JPH01234150A - Polishing apparatus - Google Patents

Abstract

PURPOSE:To conduct a teaching process easily and in a short time by providing control means for deciding a polishing area according to stored grinding stone position data, setting a polishing pattern in the polishing area, moving the grinding stone in the polishing area according to the polishing pattern to polish a machining surface of a work. CONSTITUTION:Position designating means 31 are operated to designate plural positions of a grinding stone, and the respective position data are stored by storing means 37. According to the stored two or more different position data, an area formed by the respective points on machining surfaces corresponding to the respective positions data are decided as polishing area by polishing area deciding means (CPU) 35. A polishing pattern in the polishing area is set by setting means 32, and according to the polishing pattern, a grinding stone is moved in the polishing area by the polishing control means (CPU) 30 to polish a machining surface of a work.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a polishing device such as a mold grinder, and more specifically to a polishing device that automatically performs the polishing process of a workpiece. .

[Prior art] Japanese Patent Application Laid-Open No. 62-24165 filed by the same applicant as this application
No. 0 discloses that a grindstone is moved along a desired polishing path based on a manual device of an operating member in a teaching device,
A polishing method is disclosed in which the polishing path is input into a storage means and a grindstone is moved multiple times according to the polishing path to perform playback polishing.

[Problems to be Solved by the Invention] However, in the above-mentioned teaching process, teaching must be performed by sequentially inputting data of the polishing path into the storage means while continuously moving the grindstone on the desired polishing path. For example, when the machining surface has a simple shape, it is necessary to simply count the path many times, which is not efficient, and when the linearity of the teaching path is required, manual operation will reduce the teaching path. Fluctuations may occur, which may cause problems.

This invention was made to solve the above problems, and its purpose is to improve work efficiency by easily and quickly performing the teaching process, and to ensure linearity of the teaching path. The purpose of the present invention is to provide a polishing device that can perform the following steps.

[Means for Solving the Problems] A polishing apparatus of the present invention includes a grindstone for polishing a processed surface of a workpiece, a plane setting means for setting a plane on which the grindstone is moved, and a plane setting means. a position specifying means for specifying the a number of positions of the grindstone on a set plane; a storage means for storing position data of the grindstone based on the operation of the position specifying means; polishing area determining means for determining, as a polishing area, an area formed by each point on the processing surface corresponding to each position data based on the above position data; and polishing in the polishing area determined by the polishing area determining means. A polishing pattern setting means for specifying a pattern, and a polishing area determined by the polishing area determining means based on the polishing pattern set by the polishing pattern setting means, and the grindstone is moved to polish the machined surface of the workpiece. and a polishing control means for polishing.

In another invention, there is provided a grindstone for polishing a processed surface of a workpiece, a plane setting means for setting a plane on which the grindstone is moved, and a plurality of grindstones on the plane set by the plane setting means. a position specifying means for specifying a position, a storage means for storing position data of the grindstone based on the operation of the position specifying means, and each position data based on two or more position data stored in the storage means. and a pattern setting means for setting a polishing pattern in the polishing area determined by the polishing area determining means. , a reference side setting means for setting a reference side connecting a pair of adjacent positions among the plurality of positions specified by the position specifying means; and a reference side setting means among the plurality of positions set by the position specifying means. target point determining means for determining, as a target point, a position where the height of a triangle having the base side set by the reference side as the base and each position as the apex is the highest; and the reference side and target point set by the reference side setting means. Moving the grindstone based on the polishing pattern set by the pattern setting means so as to gradually approach the target point determined by the determining means from one side to the other, and polishing within the polishing area. There are some that have the means.

The above-mentioned grindstone moving means moves the grindstone along the reference side, approaches the target point by a predetermined distance from one end of the reference side within the polishing area, and further moves the grindstone onto the boundary of the polishing area by a distance shorter than the predetermined distance. Move it away from the target point by a distance and move it to the boundary facing the reference side and the target point,
Some machines repeat this process to gradually bring the grindstone closer to the target point.

Further, the reference side setting means sets a plurality of reference sides, the target point determining means determines a plurality of target points corresponding to each reference side, and the grindstone moving means sequentially performs polishing using each reference side as a reference. You may do so.

On the other hand, in addition to the above-mentioned polishing device, there are provided a grindstone for grinding the processed surface of the workpiece, a plane setting means for setting a plane on which the grindstone is moved, and a grindstone for setting a plane on which the grindstone is moved. a position specifying means for specifying a plurality of positions; a storage means for storing position data of the grindstone based on the operation of the position specifying means; polishing area determining means for determining, as a polishing area, an area formed by each point on the machined surface corresponding to the position data; 0] a pattern setting means for setting a polishing pattern in the maro area, a pattern angle setting means for setting a plurality of angles of the polishing pattern set by the pattern setting means with respect to the polishing area, and a pattern angle setting means for setting the polishing pattern in the polishing area. There is also a polishing apparatus that includes a polishing control means that moves a grindstone within a polishing region based on a plurality of angles set by the means, and polishes the inside of the polishing region.

[Operation] When a plurality of positions of the grindstone are specified based on the operation of the position specifying means, data for each position is stored in the storage means, and the teaching process is performed easily and in a short time. Based on two or more different positional data stored in the storage means, the polishing area determining means determines as a polishing area an area formed by each point on the processing surface corresponding to each positional data.

