JPH0125223B2 - - Google Patents
Info
- Publication number
- JPH0125223B2 JPH0125223B2 JP208483A JP208483A JPH0125223B2 JP H0125223 B2 JPH0125223 B2 JP H0125223B2 JP 208483 A JP208483 A JP 208483A JP 208483 A JP208483 A JP 208483A JP H0125223 B2 JPH0125223 B2 JP H0125223B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- motor
- ultrasonic vibration
- water jet
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 43
- 238000004140 cleaning Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 8
- 238000004528 spin coating Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【発明の詳細な説明】
本発明は、半導体装置の基板等に被覆を行うプ
リ洗浄付スピンコート法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a spin coating method with pre-cleaning for coating substrates, etc. of semiconductor devices.
一般に半導体装置の基板は研磨工程時に、その
表面がワツクス、油類等によつて汚染されるので
洗浄により前記汚染物を完全に除去し、清浄な基
板とすることは良質の半導体装置を生産するため
の不可欠の工程であることは周知である。したが
つて前記汚染物の除去には、トリクレン、洗剤あ
るいは水等を使用して超音波洗浄その他の洗浄法
等で洗浄を行う。この基板表面の清浄度が半導体
装置の品質および歩留りに大きく影響するので、
洗浄の終つた基板は、一旦クリーンルーム中に備
付けられた清浄な容器に保管されたのち、該容器
中に保管された基板をスピンコーターに移して、
たとえばレジスト等をスピンコートするのであ
る。ところが前記基板が保管中あるいは容器より
スピンコーターへ移す作業において、ゴミ等が付
着する懸念がある。このように基板にゴミ等が付
着した状態でスピンコートすると、被膜の剥離、
電食等が発生して、半導体装置の品質を低下させ
る原因となつていた。 Generally, the surface of semiconductor device substrates becomes contaminated with wax, oil, etc. during the polishing process, so cleaning to completely remove these contaminants and creating a clean substrate is the key to producing high-quality semiconductor devices. It is well known that this is an essential process for Therefore, to remove the above-mentioned contaminants, cleaning is performed by ultrasonic cleaning or other cleaning methods using trichloride, detergent, water, or the like. The cleanliness of this substrate surface greatly affects the quality and yield of semiconductor devices.
After the substrate has been cleaned, it is temporarily stored in a clean container provided in the clean room, and then the substrate stored in the container is transferred to a spin coater.
For example, a resist or the like is spin coated. However, there is a concern that dust and the like may adhere to the substrate while it is being stored or during transfer from the container to the spin coater. If the substrate is spin-coated with dust etc. attached to it, the coating may peel off or
Electrical corrosion and the like occur, which causes deterioration in the quality of semiconductor devices.
本発明は、前記の問題点を解決すべくなされた
もので、予め洗浄された基板にスピンコートを行
う直前に再度洗浄するようにした新規なるプリ洗
浄付スピンコート法を提供するものである。簡単
に述べると本発明は、回転軸に設けられた吸着端
に基板を吸着させた状態で基板を回転せしめ、回
転軸に設けた超音波振動機構を動作せめた状態で
水流噴射管からの水流噴射により基板を洗浄する
工程と、水流噴射を停止した後超音波振動を停止
する工程と、基板を乾燥する工程と、該基板を回
転させながらレジストを基板上にスピンコートす
る工程とを有することを特徴とするスピンコート
法により達成される。 The present invention has been made to solve the above-mentioned problems, and provides a novel spin coating method with pre-cleaning in which a pre-cleaned substrate is cleaned again immediately before spin coating. Briefly stated, the present invention rotates the substrate while adsorbing it to a suction end provided on a rotating shaft, and operates an ultrasonic vibration mechanism provided on the rotating shaft to generate a water stream from a water jet pipe. The method includes a step of cleaning the substrate by spraying, a step of stopping the ultrasonic vibration after stopping the water jet, a step of drying the substrate, and a step of spin-coating a resist on the substrate while rotating the substrate. This is achieved by a spin coating method characterized by:
垂直に配置されるモータの回転軸の先端に設け
られる吸着端に基板を吸着させた状態で基板を回
転し、かつ超音波振動を伝達させるのは、超音波
振動発生板上に駆動モータを固定し、該駆動モー
タの垂直な固定軸を中空の吸引管中に収容し、該
軸先端に該吸引管と通気する吸着端を装着するこ
とで容易に実施できる。 The drive motor is fixed on the ultrasonic vibration generation plate to rotate the substrate while it is attracted to the suction end provided at the tip of the rotating shaft of the vertically arranged motor, and to transmit ultrasonic vibrations. However, this can be easily carried out by housing the vertical fixed shaft of the drive motor in a hollow suction tube and attaching a suction end that communicates with the suction tube to the tip of the shaft.
