JPH01225191A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JPH01225191A JPH01225191A JP4972988A JP4972988A JPH01225191A JP H01225191 A JPH01225191 A JP H01225191A JP 4972988 A JP4972988 A JP 4972988A JP 4972988 A JP4972988 A JP 4972988A JP H01225191 A JPH01225191 A JP H01225191A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- flexible printed
- circuit board
- shaped
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000717 retained effect Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000001151 other effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明はフレキシブルプリント基板に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) This invention relates to a flexible printed circuit board.
（従来の技術）
表面実装タイプの電気部品であっても、電気接点より下
（底部）側にふくらみ部分のあるもの（以下、単に部品
という、、）をフレキシブルプリント基板に実装する場
合には、そのふくらみ部分を逃がす必要がある。このた
め、このような部品を実装するフレキシブルプリント基
板には、部品実装用ランド部に、上記ふくらみ部分を逃
がすための実装穴があけられている。(Prior art) When mounting a surface-mount type electrical component (hereinafter simply referred to as a component) on a flexible printed circuit board, it must have a bulge below the electrical contact (bottom) side. You need to release that bulge. For this reason, in a flexible printed circuit board on which such a component is mounted, a mounting hole is formed in the component mounting land portion to allow the bulge to escape.
第１０図はそのような実装穴を有するフレキシブルプリ
ント基板である。図において、１はフレキシブルプリン
ト基板、２ａは導体パターン、２ｂはスルーホール、３
はカバーレイ穴、４は放熱用ランド部、５は部品実装用
ランド部に設けた実装穴である。この穴５は、部品（後
述するＩＣ６）のふくらみ部分の形状に合わせてあけた
異形穴である。FIG. 10 shows a flexible printed circuit board having such mounting holes. In the figure, 1 is a flexible printed circuit board, 2a is a conductive pattern, 2b is a through hole, and 3
4 is a cover lay hole, 4 is a heat dissipation land portion, and 5 is a mounting hole provided in a component mounting land portion. This hole 5 is an irregularly shaped hole drilled to match the shape of a bulging portion of a component (an IC 6 to be described later).
第１１図は、上記フレキシブルプリント基板１の部品実
装用ランド部に、部品であるＩＣ６をハンダ７で実装し
た状態を示したものである。FIG. 11 shows a state in which an IC 6 as a component is mounted on the component mounting land portion of the flexible printed circuit board 1 with solder 7. As shown in FIG.
ところが、上述した従来のフレキシブルプリント基板に
は、次のような問題点があった。However, the above-described conventional flexible printed circuit board has the following problems.
（１）実装しようとする部品の個有の形状に合わせて特
殊な形状の異形穴をあけるので、その加工が面倒で手間
がかかり、これがコストアップの要因となっている。(1) Since a specially shaped hole is drilled to match the unique shape of the component to be mounted, the machining is troublesome and time consuming, which is a factor in increasing costs.
（２）大きな異形穴をあけるので、それだけパターンを
設けるランド部が圧迫されて相対的に小さくなる。小さ
くなった分だけ上記ランド部を大きくすると、プリント
基板をそれだけ大きくしなければならない。これが高密
度実装の障害となっている。(2) Since a large irregularly shaped hole is made, the land portion on which the pattern is provided is compressed and becomes relatively small. If the land portion is made larger by the reduced size, the printed circuit board must be made that much larger. This is an obstacle to high-density packaging.
この発明は、このような従来の問題点を解決するために
なされたもので、安価で高密度実装が可能なフレキシブ
ルプリント基板を提供することを目的とする。The present invention was made to solve these conventional problems, and it is an object of the present invention to provide a flexible printed circuit board that is inexpensive and capable of high-density mounting.
この発明では、上記目的を達成するために。 This invention aims to achieve the above object.
（１）部品実装用ランド部に折り曲げ可能な舌状ランド
部を残すスリット状の穴をあけ、これを部品の実装穴と
するとともに、前記舌状ランド部にパターンを設けるよ
うにした。(1) A slit-shaped hole is formed in the component mounting land portion to leave a bendable tongue-shaped land portion, and this is used as a component mounting hole, and a pattern is provided on the tongue-shaped land portion.
（２）上記スリット状の穴として、Ｈ形、Ｕ形およびＸ
形のものを代表例として採用した。(2) The above slit-like holes are H-shaped, U-shaped and X-shaped.