Then, the polishing pattern setting means allows the polishing pattern to be set in the polishing area. 1JIe: When the pattern is set, the polishing control means moves the grindstone in the polishing area determined by the polishing area determining means based on the polishing pattern, and polishes the processed surface of the workpiece.

If polishing is started from either the reference side or the target point and finished from the other, everything in the polishing area will be polished and there will be no unpolished areas.

When the whetstone is moved in a triangular manner, the path of movement of the whetstone is not constant, so uneven polishing is less likely to occur.

When polishing is performed sequentially based on a polishing pattern using a plurality of reference sides as a reference up to each target point, each polishing pattern is polished at an angle to each other, and uneven polishing does not occur.

A polishing pattern is executed based on a plurality of angles set by the pattern angle setting means. Therefore, the polishing patterns are polished at angles to each other, and uneven polishing does not occur.

[Example] Hereinafter, a first example in which the present invention is embodied in a mold polishing machine will be described based on FIGS. 1 to 7.

As shown in Fig. 1, an X-direction movable body 2 is moved horizontally (left and right) by an X-movement motor 3 to the Freno 1 of the mold polishing machine.
The X-direction moving body 2 is provided so as to be movable in the
A direction moving body 4 is supported by a Y movement motor 5 so as to be movable in a horizontal (back and forth) direction orthogonal to the moving direction of the X direction moving body 2. A Z-direction moving shaft 6 is attached to the X-direction moving body 4 so as to be movable vertically (up and down) by a Z-movement motor 7, and a grindstone head 8 is attached to the lower end thereof.

The whetstone head 8 includes a fixed bracket 9 and a rotating base 10, and the whetstone 1 is attached to the rotating base 10 via a slider 11.
An air cylinder 12 for pressing the mold 4 against a mold 15 as a workpiece is movably attached. A grindstone 14 is attached to the air cylinder 12 via an air motor 13, and is swung or rotated as the air motor 13 rotates to grind, for example, the XY machining surface 15a of the mold 15. 1JfIp
: It is supposed to be done.

The control panel 16 attached to the frame 1 has a cable 1
A portable remote-controllable teaching device 18 is connected via 7. This device 18 is equipped with an operating lever 19 that can be tilted within a 360 degree range, and the direction and amount of tilting can be determined by a first axis encoder 20 disposed within the device 18.
The signal is detected by a composite signal of the encoder 21 and the second axis encoder 21 (see FIG. 2).

The teaching device 18 also includes a third axis switch 22 that drives the Z-movement motor 7 to raise and lower the grindstone 14, an end switch 23 for ending the teaching process, and a start switch for starting the playback process. 24 are provided.

As shown in FIG. 2, the control panel 16 includes a mode selection switch 25 for selecting one of the manual polishing mode, teaching mode, and playback mode, and a mode selection switch 25 for selecting any two of the XYZ directions. A plane selection switch 26 as plane setting means for setting the machining surface of the mold 15, a start switch 27 for starting the teaching or playback process, and an end switch 28 for ending each process are provided. Lete is here.

In addition, the control panel 16 is equipped with a grindstone 1 in the teaching mode.
A teaching selection switch 29 for selecting either point teaching of the movement end point of No. 4 or line teaching of the movement path of the grindstone 14, a point number setting switch 30 for setting the number of points in point teaching, and a grindstone in point teaching. A position designation switch 31 as a position designation means for designating two or more 14 different positions, and a polishing pattern G1 to G in the playback process after point teaching.
4 (see FIGS. 3 to 6), a pattern selection switch 32 serves as a polishing pattern setting means for setting the polishing pattern, and a grindstone 14 is used during the playback process after point teaching.
displacement fit (for example, the line segment PIP in FIG. 8(a)
2 and line segment P+tP2. distance jl or line segment PIIP
A shift amount setting device 33 is provided for inputting the distance j2) between the line segment P21 and the line segment P22, and a shift amount setting device 33 is provided for inputting the distance j2) between the line segment P21 and the line segment P22. A display device (as shown) is provided for displaying various operating states such as a setting device 34, a teaching process, and a pullback process.

As shown in FIG. 2, each switch 22 of the teaching device 18 is connected to the input side of a central processing unit (hereinafter referred to as CPU) 35 that constitutes a polishing area determining means and a polishing control means built into the control panel 16. 24 and each of the encoders 20 and 21 are connected thereto, as well as each switch 25 to 32 of the control panel 16. Further, the x, y, z and rotation motors 3 and 5 are provided on the output side of the CPU 35.
7 and the air motor 13 are connected, and the CPU 35 outputs drive and stop signals to these. Note that the display device is connected to the output side of the CPU 35.

The CPU 35 also stores a program for controlling the operation of the entire mold polishing machine and the polishing patterns 01 to G4.
(See Figures 3 to 6) A read-only memory (ROM) 36 that stores programs, etc. corresponding to the data, position data of the end point of the movement of the grindstone 14 in the point teaching process, data of the movement path of the grindstone 14 in the line teaching process, and points. Grinding wheel 1 set by shift amount setting device 33 for playback process after teaching process
The grinding wheel 14 is set by the displacement amount and number of times setting device 34 of 4.
A random access memory (RAM) 37 is connected as a storage means for rewritably storing the number of times of movement.

