JPH01242742A - Copper alloy for electronic equipment - Google Patents

Copper alloy for electronic equipment

Info

Publication number
JPH01242742A
JPH01242742A JP6851188A JP6851188A JPH01242742A JP H01242742 A JPH01242742 A JP H01242742A JP 6851188 A JP6851188 A JP 6851188A JP 6851188 A JP6851188 A JP 6851188A JP H01242742 A JPH01242742 A JP H01242742A
Authority
JP
Japan
Prior art keywords
copper alloy
electronic equipment
balance
inevitable impurities
electric conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6851188A
Other languages
Japanese (ja)
Inventor
Kenji Kubozono
Koji Nakajima
Shinichi Iwase
Takefumi Ito
Kimio Hashizume
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6851188A priority Critical patent/JPH01242742A/en
Publication of JPH01242742A publication Critical patent/JPH01242742A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain the title copper alloy having excellent characteristics of both strength and electric conductivity by forming it with the compsn. contg. each prescribed amt. of Ni, P and Sn and the balance consisting of Cu with inevitable impurities.
CONSTITUTION: The above copper alloy contains, by weight, 1.0-4.0% Ni, >0.2-0.8% P, 0.1-3.0% Sn and the balance consisting of Cu with inevitable impurities. By the incorporation of Ni, P and Sn, the copper alloy has high strength level, comparatively excellent electric conductivity and the characteristics extremely useful to the miniaturization of the parts for electric equipment. In this way, the alloy is not only applicable to the wide uses such as the lead frame material of an integrated circuit, connector, relay and switch, but also is inexpensive. In the copper alloy, strength level can furthermore be increased by the additional incorporation of 0.03-0.5% Zn.
COPYRIGHT: (C)1989,JPO&Japio
JP6851188A 1988-03-23 1988-03-23 Copper alloy for electronic equipment Pending JPH01242742A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6851188A JPH01242742A (en) 1988-03-23 1988-03-23 Copper alloy for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6851188A JPH01242742A (en) 1988-03-23 1988-03-23 Copper alloy for electronic equipment

Publications (1)

Publication Number Publication Date
JPH01242742A true JPH01242742A (en) 1989-09-27

Family

ID=13375814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6851188A Pending JPH01242742A (en) 1988-03-23 1988-03-23 Copper alloy for electronic equipment

Country Status (1)

Country Link
JP (1) JPH01242742A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205643A (en) * 1989-02-01 1990-08-15 Hitachi Cable Ltd High strength copper alloy for lead frame
JPH04236736A (en) * 1991-01-17 1992-08-25 Dowa Mining Co Ltd Copper-base alloy for terminal and terminal using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205643A (en) * 1989-02-01 1990-08-15 Hitachi Cable Ltd High strength copper alloy for lead frame
JPH04236736A (en) * 1991-01-17 1992-08-25 Dowa Mining Co Ltd Copper-base alloy for terminal and terminal using the same

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