The one with the shape was adopted as a representative example.
（３）上記パターンには、必要に応じスルーホールを設
けるようにした。(3) Through holes were provided in the above pattern as necessary.
（１）上記スリット状の穴は、Ｈ形、Ｕ形などのように
、幅狭い穴で定形的に形成された穴であるので、従来の
異形穴に比べて形状が単純になり、それだけ加工が簡単
かつ容易になる。(1) The slit-shaped hole mentioned above is a narrow hole formed in a regular shape such as an H-shape or a U-shape, so the shape is simpler than a conventional irregular-shaped hole, and it can be machined accordingly. becomes simple and easy.
（２）舌状ランド部を利用して、この部分にパターン（
必要に応じスルーホール）を設けるので、プリント基板
を大きくしてそのためのランド部を設ける必要がない。(2) Using the tongue-like land part, pattern (
Since through-holes are provided as necessary, there is no need to enlarge the printed circuit board and provide land portions for this purpose.
このため、部品の実装密度を従来より高くすることがで
きる。Therefore, the mounting density of components can be made higher than in the past.
（実施例）
（実施例１）
第１図はこの発明の第１実施例を示す。図において、１
，２ａ、２ｂ、３は第１０図におけると同一の部分を示
す。１１は部品の実装穴で、フレキシブルプリント基板
１における部品実装ランド部に幅狭くＨ形に切り抜いて
形成したスリット状の穴である。１２．１３は、このＨ
形の実装穴１１を形成したとき、上記部品実装ランド部
に、後述するように、折り曲げ可能に残った一対の舌状
ランド部である。２Ｃはこの舌状ランド部１２．１３に
設けた導体パターン、２ｄは同じくスルーホールである
。なお、舌状ランド部には導体パターンのみを設ける場
合もある。(Example) (Example 1) FIG. 1 shows a first example of the present invention. In the figure, 1
, 2a, 2b, and 3 indicate the same parts as in FIG. Reference numeral 11 denotes a component mounting hole, which is a slit-like hole formed by cutting out a narrow H-shape in the component mounting land portion of the flexible printed circuit board 1. 12.13 is this H
When the shaped mounting hole 11 is formed, a pair of tongue-shaped land portions remain on the component mounting land portion so as to be bendable, as will be described later. 2C is a conductor pattern provided on this tongue-shaped land portion 12.13, and 2d is a through hole. Note that there are cases where only a conductor pattern is provided on the tongue-shaped land portion.
このような構成となっているので、フレキシブルプリン
ト基板１の実装穴１１に部品である第３図のＩＣ１４を
嵌めて同基板１にハンダ７で取り付けると、第２図に示
すように実装できる。With this configuration, when the IC 14 shown in FIG. 3, which is a component, is fitted into the mounting hole 11 of the flexible printed board 1 and attached to the board 1 with solder 7, it can be mounted as shown in FIG. 2.
その場合、舌状ランド部１２．１３は、例えば、第４図
に示す態様で折り曲げることができる。すなわち、同図
（ａ）に示すように、両舌状ランド部１２．１３をＩＣ
１４の底面（ふくらみ部分）に沿わせて折り曲げること
ができる。また、同図（ｂ）に示すように、両舌状ラン
ド部１２．１３を９０度程度折り山げて突出させること
もできる。さらに、同図（ｅ）のように、両舌状ランド
部１２．１３を１８０度折り曲げてプリント基板１に沿
わせることもできる。In that case, the tongue land 12.13 can be bent, for example, in the manner shown in FIG. That is, as shown in FIG.
It can be bent along the bottom (bulging part) of 14. Further, as shown in FIG. 2(b), the tongue-shaped land portions 12 and 13 can be bent by about 90 degrees to protrude. Furthermore, as shown in FIG. 2(e), the tongue-like land portions 12 and 13 can be bent 180 degrees to fit along the printed circuit board 1.
次に作用を説明する。Next, the effect will be explained.
（１）上記実装穴１１は、幅狭い穴でＨ形に形成された
穴であるので、従来の異形穴に比べて形状が単純になる
。このため、加工が簡単かつ容易になり、製造コストを
低減できる。(1) Since the mounting hole 11 is a narrow H-shaped hole, its shape is simpler than a conventional irregularly shaped hole. Therefore, processing becomes simple and easy, and manufacturing costs can be reduced.