Each time the position designation switch 31 is operated in the point teaching process, the CPU 35 stores data corresponding to the position of the grindstone 14 at that time in the RAM 37, and when the number of position data reaches the number of points set by the point number setting switch 30. Then, this teaching process is completed.

Further, when the start switch 24 or 27 is operated, the CPU 35 performs RA in the point teaching process.
The area formed by each point on the processing surface 15a corresponding to each position data stored in M37 is determined as the polishing area. Note that in this example, the area refers to a line segment connecting the two points when there are two points on the processing surface, and a line segment connecting the two points when there are three or more points on the processing surface. In addition, the CPU 35 moves the grindstone 14 based on one of the polishing patterns G4 (for example, shown in FIG. 6) set by the pattern selection switch 32 and the displacement amount set by the shift amount setting device 33. It is moved within the polishing area on the processing surface 15a to perform playback polishing.

Further, the CPU 35 stores the polishing path data of the grindstone 14 in the line teaching process in the RAM 37, and uses the ms stored in the RAM 37 in the subsequent playback process.
The grindstone 14 is driven along the machining surface 15a based on the path data, and the grinding wheel 14 is polished by a grinding wheel.The CPU 35 is equipped with a counter 35a that counts the number of times the grindstone 14 is moved. When the number of movements of the grindstone 14 in the back polishing process reaches a predetermined number,
The playback process is terminated.

Next, the operation of polishing the mold 15 using the mold polishing machine configured as described above will be described with reference to the flowcharts shown in FIGS. 7(a) and 7(b).

First, the CPU 35 waits for the operation of the mode selection switch 25 (step S1, hereinafter referred to as S1), and when the teaching mode is selected, the process proceeds to 82.

In S2, the CPU 35 waits for the operation of the teaching selection switch 29, and when point teaching is selected, the process proceeds to 83. In the subsequent S3, two axes, e.g., X and Y, are selected by the plane selection switch 26, and the mold 15 is processed in XY Surface 15a
is set, the process proceeds to 84. If the point number I is set to, for example, [3] by the point number setting switch 30 in this S4, the CPU 35 sets the start switch 2 in S5.
7, and when the start switch 27 is operated, the process proceeds to S6, where the point count value i is set to [0] and the point teaching process is started.

As shown in FIG. 1, the grindstone 14 is placed at the teaching start position, and the air cylinder 12 moves it to
When the air motor 13 is started in a state in which it is in pressure contact with a, and the operating lever 19 of the teaching device 18 is tilted in a desired direction, a detection signal corresponding to the tilting direction and amount is outputted from each encoder 20.21 to the CPU 35. Ru.

In S7, the CPU 35 performs X based on the detection signal.

A drive signal is output to the Y movement motor 3.5, and each motor 3.
5 to move the grindstone 14. Then, in S8, the CPU 35 waits for the position designation switch 31 to be pressed, and when the position designation switch 31 is operated, the process proceeds to 89 to position the grindstone 14 at the position corresponding to the current position Pt (see FIG. 8(a)). 0 then CP to store data in RAM37
U35 adds [1] to the point count value l in 310, and adds point count value 1 and point number 1 in 811.
If it is determined that i≧■ is not true, the process moves to S7, repeats the routine from 87 to 311, and stores other positions P2 and Ps of the grindstone 14 (see FIG. 8(a)) in the RAM.
37 to be memorized. Then, in Sll, CPU35 is l≧
If it is determined that it is I, the point teaching process is ended.

If the CPU 35 determines in S2 that the teaching selection switch 29 has not been operated for a predetermined period of time, the CPU 35 determines that line teaching has been selected and proceeds to S12.In the subsequent S13, the plane selection switch 26 selects two axes, for example, X and Y. 3 when the XY processing surface 15a of the mold 15 is set.
Step 14 follows. At step 314, the CPU 35 waits for the operation of the teaching selection switch 29, and when the start switch 27 is operated, the line teaching process is started.

Then, as shown in FIG. 1, the grindstone 14 is placed at the teaching start position, the air motor 13 is started with the grindstone 14 pressed against the XY machining surface 15a by the air cylinder 12, and the operating lever 19 of the teaching device 18 is moved to the desired position. When the tilting direction is tilted, a detection signal corresponding to the tilting direction and tilting amount is sent from each encoder 20.21 to the CPU 35.
is output to. - At 315, the CPU 35 performs X based on the detection signal.

A drive signal is output to the Y movement motor 3.5, and each motor 3,
5 and rotate the grindstone 14 as shown by the solid line in FIG.
, Y directions, and the polishing path data of the grindstone 14 is stored in the RAM 37. Furthermore, this S1
When the third axis switch 22 is operated at step 5, the grindstone 14 is moved in the Z direction in FIG. 1 by the rotation of the Z movement motor 7.
Polishing path data in the third axis direction is also stored in the RAM 37.

At 816, the CPU 35 waits for the end switch 28 to be operated, and when the end switch 28 is operated, the line teaching process ends.

Then, the CPU 35 waits for the operation of the mode selection switch 25, and when the playback mode is selected in S17,
The process proceeds to S818, waits for the pattern selection switch 32 to be pressed, and when the pattern selection switch 32 selects, for example, the polishing pattern G4 shown in FIG. 6, the process proceeds to S19.
In the following S19, the shift amount setter 33 sets the displacement jl and J2 of the grindstone 14 in the polishing pattern G4, and then the process proceeds to S20.