かくて吸着端に吸着された基板にゴミ等が付着
する危険なく所定レジストのスピンコートを行う
ことができる。 In this way, a predetermined resist can be spin-coated without the risk of dust or the like adhering to the substrate attracted to the suction end.
以下図面を参照しながら本発明の要旨を具体的
に説明する。全図を通じ同一符号は同一対象物を
示す。 The gist of the present invention will be specifically explained below with reference to the drawings. The same reference numerals indicate the same objects throughout the figures.
第１図は本発明の１実施例を説明するための模
式的斜視図で、第２図はその要部を断面とした側
面図である。１はガラス、磁器等からなる基板、
２は回転軸２１に付設した吸着端２２を介して前
記基板１を回転させるモータ、３は前記回転軸２
１の外周に付設し、図示しない真空ポンプにより
吸引管３１を介して、前記基板１を吸着支持する
吸着管、４は超音波振動機構、５は前記基板１を
洗浄する水流噴射管、６は不活性ガス供給管で、
７は被覆材料吹付管である。 FIG. 1 is a schematic perspective view for explaining one embodiment of the present invention, and FIG. 2 is a side view showing a main part thereof in cross section. 1 is a substrate made of glass, porcelain, etc.;
2 is a motor that rotates the substrate 1 via a suction end 22 attached to the rotating shaft 21; 3 is the rotating shaft 2;
1 is attached to the outer periphery of the substrate 1, and 4 is an ultrasonic vibration mechanism; 5 is a water jet pipe for cleaning the substrate 1; With an inert gas supply pipe,
7 is a coating material spray pipe.
予め超音波洗浄等により清浄保管された基板１
をモータ回転軸２１の外周に付設した吸着管３に
回転自在で、モータ回転軸２１に付設した吸着端
２２に載置し、図示しない真空ポンプを動作せし
め、吸引管３１を介して前記基板１を吸着せしめ
る。これら一連の作業および基板１の保管は何れ
もクリーンルーム中で行なわれ、しかも作業者は
防塵服で作業を行うが、このような状態でも塵芥
が付着する惧れがある。そこで前記基板１を吸着
した状態でモータ２を回転せしめて、基板１を矢
印Ａ方向に回転せしめると同時に超音波振動機構
４を動作せしめ、超音波発振子からの振動を超音
波振動機構４の振動面４′、モータ２、回転軸２
１、およびその先端に設けられた吸着端２２を介
して前記基板１に回転と振動を同時に与えながら
スピンコートを行うに先立つて、水流噴射管５に
水を供給して水流噴射により基板１に付着した塵
芥を洗浄したるのち、超音波振動を止めて、基板
１を充分乾燥する。そして引続きモータ２を回転
させながら不活性ガスたとえば窒素N2等を供給
管６より供給しながら、不活性ガス雰囲気中にお
いて被覆材料たとえばレジスト等を吹付け所定の
被膜を形成するようにしたものである。 Substrate 1 that has been kept clean by ultrasonic cleaning etc.
is rotatably mounted on a suction tube 3 attached to the outer periphery of the motor rotation shaft 21, and placed on the suction end 22 attached to the motor rotation shaft 21, and a vacuum pump (not shown) is operated to remove the substrate 1 through the suction tube 31. Let it absorb. This series of operations and the storage of the substrate 1 are all performed in a clean room, and the workers wear dust-proof clothing, but there is a risk that dust will adhere even in such conditions. Therefore, with the substrate 1 adsorbed, the motor 2 is rotated to rotate the substrate 1 in the direction of arrow A, and at the same time, the ultrasonic vibration mechanism 4 is operated, and the vibrations from the ultrasonic oscillator are transferred to the ultrasonic vibration mechanism 4. Vibration surface 4', motor 2, rotating shaft 2
1, and a suction end 22 provided at the tip of the suction end 22 provided at the tip thereof. After cleaning the attached dust, the ultrasonic vibration is stopped and the substrate 1 is sufficiently dried. Then, while continuing to rotate the motor 2 and supplying an inert gas such as nitrogen N 2 through the supply pipe 6, a coating material such as resist is sprayed in the inert gas atmosphere to form a predetermined film. be.
超音波振動機構を動作せしめ水流噴射により基
板を洗浄した場合、５″ウエハでのゴミの出現率
は、0.1個であつた。 When the ultrasonic vibration mechanism was operated and the substrate was cleaned by water jet, the appearance rate of dust on a 5'' wafer was 0.1.
一方、水流噴射のみにより基板を洗浄した場合
５″ウエハでのゴミの出現率は２〜３個であつた。 On the other hand, when the substrate was cleaned by water jet only, the appearance rate of dust on a 5'' wafer was 2 to 3 pieces.