（２）舌状ランド部１２．１３を利用して、この部分に
も導体パターン２Ｃとスルーホール２ｄを設けることが
できるので、プリント基板１を大きくしてそのためのラ
ンド部を設ける必要がない。(2) Since the conductor pattern 2C and the through hole 2d can be provided in this portion by using the tongue-shaped land portions 12, 13, there is no need to enlarge the printed circuit board 1 and provide a land portion therefor.
このため、従来より部品の実装密度も高くすることがで
きる。Therefore, the mounting density of components can be increased compared to the conventional technology.
（実施例２）
第５図は第２実施例で、Ｕ形の実装穴１５を形成して部
品実装ランド部に舌状ランド部１６を残し、この舌状ラ
ンド部１６にも導体パターン２ｃとスルーホール２ｄを
設けた例である。(Embodiment 2) FIG. 5 shows a second embodiment, in which a U-shaped mounting hole 15 is formed and a tongue-shaped land portion 16 is left in the component mounting land portion, and a conductor pattern 2c is also formed on this tongue-shaped land portion 16. This is an example in which a through hole 2d is provided.
この実施例のプリント基板１は、部品の実装高さに制限
がある場合に、第６図に示すように、部品１７を裏がえ
して実装するときに使用できる。The printed circuit board 1 of this embodiment can be used when the component 17 is mounted upside down as shown in FIG. 6 when there is a limit on the mounting height of the component.
これは表側のふくらみ部分を実装穴１５に嵌め込むこと
ができるためである。また、実装穴１５がＵ形になって
いるので、上記部品１７のように端子が片側たけにある
ものに適している。その他の作用効果は第１実施例と同
じである。This is because the bulge on the front side can be fitted into the mounting hole 15. Further, since the mounting hole 15 is U-shaped, it is suitable for a component such as the above-mentioned component 17 in which the terminal is located only on one side. Other effects are the same as in the first embodiment.
（実施例３）
第７図は第３実施例を示す。これは、第２実施例と同様
、Ｕ形の実装穴２０をあけ、舌状ランド部２１にも導体
パターン２Ｃとスルーホール２ｄを設けた例である。こ
れは、パターンの引き廻わしの負荷により、両側に端子
がある場合でも、上記Ｕ形の実装穴２０をあける場合も
あることを示したものである。作用効果は第１実施例と
同じである。(Embodiment 3) FIG. 7 shows a third embodiment. This is an example in which a U-shaped mounting hole 20 is drilled and a conductor pattern 2C and a through hole 2d are also provided in the tongue-shaped land portion 21, as in the second embodiment. This indicates that the U-shaped mounting hole 20 may be made even if there are terminals on both sides due to the load of pattern routing. The operation and effect are the same as in the first embodiment.
（実施例４）
第８図は第４実施例を示す。この実施例はＸ形の実装穴
２２をあけ、そのときにできる舌状ランド部２１，２２
，２３．２４に導体パターン２ｃとスルーホール２ｄを
設けた例である。この実施例のプリント基板１の場合は
、実装穴１８がＸ形になっているので、周囲のパターン
２ａがら各舌状ランド部２１〜２４にパターン２ｃを引
き出せる利点がある。その他の作用効果は第１実施例と
同じである。(Embodiment 4) FIG. 8 shows a fourth embodiment. In this embodiment, an X-shaped mounting hole 22 is drilled, and tongue-shaped lands 21 and 22 are formed at that time.
, 23 and 24 are provided with conductor patterns 2c and through holes 2d. In the case of the printed circuit board 1 of this embodiment, since the mounting hole 18 is X-shaped, there is an advantage that the pattern 2c can be pulled out from the surrounding pattern 2a onto each of the tongue-shaped lands 21 to 24. Other effects are the same as in the first embodiment.
（実施例５）
第９図は第５実施例を示す。これは第１実施例のプリン
ト基板１との比較で言えば、同基板１の舌状ランド部１
２．１３以外の部分に、裏打ち材２５をつけた例である
。このようにすれば部品を取り付は易くなる。その他の
作用効果は第１実ｈｈ例と同じである。(Example 5) FIG. 9 shows a fifth example. In comparison with the printed circuit board 1 of the first embodiment, the tongue-shaped land portion 1 of the same circuit board 1 is
This is an example in which a backing material 25 is attached to a portion other than 2.13. This makes it easier to attach the parts. Other effects are the same as in the first example hh.