In S20, the CPU 35 waits for the suppression operation of the start switch 27, and when the start switch 27 is operated, the CPU 35
The CPU 35 sets the point count value j to [01 and proceeds to S22. In the following S22, the CPU 35 stores the grindstone 1 stored in the RAM 37 in the point teaching process of S3 to S11.
Everyone on the machined surface 15a based on the position data corresponding to the three positions (P1 to ps) of 4! The CPU 35 determines the area having vertices from pt to Ps as the polishing area E, and drives the X and Y movement motors 3.5 based on each position data to move the grindstone 14 as shown in FIG. 8(a). polishing pattern G
4 on the XY processing surface 15a and polishing area E.
Polish the inside.

For polishing in this polishing area E, first, the CPU 35
4 from position M to position PL [after moving towards P2,
A line segment P21 at a distance j1 parallel to the line segment PIP2 and its intermediate point Q1 are calculated, and the grindstone 14 is moved toward the intermediate point Q1 from the position P2. Thereafter, the CPU 35 calculates a line segment P+2P*t that is parallel to the line segment P++P□ and has a distance j2 toward the line segment PtPt, and moves the grindstone 14 from the point Q1 toward the position M P t x. From then on, do the same thing and set the CPU
35, the distance is 1st. Line segment P tmP 2a (
n is a natural number), and line segment P t2m-IP 22m-1
The midpoint of the grinding wheel 14 is calculated based on the calculated data.
is moved and the inside of the polishing area E is polished.

When the polishing based on the line segment PtPt is completed, the CPU 35 adds [1] to the point count j in 323, and compares the point count j with the point number ■ in 324, and if j≧■ is not satisfied, the CPU 35 adds [1] to the point count j in 323. When the determination is made, the process moves to S22 and repeats the routine from 87 to S11, and the steps shown in FIG. 8(b) and (
As shown in c), the grindstone 14 is moved based on the line segment PxPs and the line segment PsPt based on the polishing pattern G4, respectively, to polish the inside of the polishing area E of the XY processing surface 15a.

Then, when the CPU 35j and kS24 determine that j≧I, the playback process ends.

Further, if the CPU 35 determines in S18 that the pattern selection switch 32 has not been operated for a predetermined period of time, the process proceeds to 326.
In this S26, when the required number of times M of movement of the grindstone 14 is set by the number setting device 34 of the control panel 16, that value is stored in the RAM.
37. Then, in S27, the CPU 35 activates the start switch 24 of the teaching device 18 or the control panel 16.
When the start switch 27 is operated, the count value m of the counter 35a is set to [0] in S28, and the process proceeds to 329.
In step 29, the CPU 35 reads out the data of the polishing path 1'' of the grindstone 14 stored in the line teaching process tRAM 37 in steps 812 to S16 in the reverse order of input, and based on the data, controls the X, Y movement motor 3.5 or 2 movement motor. 7 to move the grindstone 14 on the XY processing surface 15a.

Next, the CPU 35 moves the grindstone 14 to the polishing path T at 830.
When reaching one end of the counter 35a, the count value m of the counter 35a becomes [
1] and compares the count value m of the counter 35a with the set number of movements M in 331. If it is determined that m≧M is not found, the process moves to 829 and repeats the routine in 329.30, and in S31 If it is determined that m≧Mi', the playback process ends.

In this mold polishing machine, the mold 15 can also be polished by setting the manual polishing mode at 825 using the mode selection switch 25.

Now, in this embodiment, when polishing the machined surface in any two directions of the XYZ directions, after selecting the teaching mode with the mode selection switch 25, selecting point teaching with the teaching selection switch 29, and pressing the position designation switch. Based on the position data of three or more grindstones 14 specified in step 31, an area having each point on the processing surface 15a as the apex is determined as a polishing area E, and the inside of the polishing area E is formed into one of polishing patterns 01 to G4. Since the grinding wheel is ground based on the grinding wheel, it is only necessary to teach the moving end points P1 to P3 of the grinding wheel 14, and there is no need to move the grinding wheel 14 over the entire movement path, so the teaching process can be performed easily and in a short time. can improve work efficiency.

Further, in this embodiment, when the position data of the grindstone 14 stored in the RAM 37 is 3 or more, the polishing patterns 01 to G
Since the inside of the polishing area E is polished based on each line segment connecting two points adjacent to each other based on any of the above, the polishing direction can be made random, and the occurrence of unevenness on the finished surface can be prevented. This enables uniform and highly accurate polishing.

Furthermore, in this embodiment, the grindstone 1 stored in the RAM 37
When there are two position data in 4, polishing is performed along the line segment connecting the two points corresponding to the position data, so if linearity of the polishing path, that is, the teaching path is required, It is possible to prevent fluctuations that are likely to occur during manual operation of the operating lever 19 and ensure linearity.

In addition, the mold milling machine of this embodiment has point teaching that memorizes only the end point of the movement of the grindstone 14.
It is also possible to perform line teaching that memorizes the entire movement path of No. 4, which is particularly effective when the machined surface has a complex shape with unevenness.

Next, a second embodiment in which the present invention is embodied in another mold milling machine will be described with reference to FIGS. 10 to 17.

Note that the same parts as in the first embodiment are given the same numbers, and their explanations will be omitted.