このように超音波振動と水流噴射による基板洗
浄との併用効果により極めて洗浄効果を高めるこ
とができる。 In this way, the combined effect of ultrasonic vibration and substrate cleaning by water jet can greatly enhance the cleaning effect.
以上の説明から明らかなように、本発明に係る
プリ洗浄付スピンコーターによれば、洗浄後基板
に付着した塵芥を再度洗浄により除去したのち、
基板へのコーテイングを行うことなるので、半導
体装置としての高品質が期待できるとともに、良
品率の向上に寄与する所が大である。 As is clear from the above description, according to the spin coater with pre-cleaning according to the present invention, after removing the dust adhering to the substrate after cleaning by cleaning again,
Since the coating is applied to the substrate, high quality semiconductor devices can be expected, and it greatly contributes to improving the rate of non-defective products.
第１図は本発明によるスピンコートの一実施例
を説明するための模式的斜視図、第２図は要部断
面とした側面図を示す。
図において、１は基板、２はモータ、３は吸着
管、４は超音波振動機構、５は水流噴射管、６は
不活性ガス供給管、７は被覆材料吹付管、２１は
モータ回転軸、３１は吸引管、を示す。
FIG. 1 is a schematic perspective view for explaining an embodiment of spin coating according to the present invention, and FIG. 2 is a side view showing a cross section of a main part. In the figure, 1 is a substrate, 2 is a motor, 3 is an adsorption tube, 4 is an ultrasonic vibration mechanism, 5 is a water jet tube, 6 is an inert gas supply tube, 7 is a coating material spray tube, 21 is a motor rotation shaft, 31 indicates a suction tube.
Claims (1)
真空ポンプに接続される吸着管と該吸着管に回転
自在で、該モータ回転軸に付設した基板を載置・
吸着せしめる吸着端と、 該モータに、該モータ回転軸と対向する側に付
設され、該モータ、該モータ回転軸、該吸着端を
介して該基板に超音波振動を伝達せしめる超音波
振動機構と、 該基板上部に設けられ該基板を洗浄する水流噴
射部と基板を不活性ガス雰囲気とする不活性ガス
供給管と被覆材料吹付管とを有するスピンコータ
ーを用い、 該吸着端に予め洗浄された基板を吸着させた状
態で基板を回転せしめ、該超音波振動機構を動作
せしめた状態で水流噴射管からの水流噴射により
基板を洗浄する工程と、水流噴射を停止した後超
音波振動を停止する工程と、基板を乾燥する工程
と、該基板を回転させながらレジストを基板上に
スピンコートする工程とを有することを特徴とす
るスピンコート法。[Scope of Claims] 1. A motor, a suction tube connected to a vacuum pump via a suction tube attached to the outer periphery of the motor rotation shaft, and a substrate rotatably attached to the motor rotation shaft mounted on the suction tube. Place/
an ultrasonic vibration mechanism that is attached to the motor on a side opposite to the motor rotation shaft and that transmits ultrasonic vibration to the substrate via the motor, the motor rotation shaft, and the suction end; , using a spin coater having a water jet unit installed on the top of the substrate for cleaning the substrate, an inert gas supply pipe for creating an inert gas atmosphere around the substrate, and a coating material spraying pipe, and applying a pre-cleaned surface to the suction end. A process of rotating the substrate with the substrate adsorbed, cleaning the substrate with a water jet from a water jet pipe while operating the ultrasonic vibration mechanism, and stopping the ultrasonic vibration after stopping the water jet. A spin coating method comprising: a step of drying a substrate; and a step of spin-coating a resist onto a substrate while rotating the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP208483A JPS58130532A (en) | 1983-01-10 | 1983-01-10 | Spin coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP208483A JPS58130532A (en) | 1983-01-10 | 1983-01-10 | Spin coating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58130532A JPS58130532A (en) | 1983-08-04 |
| JPH0125223B2 true JPH0125223B2 (en) | 1989-05-16 |
Family
ID=11519479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP208483A Granted JPS58130532A (en) | 1983-01-10 | 1983-01-10 | Spin coating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58130532A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0191426A (en) * | 1987-10-02 | 1989-04-11 | Shiotani Seisakusho:Kk | Spin coating device |
| US10090189B2 (en) | 2013-11-19 | 2018-10-02 | Ebara Corporation | Substrate cleaning apparatus comprising a second jet nozzle surrounding a first jet nozzle |
| JP2015099852A (en) * | 2013-11-19 | 2015-05-28 | 株式会社荏原製作所 | Substrate cleaning device and substrate processing device |
-
1983
- 1983-01-10 JP JP208483A patent/JPS58130532A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58130532A (en) | 1983-08-04 |
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