（発明の効果ン
以上説明したように、この発明によれば、部品実装用ラ
ンド部にスリット状の穴を設け、これを部品の実装穴と
し、同ランド部に残された舌状ランド部にパターン（要
すればスルーホール）を設けたので、安価で高密度実装
が可能なフレキシブルプリント基板を得ることができる
。(Effects of the Invention) As explained above, according to the present invention, a slit-like hole is provided in the component mounting land portion, this is used as the component mounting hole, and the tongue-shaped land portion left on the land portion is provided with a slit-like hole. Since a pattern (through hole if necessary) is provided, a flexible printed circuit board that can be mounted at low cost and with high density can be obtained.
第１図はこの発明の第１実施例によるフレキシブルプリ
ント基板の斜視図、第２図は第１図のフレキシブルプリ
ント基板への部品の実装状態を示す斜視図、第３図は第
２図における部品の斜視図、第４図（ａ）〜（Ｃ）は第
１図のフレキシブルプリント基板に対する部品の実装態
様を示す側面図、第５図は第２実施例によるフレキシブ
ルプリント基板の斜視図、第６図は第５図のフレキシブ
ルプリント基板への部品の実装状態を示す斜視図、第７
図は第３実施例の斜視図、第８図は第４実施例の斜視図
、第９図は第５実施例の斜視図、第１０図は従来のフレ
キシブルプリント基板の斜視図、第１１図は第９図のフ
レキシブルプリント基板への部品の実装状態を示す斜視
図である。
１−−−−−−フレキシブルプリント基板２ ａ 、
２ ｃ −・・・・・導体パターン２ ｂ 、 ２
ｄ −−−−−−スルーホール１１・・・・・・実装
穴1 is a perspective view of a flexible printed circuit board according to a first embodiment of the present invention, FIG. 2 is a perspective view showing a state in which components are mounted on the flexible printed circuit board of FIG. 1, and FIG. 3 is a perspective view of the components shown in FIG. 2. 4(a) to 4(C) are side views showing how components are mounted on the flexible printed circuit board of FIG. 1, FIG. 5 is a perspective view of the flexible printed circuit board according to the second embodiment, and FIG. The figure is a perspective view showing the mounting state of components on the flexible printed circuit board in figure 5, and figure 7.
The figure is a perspective view of the third embodiment, FIG. 8 is a perspective view of the fourth embodiment, FIG. 9 is a perspective view of the fifth embodiment, FIG. 10 is a perspective view of a conventional flexible printed circuit board, and FIG. 9 is a perspective view showing a state in which components are mounted on the flexible printed circuit board of FIG. 9. FIG. 1-------Flexible printed circuit board 2a,
2 c --- Conductor pattern 2 b, 2
d -------Through hole 11...Mounting hole
Claims (3)
るフレキシブルプリント基板であって、前記実装穴は、
前記ランド部に折り曲げ可能な舌状ランド部を残すスリ
ット状の穴で形成し、かつ前記舌状ランド部に、パター
ンを設けたことを特徴とするフレキシブルプリント基板
。(1) A flexible printed circuit board having a mounting hole for the component in a land portion on which the component is mounted, the mounting hole comprising:
A flexible printed circuit board, characterized in that the land portion is formed with a slit-like hole leaving a bendable tongue-like land portion, and the tongue-like land portion is provided with a pattern.
ある請求項１に記載のフレキシブルプリント基板。(2) The flexible printed circuit board according to claim 1, wherein the slit-like hole is H-shaped, U-shaped, or X-shaped.
２に記載のフレキシブルプリント基板。(3) The flexible printed circuit board according to claim 1 or 2, wherein a through hole is provided in the pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4972988A JPH01225191A (en) | 1988-03-04 | 1988-03-04 | Flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4972988A JPH01225191A (en) | 1988-03-04 | 1988-03-04 | Flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01225191A true JPH01225191A (en) | 1989-09-08 |
Family
ID=12839276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4972988A Pending JPH01225191A (en) | 1988-03-04 | 1988-03-04 | Flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01225191A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5541788A (en) * | 1992-07-20 | 1996-07-30 | Fujitsu Limited | Magnetic disk drive and flexible printed circuit board |
-
1988
- 1988-03-04 JP JP4972988A patent/JPH01225191A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5541788A (en) * | 1992-07-20 | 1996-07-30 | Fujitsu Limited | Magnetic disk drive and flexible printed circuit board |
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