, the mold polishing machine of this embodiment has only the function of point teaching and its playback polishing, and for playback polishing, as in the first embodiment, line segments dividing the polishing area E (for example, PIP4 ) is the edge specification for polishing based on? It is equipped with iJI polishing and angle specified polishing which performs polishing according to a preset angle.

In addition, as shown in FIG. 10, the control panel 16 of the mold milling machine
In the control panel 16 of the first embodiment, the number setting device 34 and the teaching selection switch 29 are omitted, and instead, both ends of a line segment (reference side) that is a reference in side specified polishing are specified. A double end point setting switch 38 as a reference side setting means for setting the same reference side by using the same reference side, a reference side number setting switch 39 for setting the number of the same reference side, and a shift amount setting device 33 in the first embodiment. , a division number setting switch 40 for determining the polishing density of the polishing area E, a pattern angle setting switch 41 as a pattern angle setting means for setting the angle of the polishing pattern with respect to the polishing area E in the angle specified polishing, and a pattern angle setting switch 41 as a pattern angle setting means for setting the angle of the polishing pattern with respect to the polishing area E in the angle specified polishing. A polishing number setting switch 42 for setting the number of polishing times is added. Furthermore, the mode selection switch 25 of the mold polishing machine of this embodiment
is designed to select between teaching mode and playback mode, and between edge-specified polishing and angle-specified polishing.

Further, a target point determining means and a grindstone moving means are added to the CPU 35 built into the control panel.

Then, in the playback polishing of side specified polishing, when the CPU 35 inputs both ends of a specific side among the plurality of sides that partition the polishing area E using the both end point setting switch 38,
The data is stored in RAM3 using the side connecting the same positions as the reference side.
7, and set a specific position as a reference point among the positions forming the polishing area E, determine a polishing path from the reference side to the target point based on a predetermined procedure described later, and Polishing is performed within E.

Further, in the playback polishing of angle specified polishing, when an angle is input by the pattern angle setting switch 41, the CPU 35 stores the data in the RAM 37 as an angle for the polishing pattern input at the same time, and performs polishing. In some cases, polishing is performed according to that angle.

Further, the ROM 36 stores each polishing pattern 05 to G8 as shown in FIGS. 11 to 14 and a line segment A serving as an angle reference, and the CPU 35 performs polishing in accordance with these polishing patterns in both polishing steps. In angle specified polishing, the angle of the pattern to be polished is determined using the line segment A as a reference.

Next, the operation of polishing the mold 15 using the mold polishing machine configured as described above will be described with reference to the flowchart shown in FIG. 17.

The teaching mode of the mold milling machine of this embodiment is almost the same as the teaching mode of the mold milling machine of the first embodiment, except that line teaching is omitted as described above. In other words, the CPU 35 operates as shown in FIG.
As shown in a), in S51, the mode selection switch 25 is
When the teaching mode is selected, two axes are selected in S52, and the number of points 1 is set to, for example, "7" by the point number setting switch 30 in S53. Then, as shown in FIG. 15<a), the CPU 35 stores position data (P+ to P7) in numbers 355 to 860 corresponding to the number of points 1.

Further, if the teaching mode is not selected within the predetermined time in step 351, the CPU 35 proceeds to S61.
As shown in FIG. 15(b), CP tJ 35 is 36
If base designated polishing is selected in Step 1 and the number T of reference sides is set to, for example, "2" by the reference side number setting switch 39 in S62, the counter value t is set to "0" in S63.
In S64, the PU35 selects the both end points U, Vt of the reference side (in this case, the P2
When Uo corresponding to Pl and vo corresponding to Pl are set, the position data is stored in the RAM 37.

-Then, the CPU 35 sets the counter value t to "1" in S65.
At the same time, the counter value t and the reference side number T are compared in 366, and if it is determined that t≧T is not found, the process returns to 364 and the routine of S64 to S66 is repeated, and the position of another reference side (U+, Vl) is calculated. The data is stored in the RAM 37. Then, if it is determined in S66 that t≧T, 36
Move to 7.

At 867, the CPU 35 selects the pattern selection switch 32.
When the polishing pattern G6 is set and the number of divisions (5 in this case) is set by the division number setting switch 4o at 868, the process moves to S69. When the start switch 27 is operated in step 369, the CPU 35 sets the counter value t to "0" in step S70, and as shown in FIG.
At step 71, an area having vertices at Tt, Pr to P7 on the processing surface is determined as a polishing area E based on the position data stored in the RAM 37 in the point teaching process of steps 351 to S60. Further, the CPU 35 calculates Uo and V based on the position data of both ends of the reference side stored in the RAM 37 in steps 362-866. and U+
, Vi as both ends, and using these reference sides as a reference, the grindstone 14 is rotated in the XY direction based on the polishing pattern G6.
It is moved on the processing surface 15a to polish the inside of the polishing area E.

” To explain in detail the polishing in the polishing area E of No. 15,
As shown in Figure (a), the CPU 35 has Uo.

■. With one reference side specified by as the base, each position P
Assuming a large number of triangles with vertices 1 to P7, the position ff that forms the apex of the triangle with the highest height among them
Specify p6 and set this position as the target point.
As shown in FIG. 5(b), the CPU 35 specifies the midpoint Qo of the reference side, assumes a line segment from the midpoint Q to the target point P6, and divides it into divisions set by the division number setting switch 4o. Divide this line segment into 5 equal parts and determine each division point according to Equation 5, and determine each line segment that is parallel to the reference side, passes through each division point, and extends from end to end of polishing area E. .

