) * 1986-01-20 1987-07-23 Fujitsu Ltd Ic lead bending press
JPS6384056A (en) * 1986-09-29 1988-04-14 Toshiba Corp Equipment for molding lead

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5199469A (en) * 1990-08-31 1993-04-06 Mitsubishi Denki Kabushiki Kaisha Exterior lead forming device for semiconductor devices
US5626169A (en) * 1992-11-06 1997-05-06 Fico B.V. Device for bending leads of a lead frame
DE19638671A1 (en) * 1996-09-20 1998-04-02 Siemens Components A T Semiconductor chip housing leads deforming jig and method

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