JPH01220454A - Frame aligning apparatus - Google Patents

Frame aligning apparatus

Info

Publication number
JPH01220454A
JPH01220454A JP4543688A JP4543688A JPH01220454A JP H01220454 A JPH01220454 A JP H01220454A JP 4543688 A JP4543688 A JP 4543688A JP 4543688 A JP4543688 A JP 4543688A JP H01220454 A JPH01220454 A JP H01220454A
Authority
JP
Japan
Prior art keywords
frame
engaging
frames
positioning members
attitude
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4543688A
Other languages
Japanese (ja)
Inventor
Akira Ishihara
Matsuro Kanehara
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP4543688A priority Critical patent/JPH01220454A/en
Publication of JPH01220454A publication Critical patent/JPH01220454A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make adaptable for frame sizes efficiently and to improve productivity, by automatically controlling a plurality of frame positioning members in an engaging and non-engaging attitude based on the sizes of the mounting frames.
CONSTITUTION: Mounting frames are mounted on a frame aligning table 6. Positioning members 7a and 7b which are engaged with notches 41a and 41b of the frames are provided on the table 6. A frame pushing mechanism 18 comprising an air cylinder 12, a pushing members 14 and the like which push the frames on the table 6 is provided at the opposite side. When the frame size is set by a control means, the engaging attitudes of the positioning members are automatically controlled as follows: e.g., the member 7a is in the engaging attitude; and, e.g., the inner member 7b is in the non-engaging attitude with an air cylinder 9. The frames are moved to the table 6 with the mechanism 18, and the member 7a is engaged with the notch 41a. In this way, the positioning members are automatically changed so as to deal with the frame sizes efficiently, and the productivity is improved.
COPYRIGHT: (C)1989,JPO&Japio
JP4543688A 1988-02-27 1988-02-27 Frame aligning apparatus Pending JPH01220454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4543688A JPH01220454A (en) 1988-02-27 1988-02-27 Frame aligning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4543688A JPH01220454A (en) 1988-02-27 1988-02-27 Frame aligning apparatus

Publications (1)

Publication Number Publication Date
JPH01220454A true JPH01220454A (en) 1989-09-04

Family

ID=12719262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4543688A Pending JPH01220454A (en) 1988-02-27 1988-02-27 Frame aligning apparatus

Country Status (1)

Country Link
JP (1) JPH01220454A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122624A (en) * 1993-10-28 1995-05-12 Nec Corp Prealignment equipment for wafer
EP0884766A2 (en) * 1997-06-12 1998-12-16 Lintec Corporation Method of die bonding electronic component and die bonding apparatus therefor
KR100902098B1 (en) * 2007-08-24 2009-06-09 앰코 테크놀로지 코리아 주식회사 Wafer alignment device for wafer mount
JP2010021464A (en) * 2008-07-14 2010-01-28 Disco Abrasive Syst Ltd Chuck table of working device
JP2010238710A (en) * 2009-03-30 2010-10-21 Lintec Corp Positioning device and positioning method
JP2012094814A (en) * 2010-09-28 2012-05-17 Tokyo Electron Ltd Substrate position detection device, film formation device having the same, and substrate position detection method
JP2014216391A (en) * 2013-04-23 2014-11-17 株式会社荏原製作所 Substrate processing apparatus and method of manufacturing processing substrate
JP2015070179A (en) * 2013-09-30 2015-04-13 株式会社ディスコ Chuck table
JPWO2014068763A1 (en) * 2012-11-02 2016-09-08 富士機械製造株式会社 Expanding ring inner diameter measuring system and push-up motion interference avoidance system of die feeding device
JP2017069370A (en) * 2015-09-30 2017-04-06 株式会社ディスコ Transfer mechanism

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122624A (en) * 1993-10-28 1995-05-12 Nec Corp Prealignment equipment for wafer
EP0884766A2 (en) * 1997-06-12 1998-12-16 Lintec Corporation Method of die bonding electronic component and die bonding apparatus therefor
EP0884766A3 (en) * 1997-06-12 2000-09-20 Lintec Corporation Method of die bonding electronic component and die bonding apparatus therefor
KR100902098B1 (en) * 2007-08-24 2009-06-09 앰코 테크놀로지 코리아 주식회사 Wafer alignment device for wafer mount
JP2010021464A (en) * 2008-07-14 2010-01-28 Disco Abrasive Syst Ltd Chuck table of working device
JP2010238710A (en) * 2009-03-30 2010-10-21 Lintec Corp Positioning device and positioning method
JP2012094814A (en) * 2010-09-28 2012-05-17 Tokyo Electron Ltd Substrate position detection device, film formation device having the same, and substrate position detection method
JPWO2014068763A1 (en) * 2012-11-02 2016-09-08 富士機械製造株式会社 Expanding ring inner diameter measuring system and push-up motion interference avoidance system of die feeding device
JP2014216391A (en) * 2013-04-23 2014-11-17 株式会社荏原製作所 Substrate processing apparatus and method of manufacturing processing substrate
JP2015070179A (en) * 2013-09-30 2015-04-13 株式会社ディスコ Chuck table
JP2017069370A (en) * 2015-09-30 2017-04-06 株式会社ディスコ Transfer mechanism

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