Then, as shown in FIG. 15(b), the CPU 35 sets one end P2 of the reference side as the polishing start point, and starts from the same point P2 with the grinding wheel 14.
is moved to the other end Pi of the reference side, and then the grindstone 14 is moved from the reference side to the second dividing point,
The grindstone 14 is moved from the reference side to the end on the polishing start point side of the first line segment.Next, the CPU 35 moves the grindstone 14 from this end to the other end of the same line segment, and continues to the reference side. to the third division point, and also from the reference side to the end of the second line segment on the polishing start point side. Furthermore, the CPU 35 moves the grindstone 14 from this end to the other end of the line segment, repeats the above steps at each division point so as to approach the target point P6, and brings the grindstone 14 to the target point P6, polishing The first polishing in area E is completed.

Next, the CPU 35 adds "1" to the counter value t in step 372, and adds "1" to the counter value t and the reference side number T in step S73.
If it is determined that t≧T is not found, the process moves to step 371, repeats the routines 871 to 373, and performs the second polishing using another reference side (Ul, Vl) as a reference.

In this second polishing, as shown in FIG. 15(C), the CPU 35 specifies the target point P1 in the same manner as described above based on the reference sides specified by U, V, and Assuming a line segment from the intermediate point Q to the target point PL, divide this line segment into 10 equal parts according to the division number 10 set by the division number setting switch 40, determine each division point, and Line segments that are parallel, pass through each division point, and extend from one end of the polishing area E to the other are determined. and,
Based on these, the grindstone 14 is moved following the polishing pattern G6 and the polishing area E is polished again, as in the first polishing described above.

Next, when the CPU 35 determines in S73 that t≧T, it ends the playback process.

As described above, according to the side designated polishing of this embodiment, in addition to the effects of the mold grinder of the first embodiment described above, by appropriately increasing or decreasing the designated number of reference sides, polishing @ area E can be performed. The number of times of polishing, that is, the density of polishing, can be changed depending on the workpiece. Furthermore, since polishing is performed based on different reference sides, polishing is performed with the polishing patterns oriented at angles to each other. Therefore, the moving direction of the grindstone 14 becomes random, and uneven polishing does not occur.

In addition, according to the side specified polishing of this embodiment, the target point P4, p, at which polishing ends is set to each position P4 forming the polishing area E.
1 to P7, the distance from the reference side where polishing is started in the direction perpendicular to the same side is set to be the farthest, so if you follow this polishing procedure, all of the specified polishing area E will be polished in any case. There will be no unpolished areas left.

Furthermore, the pattern G6 and the first pattern shown in FIG.
According to patterns G7 and G8 shown in FIG. 3.14, the movement path of the grindstone 14 is not constant as in pattern G5 shown in FIG. 11, and the grindstone 14 is moved in a triangular or zigzag pattern. Polishing unevenness is less likely to occur.

In addition, according to the edge specified polishing of this embodiment, as shown in FIG. 18(a)
As shown in the figure, the shape of the polishing area E and the reference sides Uo, Vo
Each dividing point may be located at the edge of the area E depending on the setting position. In this case, the grinding wheel 14 is turned back at the end of the polishing area E, and there are densely polished areas and coarsely polished areas in the same area E (in FIG. 18(a), the right side of the polishing type kAE is dense and the left side is There is also a possibility that the area E cannot be uniformly polished.

Therefore, as shown in FIG. 18(b), the reference side Uo,
The intermediate points Wt to W4 of the line segments parallel to V(1 and passing through each division point may be determined, respectively, and the grindstone 14 may be turned back at the intermediate points W1 to W4 instead of the division points. By shifting in this way, the point at which the grindstone 14 turns back is always at the center of the MR area, and the area E can be polished more uniformly.

With this, the CPU 35 ends the side designated polishing. - way, CP
If edge specified polishing is not selected within the predetermined time by the mode selection switch 25 in step 861, U35 determines that angle specified polishing has been selected and proceeds to step 374, as shown in No. 17 (C). , CPU35 is 874
When the polishing number 1 is set by the polishing port number setting switch 42 at step 875, the counter value i is set to "o".

Furthermore, the pattern selection switch 32 described above at 376
Polishing pattern h (G5 in this case) is set by
At 377, the angle θ is set by the pattern angle setting switch 41.
(θ1) is set, and when the displacement amount j (Jl) is set by the shift amount setting device 33 in 878, CP
In step S79, U35 sets a variable T(1) with θ and j as parameters.

Then, the CPU 35 sets the counter value 1 to "1" in S80.
If it is determined in S81 that i≧I is not satisfied, the process moves to S76 and repeats the routine of S76 to S81, and the polishing pattern G7, pattern angle θ2, and displacement j2 are set.

When the CPU 35 determines at 381 that 1≧I, the CPU 35 returns 38
At step 2, wait for the operation of the start switch 27, and when this operation is performed, the point count value l is set to "0" again at step 383.
At the same time, initial polishing is performed in S84.

