JPH01221682A - Inspection device for semiconductor element - Google Patents

Inspection device for semiconductor element

Info

Publication number
JPH01221682A
JPH01221682A JP4731388A JP4731388A JPH01221682A JP H01221682 A JPH01221682 A JP H01221682A JP 4731388 A JP4731388 A JP 4731388A JP 4731388 A JP4731388 A JP 4731388A JP H01221682 A JPH01221682 A JP H01221682A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
semiconductor element
element
part
cylinder
position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4731388A
Inventor
Toshihiro Fujishita
Original Assignee
Nec Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To reduce the occurring case of a defective measurement by driving an up-and-down mechanical device for a semiconductor element which the semiconductor element mounting part is made to move up and down, at the position other than a measurement part, and easily performing a positioning of the semiconductor element.
CONSTITUTION: The semiconductor element 12 being an object to be inspected is mounted on the semiconductor element mounting part 5. A cylinder 10 is begun to lower and an engaging piece installed on the cylinder 10 is engaged to an engaging part 8. When the cylinder 10 is lowered further, an up-and-down member 7 for the semiconductor element is begun to lower against an energizing force of a spring 9, and along with the member 7 going down, electric poles of the element 12 are made to lower together with the mounting part 5 to the position to contact with contacts 4. At this time, the space between the surface of the element 12 and the bottom part of the cylinder 10 is kept in the distance of W1-(W2+W3) until the poles of the element 12 are lowered to the position to contact with the contacts 14. During this action, a position divergence for the element 12 like as before and behind, right and left is corrected by means of being guided with a tapered surface 2a of a recessed part 2, and the occurrence of the defective measurement is thereby reduced.
COPYRIGHT: (C)1989,JPO&Japio
JP4731388A 1988-02-29 1988-02-29 Inspection device for semiconductor element Granted JPH01221682A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4731388A JPH01221682A (en) 1988-02-29 1988-02-29 Inspection device for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4731388A JPH01221682A (en) 1988-02-29 1988-02-29 Inspection device for semiconductor element

Publications (1)

Publication Number Publication Date
JPH01221682A true true JPH01221682A (en) 1989-09-05

Family

ID=12771803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4731388A Granted JPH01221682A (en) 1988-02-29 1988-02-29 Inspection device for semiconductor element

Country Status (1)

Country Link
JP (1) JPH01221682A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6078185A (en) * 1996-07-29 2000-06-20 Ando Electric Co., Ltd Apparatus for controlling insertion of an integrated circuit into a socket for testing and measurement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6078185A (en) * 1996-07-29 2000-06-20 Ando Electric Co., Ltd Apparatus for controlling insertion of an integrated circuit into a socket for testing and measurement

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