That is, as shown in FIG. 16(a), the CPU 35
While maintaining the angle G1 with respect to the reference line segment A mentioned above, the grinding wheel 1 is moved with a displacement of Jl based on the polishing pattern G5.
4 to polish the inside of the polishing area E.

Then, the CPU 35 sets the counter value i to "1" in S85.
, and if it is determined in S86 that i≧1, the process returns to S84 and repeats the routine from 384 to 886, and at 384, as shown in FIG. While maintaining the angle of G2, a second polishing is performed with a displacement of J2 based on the polishing pattern of G7.

Next, when the CPU 35 determines that i≧I in S86, it ends the playback polishing of the angle specified polishing.

In this way, according to the specified angle polishing of this embodiment, the angle of the polishing pattern with respect to the polishing area E can be arbitrarily set, so that polishing can be performed to prevent polishing unevenness, similar to the side specified polishing described above. can be carried out.

The dimension between the division points determined by the aforementioned division number setting switch 40 and the shift amount by the shift amount setting device 33 are set so that no unpolished areas remain between the culm movement paths of the grindstone 14. As long as they overlap, it can be set in any way.

In addition, the mold polishing machine of this embodiment determines the polishing density by determining the number of divisions in side specified polishing, and determines the polishing density by determining the shift amount in angle specified polishing. The two may be reversed, and the polishing density may be determined by the shift amount in the side specified polishing, and the polishing density may be determined by the number of divisions in the angle specified polishing.

On the other hand, when performing the triangular pattern G5 in edge-specified polishing, the shift amount jl,
j2 may be determined and the grinding wheel 14 may be moved so that adjacent triangles overlap with each other.

Furthermore, in the side reference polishing of this embodiment, the base is a line segment completely parallel to the reference side, and the midpoints QO, QL of the reference side are
The grindstone 14 was moved so as to draw a number of triangles whose vertices were placed on the line segment connecting 03 points Pa and P+, but the bases of the triangles do not necessarily have to be parallel to the reference side,
The vertices of a triangle do not necessarily have to be arranged in a straight line.
Therefore, the base of each triangle may be made slightly oblique with respect to the reference side, and the vertices of each triangle may be arranged in a curved line. Even in this case, the above-mentioned effects can be sufficiently obtained. .

Also, in the side reference polishing of this embodiment, the target point P6. P
+, the grindstone 14 was moved according to the polishing patterns 05 to G8, but the target point Pb was moved along a completely opposite path.
, P+ to the reference side, and in this case as well, the various effects described above can be obtained.

On the other hand, the machined surface 15a to be polished by the mold grinding machines of the first and second embodiments may not be flat but may have curvature, etc. Even in this case, the grinding surface 15a is polished by the action of the air cylinder 12 described above. 14 is always pressed against the processing surface 15a, so the same surface can be polished without any support.

By the way, the point teaching process of the mold milling machine of the above-mentioned first and second embodiments was invented on the premise that the polishing area E having a certain area is to be polished. This concept of point teaching can also be applied when polishing the polishing area E.

The polishing procedure will be outlined below.

For example, as shown in FIG. 19, a mold for press-molding an automobile bumper has a groove 51 corresponding to the shape of the bumper. must be moved along the groove 51. Normally, the polishing path is designated by the line teaching described in the first embodiment, and the grindstone 14 moves based on this to perform polishing.However, in order to designate the polishing path, the operating lever of the teaching device 18 is used. 19 to actually move the grindstone 14 within the groove 51, which was very troublesome.

Therefore, as shown in FIG. 19, as the polishing area E was specified by point teaching in the first and second embodiments, points P1~
Pt is designated and input to the CPU 35. When performing polishing, the polishing path may be determined by connecting the points P1 to P7 with straight lines in the order of input, and the grinding wheel 14 may be moved following this path. Since it is only necessary to specify the points, it is possible to specify the polishing path extremely easily.

[Effects of the Invention] As described in detail above, according to the present invention, it is only necessary to teach the end point of the movement of the grindstone, and there is no need to move the grindstone over the entire movement path, making the teaching process easy and short. This has the excellent effect of improving work efficiency and ensuring linearity when linearity of the teaching path is required.

[Brief explanation of the drawing]

・Figures 1 to 7 show a first embodiment embodying this invention, Figure 1 is a front view showing a mold scraper, and Figure 2 schematically shows a control circuit of the mold scraper. The block diagram, Figures 3 to 6 are diagrams showing the polishing pattern, Figures 7 (a) and (b) are flow charts showing the operation of the mold grinder, and Figures 8 (a) to (
c) is a diagram for explaining the playback process after point teaching, FIG. 9 is a diagram for explaining the playback process after line teaching, FIGS. 10 to 17 show the second embodiment, and FIG. The figure is a block diagram schematically showing the control circuit of the mold milling machine, Figures 11 to 14 are diagrams showing the polishing pattern, and Figures 15 (a) to (c) are diagrams for explaining the process of side specified polishing. Figures 16(a) and 16(b) are diagrams for explaining the angle specified polishing process, and Figures 17(a) to (C)
) is a flowchart showing the operation of the mold milling machine, No. 18
Figure 18 (a) is a diagram showing the case where the grindstone is turned back at the edge of the polishing area in edge specified polishing, and Figure 18 (b) is a diagram showing the case where the grindstone is turned back at the center of the polishing area in edge specified polishing. FIG. 19 is a front view showing the case where a long and narrow polishing area is polished. In the figure, 14 is a grindstone, 15 is a mold as a workpiece, and 15a
26 is a plane selection switch as a plane setting means; 31 is a position specification switch as a position specification means; 3
2 is a pattern selection switch as a pattern setting means;
35 is a CPU as a polishing area determining means, a polishing control means, a target point determining means, and a grindstone moving means; 37 is a RAM as a storage means; 38 is a both end point setting switch as a reference side setting means; 41 is a pattern angle setting Pattern angle setting switch as a means, E is a polishing area, 01 to G8 are polishing patterns, Pt to p, , P1 to P7° P1 to P4 are positions f
f (moving end point). Fig. 5 Fig. 6m (';1 Fig. 8 (C) Fig. 9 j”I P21i13 II
Figure 14 11151! f (b) 2QOP3 (Llo) (Vo) Figure 15 (C) Figure 16 (a) P! . Figure 17 (b) 181!1 (b) @18II (a) P2 QOP3 (LIO) (VO)

Claims (1)

[Claims] 1. A grindstone (14) for polishing a processed surface (15a) of a workpiece (15); and a plane setting means (26) for setting a plane on which the grindstone (14) is moved. , a plurality of positions (P_1 to P_3, P_1) of the grindstone (14) on the plane set by the plane setting means (26);
~P_7, P_1~P_4), and a position specifying means (31) for specifying the position of the grindstone (1) based on the operation of the position specifying means (31).
a storage means (37) for storing the position data of 4); and a processing surface (15) corresponding to each position data based on the two or more position data stored in the storage means (37).
a) a polishing area determining means (35) for determining the area formed by each point on the polishing area (E); and a polishing pattern () in the polishing area (E) determined by the polishing area determining means (35). a pattern setting means (32) for setting the polishing pattern (G1 to G8), and a polishing area determining means (
35) in the polishing area (E) determined by
14) to the machined surface (15a) of the workpiece (15).
A polishing device comprising a polishing control means (35) for polishing. 2. A grindstone (14) for polishing the processed surface (15a) of the workpiece (15), a plane setting means (26) for setting a plane on which the grindstone (14) is moved, and the plane setting means ( position specifying means (31) for specifying a plurality of positions (P_1 to P_7) of the grindstone (14) on the plane set by ); and a storage means (37) for storing position data of the two or more pieces of position data stored in the storage means (37), and processing surfaces (15) corresponding to each position data based on the two or more position data stored in the storage means (37).
a) a polishing area determining means (35) for determining the area formed by each point on the polishing area (E); and a polishing pattern () in the polishing area (E) determined by the polishing area determining means (35). pattern setting means (32) for setting the positions (G5 to G8), and a plurality of positions (P
A pair of adjacent positions (P_2, P_7)
_3 or P_4, P_5); and a reference side setting means (38) for setting a reference side connecting P_3 or P_4, P_5), and a plurality of positions (P
_1 to P_7), each position (P_1 to P_7) is set with the reference side set by the reference side setting means (38) as the base.
) is the highest position of the triangle with its apex (P_
6, P_1) as the target point (35
), and the reference side set by the reference side setting means (38) and the target point (P_) determined by the target point determining means (35).
6, P_1), the grindstone (14) is moved based on the polishing pattern (G6) set by the pattern setting means (32) so as to gradually approach the polishing area (P_1) from one side to the other. E) Grindstone moving means for polishing the inside (
35) A polishing device comprising: 3. The grindstone moving means (35) moves the grindstone (14) along the reference side to the target points (P_6, P_6, P_5) within the polishing area (E) from one end of the reference side (P_3, P_5).
_1), and further move the target points (P_6, P_6, P_6, P_6,
_1), and the reference side and the target point (P_6, P
3. The polishing apparatus according to claim 2, wherein the grindstone (14) is moved to a boundary opposite to the target point (P_6, P_1) by repeating this process to gradually bring the grindstone (14) closer to the target point (P_6, P_1). 4. The reference side setting means (38) sets a plurality of reference sides, the target point determining means (35) determines a plurality of target points (P_6, P_1) corresponding to each reference side, and the grindstone moving means (
35) The polishing apparatus according to claim 2, wherein polishing is performed sequentially using each reference side as a reference. 5. A grindstone (14) for polishing the processed surface (15a) of the workpiece (15), a plane setting means (26) for setting a plane on which the grindstone (14) is moved, and the plane setting means ( position specifying means (31) for specifying a plurality of positions (P_1 to P_4) of the grindstone (14) on the plane set by ); and a storage means (37) for storing position data of the two or more pieces of position data stored in the storage means (37), and processing surfaces (15) corresponding to each position data based on the two or more position data stored in the storage means (37).
a) a polishing area determining means (35) for determining the area formed by each point on the polishing area (E); and a polishing pattern () in the polishing area (E) determined by the polishing area determining means (35). a pattern setting means (32) for setting the polishing pattern (G5 to G8); and a polishing pattern (32) for setting the polishing pattern (G5 to G8);
pattern angle setting means (41) for setting a plurality of angles with respect to the polishing area (E) of the polishing pattern (G5, G7); A polishing apparatus comprising a polishing control means (35) for moving a grindstone (14) within a polishing area (E) based on the polishing area (E) and polishing the inside of the polishing area (E).